Nishi; Toyomi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Nishi; Toyomi.The latest application filed is for "method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device".
- Nishi; Toyomi - Tokyo JP
- Nishi; Toyomi - Yokohama JP
- Nishi; Toyomi - Yokohama-shi JP
- Nishi, Toyomi - Kanagawa JP
| Patent | Date |
|---|---|
| Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device Grant 7,708,618 - Yajima , et al. May 4, 2 | 2010-05-04 |
| Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device App 20080166949 - Yajima; Hiromi ; et al. | 2008-07-10 |
| Polishing apparatus Grant 7,198,552 - Nishi , et al. April 3, 2 | 2007-04-03 |
| Polishing apparatus App 20060084369 - Nishi; Toyomi ; et al. | 2006-04-20 |
| Polishing apparatus and a method of polishing and cleaning and drying a wafer Grant 6,997,782 - Nishi , et al. February 14, 2 | 2006-02-14 |
| Method and apparatus for dressing polishing cloth Grant 6,905,400 - Kimura , et al. June 14, 2 | 2005-06-14 |
| Polishing apparatus Grant RE38,215 - Shibata , et al. August 12, 2 | 2003-08-12 |
| Polishing apparatus and a method of polishing and cleaning and drying a wafer App 20030040261 - Nishi, Toyomi ; et al. | 2003-02-27 |
| Method and apparatus for dressing polishing cloth App 20020072300 - Kimura, Norio ; et al. | 2002-06-13 |
| Management of products and parts App 20020007361 - Esaki, Kazuhiro ; et al. | 2002-01-17 |
| Polishing apparatus Grant 6,139,677 - Togawa , et al. October 31, 2 | 2000-10-31 |
| Polishing apparatus Grant 6,074,276 - Shibata , et al. June 13, 2 | 2000-06-13 |
| Polishing apparatus Grant 5,860,847 - Sakurai , et al. January 19, 1 | 1999-01-19 |
| Polishing apparatus Grant 5,839,947 - Kimura , et al. November 24, 1 | 1998-11-24 |
| Polishing apparatus including cloth cartridge connected to turntable Grant 5,704,827 - Nishi , et al. January 6, 1 | 1998-01-06 |
| Polishing aparatus and method Grant 5,679,059 - Nishi , et al. October 21, 1 | 1997-10-21 |
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