Nishida; Yoshiteru
Patent Applications and Registrations
Patent applications and USPTO patent grants for Nishida; Yoshiteru.The latest application filed is for "wafer processing method".
- Nishida; Yoshiteru - Tokyo JP
- Nishida; Yoshiteru - Ota-ku JP
| Patent | Date |
|---|---|
| Processing method of wafer Grant 11,456,213 - Nishida , et al. September 27, 2 | 2022-09-27 |
| Wafer Processing Method App 20220102215 - YOKOO; Susumu ; et al. | 2022-03-31 |
| Method of processing a wafer Grant 10,957,593 - Nishida , et al. March 23, 2 | 2021-03-23 |
| Processing Method Of Wafer App 20210082763 - NISHIDA; Yoshiteru ; et al. | 2021-03-18 |
| Electrostatic chuck Grant 10,896,836 - Chito , et al. January 19, 2 | 2021-01-19 |
| Wafer processing method Grant 10,790,192 - Nishida , et al. September 29, 2 | 2020-09-29 |
| Wafer processing method Grant 10,790,193 - Nishida , et al. September 29, 2 | 2020-09-29 |
| Method Of Processing A Wafer App 20200176313 - NISHIDA; Yoshiteru ; et al. | 2020-06-04 |
| Wafer Processing Method App 20190311951 - NISHIDA; Yoshiteru ; et al. | 2019-10-10 |
| Wafer Processing Method App 20190311952 - NISHIDA; Yoshiteru ; et al. | 2019-10-10 |
| Electrostatic Chuck App 20190019712 - Chito; Kenta ; et al. | 2019-01-17 |
| Method of processing wafer Grant 10,177,004 - Watanabe , et al. J | 2019-01-08 |
| Processing method for workpiece Grant 10,115,636 - Nishida , et al. October 30, 2 | 2018-10-30 |
| Method Of Processing Wafer App 20180269068 - Watanabe; Yoshio ; et al. | 2018-09-20 |
| Wafer processing method Grant 9,330,976 - Yakoo , et al. May 3, 2 | 2016-05-03 |
| Wafer Processing Method App 20160042996 - Yakoo; Susumu ; et al. | 2016-02-11 |
| Processing Method For Workpiece App 20160042962 - Nishida; Yoshiteru ; et al. | 2016-02-11 |
| Processing Method For Wafer Having Embedded Electrodes App 20120252212 - Nishida; Yoshiteru | 2012-10-04 |
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