Nippon Mining & Metals Co., Ltd.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Nippon Mining & Metals Co., Ltd..The latest application filed is for "copper electrolytic solution and two-layer flexible substrate obtained using the same".

Company Profile

2.117.167

Nippon Mining & Metals Co., Ltd. - Tokyo JP
Nippon Mining & Metals Co., Ltd. - Minato-ku Tokyo JP
Nippon Mining & Metals Co., Ltd. -
Nippon Mining & Metals Co., Ltd - Tokyo JP
Nippon Mining & Metals co., Ltd - Minato-ku, Tokyo JP
Nippon Mining & Metals Co., Ltd. - Minato-ku, Tokyo JP
NIPPON MINING & METALS COMPANY, LIMITED - Tokyo JP
Nippon Mining & Metals Co., Ltd - Minato-Ku Tokyo JP
NIPPON MINING & METALS CO., LTD. - 10-1, Toranomon 2-chome, Minato-ku Tokyo JP
Nippon Mining & Metals Co., Ltd. - JP JP
Nippon Mining & Metals Co. , Ltd. - Ibaraki-ken JP
Nippon Mining & Metals Co., Ltd - Hitachi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks

Patent Activity

Patent	Date
InP single crystal wafer and method for producing InP single crystal Grant 8,815,010 - Noda , et al. August 26, 2	2014-08-26
Substrate and manufacturing method therefor Grant 8,736,057 - Ito , et al. May 27, 2	2014-05-27
Method for recovering metal from ore Grant 8,585,798 - Abe , et al. November 19, 2	2013-11-19
Two-layer flexible substrate Grant 8,568,856 - Tsuchida , et al. October 29, 2	2013-10-29
Heat treatment method of ZnTe single crystal substrate and ZnTe single crystal substrate Grant 8,476,171 - Asahi , et al. July 2, 2	2013-07-02
Copper electrolytic solution containing amine compound having specific skeleton and organosulfur compound as additives, and electrolytic copper foil produced using the same Grant 8,449,751 - Kumagai , et al. May 28, 2	2013-05-28
Electroless copper plating solution Grant 8,404,035 - Yabe , et al. March 26, 2	2013-03-26
Plated article having metal thin film formed by electroless plating Grant 8,394,508 - Yabe , et al. March 12, 2	2013-03-12
ULSI micro-interconnect member having ruthenium electroplating layer on barrier layer Grant 8,390,123 - Sekiguchi , et al. March 5, 2	2013-03-05
Substrate and manufacturing method therefor Grant 8,247,301 - Ito , et al. August 21, 2	2012-08-21
Epitaxial growth process Grant 8,231,728 - Takakusaki , et al. July 31, 2	2012-07-31
Copper Electrolytic Solution And Two-layer Flexible Substrate Obtained Using The Same App 20120189811 - HANAFUSA; Mikio	2012-07-26
Electroless nickel plating liquid Grant 8,182,594 - Hino , et al. May 22, 2	2012-05-22
Method for electroless plating and metal-plated article Grant 8,182,873 - Imori , et al. May 22, 2	2012-05-22
Plated article having metal thin film formed by electroless plating, and manufacturing method thereof Grant 8,163,400 - Yabe , et al. April 24, 2	2012-04-24
Manufacturing method of GaN thin film template substrate, GaN thin film template substrate and GaN thick film single crystal Grant 8,137,460 - Morioka , et al. March 20, 2	2012-03-20
Hybrid Silicon Wafer and Method of Producing the Same App 20120009374 - Takamura; Hiroshi ; et al.	2012-01-12
Hybrid Silicon Wafer and Method of Producing the Same App 20120009373 - Takamura; Hiroshi ; et al.	2012-01-12
Electronic component formed with barrier-seed layer on base material Grant 8,089,154 - Sekiguchi , et al. January 3, 2	2012-01-03
METHOD FOR PRODUCING a-IGZO OXIDE THIN FILM App 20110306165 - Ikisawa; Masakatsu ; et al.	2011-12-15
Resin substrate material, electronic component substrate material manufactured by electroless plating on the same, and method for manufacturing electronic component substrate material Grant 8,043,705 - Kawamura , et al. October 25, 2	2011-10-25
Electronic component formed with barrier-seed layer on base material Grant 8,004,082 - Sekiguchi , et al. August 23, 2	2011-08-23
Method of surface treatment using imidazole compound Grant 7,968,150 - Imori , et al. June 28, 2	2011-06-28
Vapor phase growth method Grant 7,883,998 - Nakamura , et al. February 8, 2	2011-02-08
Semiconductor substrate for epitaxial growth and manufacturing method thereof Grant 7,875,957 - Suzuki , et al. January 25, 2	2011-01-25
Metal plating method and pretreatment agent Grant 7,867,564 - Imori , et al. January 11, 2	2011-01-11
Non-Adhesive Flexible Laminate App 20110003169 - Makino; Nobuhito ; et al.	2011-01-06
Preparation Method Of Lithium Carbonate From Lithium-ion Secondary Battery Recovered Material App 20110002825 - YAMAOKA; Toshiyuki ; et al.	2011-01-06
Sintered Silicon Wafer App 20100330325 - Suzuki; Ryo ; et al.	2010-12-30
Sputtering Target of Nonmagnetic-Particle-Dispersed Ferromagnetic Material App 20100320084 - Sato; Atsushi	2010-12-23
Sputtering Target for Producing Metallic Glass Membrane and Manufacturing Method Thereof App 20100320085 - Nakamura; Atsushi ; et al.	2010-12-23
Non-Adhesive-Type Flexible Laminate and Method for Production Thereof App 20100323215 - Makino; Nobuhito	2010-12-23
Method for Collection of Valuable Metal from ITO Scrap App 20100316544 - Shindo; Yuichiro ; et al.	2010-12-16
Electrolytic Copper Plating Method, Pure Copper Anode for Electrolytic Copper Plating, and Semiconductor Wafer having Low Particle Adhesion Plated with said Method and Anode App 20100307923 - Aiba; Akihiro ; et al.	2010-12-09
Sintered Oxide Compact Target for Sputtering and Process for Producing the same App 20100300878 - Osada; Kozo ; et al.	2010-12-02
Method for Collection of Valuable Metal from ITO Scrap App 20100294082 - Shindo; Yuichiro ; et al.	2010-11-25
Method of Recovering Valuable Metals from IZO Scrap App 20100288645 - Shindo; Yuichiro ; et al.	2010-11-18
Method of Recovering Valuable Metals from IZO Scrap App 20100288646 - Shindo; Yuichiro ; et al.	2010-11-18
Method of Recovering Valuable Metals from IZO Scrap App 20100282615 - Shindo; Yuichiro ; et al.	2010-11-11
High strength titanium copper alloy, manufacturing method therefor, and terminal connector using the same App 20100276037 - Yamamoto; Michiharu ; et al.	2010-11-04
Thin Film Mainly Comprising Titanium Oxide, Sintered Sputtering Target Suitable for Producing Thin Film Mainly Comprising Titanium Oxide, and Method of Producing Thin Film Mainly Comprising Titanium Oxide App 20100276276 - Takami; Hideo ; et al.	2010-11-04
Method of Producing Two-Layered Copper-Clad Laminate, and Two-Layered Copper-Clad Laminate App 20100279069 - Hanafusa; Mikio	2010-11-04
Copper electrolytic solution containing as additive compound having specific skeleton, and electrolytic copper foil manufactured therewith Grant 7,824,534 - Tsuchida , et al. November 2, 2	2010-11-02
High-Purity Lanthanum, Sputtering Target Comprising High-Purity Lanthanum, and Metal Gate Film Mainly Comprising High-Purity Lanthanum App 20100272596 - Takahata; Masahiro ; et al.	2010-10-28
Sn-PLATED MATERIALS FOR ELECTRONIC COMPONENTS App 20100266863 - Tanaka; Koichiro	2010-10-21
High Purity Ytterbium, Sputtering Target Made Thereof, Thin Film Containing the Same, and Method of Producing the Same App 20100260640 - Shindo; Yuichiro ; et al.	2010-10-14
Copper Foil for Printed Circuit Board and Copper Clad Laminate for Printed Circuit Board App 20100261033 - Moriyama; Terumasa ; et al.	2010-10-14
High-Purity Ni-V Alloy, Target therefrom, High-Purity Ni-V Alloy Thin Film and Process for Producing High-Purity Ni-V Alloy App 20100242674 - Shindo; Yuichiro ; et al.	2010-09-30
Sb-Te alloy sintered compact sputtering target Grant 7,803,209 - Takahashi September 28, 2	2010-09-28
Sputtering Target, Thin Film for Optical Information Recording Medium and Process for Producing the Same App 20100240521 - Hosono; Hideo ; et al.	2010-09-23
Cathode material for lithium secondary battery and manufacturing method thereof Grant 7,799,301 - Kajiya , et al. September 21, 2	2010-09-21
Electrolytic copper plating method, pure copper anode for electrolytic copper plating, and semiconductor wafer having low particle adhesion plated with said method and anode Grant 7,799,188 - Aiba , et al. September 21, 2	2010-09-21
Copper electrolytic solution containing as additive compound having specific skeleton, and electrolytic copper foil manufactured therewith App 20100224496 - Tsuchida; Katsuyuki ; et al.	2010-09-09
Packaging device and packaging method for hollow cathode type sputtering target Grant 7,788,882 - Okabe , et al. September 7, 2	2010-09-07
Hydrogen separation membrane, sputtering target for forming said hydrogen separation membrane, and manufacturing method thereof Grant 7,789,948 - Nakamura , et al. September 7, 2	2010-09-07
Metal Covered Polyimide Composite, Process for Producing the Composite, and Process for Producing Electronic Circuit Board App 20100221563 - Kohiki; Michiya ; et al.	2010-09-02
Copper Alloy Sputtering Target, Process for Producing the Same and Semiconductor Element Wiring App 20100219070 - Okabe; Takeo	2010-09-02
Iron Silicide Powder and Method for Production Thereof App 20100221170 - Oda; Kunihiro ; et al.	2010-09-02
Metal Covered Polyimide Composite, Process for Producing the Composite, and Apparatus for Producing the Composite App 20100215982 - Kohiki; Michiya ; et al.	2010-08-26
Method For Supporting Metal Nanoparticles And Metal Nanoparticles-carrying Substrate App 20100215970 - Imori; Toru ; et al.	2010-08-26
Copper Foil for Printed Circuit and Copper-Clad Laminate App 20100212941 - Higuchi; Naoki	2010-08-26
Method of Producing Sintered Compact, Sintered Compact, Sputtering Target Formed from the same, and Sputtering Target-Backing Plate Assembly App 20100206724 - Takahashi; Hideyuki	2010-08-19
Method of operating non-ferrous smelting plant Grant 7,776,133 - Nakagawa , et al. August 17, 2	2010-08-17
Copper electrolytic solution containing quaternary amine compound with specific skeleton and oragno-sulfur compound as additives, and electrolytic copper foil manufactured using the same Grant 7,771,835 - Kumagai , et al. August 10, 2	2010-08-10
Spherical Copper Fine Powder and Process for Producing the Same App 20100192728 - Haga; Takahiro	2010-08-05
Method for Collection of Valuable Metal from ITO Scrap App 20100193372 - Shindo; Yuichiro ; et al.	2010-08-05
AlRu sputtering target and manufacturing method thereof Grant 7,767,139 - Hisano August 3, 2	2010-08-03
Amorphous Film of Composite Oxide, Crystalline Film of Composite Oxide, Method of Producing said Films and Sintered Compact of Composite Oxide App 20100189636 - Ikisawa; Masakatsu ; et al.	2010-07-29
Sintered Silicon Wafer App 20100187661 - Suzuki; Ryo ; et al.	2010-07-29
Method for analyzing minute amounts of Pd, Rh and Ru, and high frequency plasma mass spectroscope used for same Grant 7,755,033 - Kamimura , et al. July 13, 2	2010-07-13
Nickel Crucible for Melting Analytical Sample, Method of Preparing Analytical Sample and Method of Analysis App 20100167407 - Sakaguchi; Masahiro ; et al.	2010-07-01
Ultrahigh-Purity Copper and Process for Producing the Same App 20100163425 - Shindo; Yuichiro ; et al.	2010-07-01
Sputtering Target, Thin Film for Optical Information Recording Medium and Process for Producing the Same App 20100167000 - Hosono; Hideo ; et al.	2010-07-01
Substrate for growing compound semiconductor and epitaxial growth method Grant 7,745,854 - Kurita , et al. June 29, 2	2010-06-29
Tantalum sputtering target and method for preparation thereof Grant 7,740,717 - Oda June 22, 2	2010-06-22
Iron silicide powder and method for production thereof Grant 7,740,796 - Oda , et al. June 22, 2	2010-06-22
Target of high-purity nickel or nickel alloy and its producing method Grant 7,740,718 - Yamakoshi , et al. June 22, 2	2010-06-22
Copper alloy sputtering target process for producing the same and semiconductor element wiring Grant 7,740,721 - Okabe June 22, 2	2010-06-22
Sintered Compact of Composite Oxide, Amorphous Film of Composite Oxide, Process for Producing said Film, Crystalline Film of Composite Oxide and Process for Producing said Film App 20100140570 - Ikisawa; Masakatsu ; et al.	2010-06-10
Apparatus For Removing Ruthenium From Solution Containing Platinum Group Metal App 20100135875 - NAGAI; Hifumi	2010-06-03
Electrolytic Copper Foil for Lithium Rechargeable Battery and Process for Producing the Copper Foil App 20100136434 - Hanafusa; Mikio	2010-06-03
Iron-based sintered compact and method for production thereof Grant 7,727,639 - Yahagi , et al. June 1, 2	2010-06-01
Tantalum sputtering target and method for preparation thereof Grant 7,716,806 - Oda May 18, 2	2010-05-18
Sputtering target, thin film for optical information recording medium and process for producing the same Grant 7,718,095 - Hosono , et al. May 18, 2	2010-05-18
Method Of Recovering Silver Using Anion-exchange Resin App 20100116093 - HIAI; Hiroshi ; et al.	2010-05-13
Manganese alloy sputtering target and method for producing the same Grant 7,713,364 - Nakamura May 11, 2	2010-05-11
Pretreating agent for electroless plating, method of electroless plating using the same and product of electroless plating Grant 7,713,340 - Kawamura , et al. May 11, 2	2010-05-11
High strength copper alloy for electronic parts and electronic parts App 20100101687 - Sugawara; Yasutaka	2010-04-29
Method of Recovering Valuable Metal from Scrap Conductive Oxide App 20100101963 - Shindo; Yuichiro ; et al.	2010-04-29
Method of Recovering Valuable Metal from Scrap Containing Conductive Oxide App 20100101964 - Shindo; Yuichiro ; et al.	2010-04-29
Electroless palladium plating liquid Grant 7,704,307 - Aiba , et al. April 27, 2	2010-04-27
Copper Anode or Phosphorous-Containing Copper Anode, Method of Electroplating Copper on Semiconductor Wafer, and Semiconductor Wafer with Low Particle Adhesion App 20100096271 - Aiba; Akihiro ; et al.	2010-04-22
Ta sputtering target and method for preparation thereof Grant 7,699,948 - Oda April 20, 2	2010-04-20
Zinc oxide-based transparent conductor and sputtering target for forming the transparent conductor Grant 7,699,965 - Ikisawa , et al. April 20, 2	2010-04-20
Barrier Film for Flexible Copper Substrate and Sputtering Target for Forming Barrier Film App 20100089622 - Irumata; Shuichi ; et al.	2010-04-15
Method of co-doping group 14 (4B) elements to produce ZnTe system compound semiconductor single crystal Grant 7,696,073 - Yamamoto , et al. April 13, 2	2010-04-13
High purity copper sulfate and method for production thereof Grant 7,695,527 - Shindo , et al. April 13, 2	2010-04-13
Cu-Ni-Si SYSTEM ALLOY FOR ELECTRONIC MATERIALS App 20100086435 - Era; Naohiko	2010-04-08
Method for Collection of Valuable Metal from ITO Scrap App 20100084281 - Shindo; Yuichiro ; et al.	2010-04-08
Method for Collection of Valuable Metal from ITO Scrap App 20100084279 - Shindo; Yuichiro ; et al.	2010-04-08
Metallic powder for powder metallurgy whose main component is iron and iron-based sintered body Grant 7,691,172 - Imori , et al. April 6, 2	2010-04-06
Gallium oxide-zinc oxide sputtering target, method of forming transparent conductive film, and transparent conductive film Grant 7,686,985 - Osada March 30, 2	2010-03-30
Method of Recovering Valuable Metal from Scrap Containing Conductive Oxide App 20100072075 - Shindo; Yuichiro ; et al.	2010-03-25
Method for leaching gold Grant 7,682,420 - Abe , et al. March 23, 2	2010-03-23
Gallium oxide-zinc oxide sputtering target, method for forming transparent conductive film, and transparent conductive film Grant 7,682,529 - Osada March 23, 2	2010-03-23
Sputtering Target and Manufacturing Method Thereof App 20100058827 - Hukushima; Atsushi	2010-03-11
Gallium oxide/zinc oxide sputtering target, method of forming transparent conductive film and transparent conductive film Grant 7,674,404 - Osada March 9, 2	2010-03-09
Highly pure hafnium material, target and thin film comprising the same and method for producing highly pure hafnium Grant 7,674,441 - Shindo March 9, 2	2010-03-09
Hafnium silicide target for forming gate oxide film, and method for preparation thereof Grant 7,674,446 - Irumata , et al. March 9, 2	2010-03-09
Roll Unit Dipped in Surface Treatment Liquid App 20100051451 - Sato; Haruo	2010-03-04
Vapor phase growth apparatus Grant 7,670,434 - Shimizu , et al. March 2, 2	2010-03-02
Ytterbium Sputtering Target and Method of Producing said Target App 20100044223 - Tsukamoto; Shiro	2010-02-25
Metallic powder for powder metallurgy whose main component is iron and iron-based sintered body Grant 7,666,245 - Imori , et al. February 23, 2	2010-02-23
Two-Layered Copper-Clad Laminate App 20100040873 - Kohiki; Michiya ; et al.	2010-02-18
Process For Recovery Of Copper From Copper-containing Chloride Media App 20100031779 - Abe; Yoshifumi ; et al.	2010-02-11
Sb-Te Alloy Sintered Compact Target and Manufacturing Method Thereof App 20100025236 - Takahashi; Hideyuki	2010-02-04
Roll Unit for use in Surface Treatment of Copper Foil App 20100018273 - Sato; Haruo	2010-01-28
Sintered Silicon Wafer App 20100016144 - Suzuki; Ryo ; et al.	2010-01-21
Cu-Mn Alloy Sputtering Target and Semiconductor Wiring App 20100013096 - Irumata; Shuichi ; et al.	2010-01-21
Copper electroplating method, pure copper anode for copper electroplating, and semiconductor wafer plated thereby with little particle adhesion Grant 7,648,621 - Aiba , et al. January 19, 2	2010-01-19
Determination method and processing method of machined surface of plate-like material, and apparatus for use in said methods Grant 7,650,201 - Nakashima , et al. January 19, 2	2010-01-19
Electrolytic Copper Plating Method, Pure Copper Anode for Electrolytic Copper Plating, and Semiconductor Wafer having Low Particle Adhesion Plated with said Method and Anode App 20100000871 - Aiba; Akihiro ; et al.	2010-01-07
Cu-ni-si system alloy App 20100000637 - Hatano; Takaaki	2010-01-07
Sputtering target, thin film for optical information recording medium and process for producing the same Grant 7,635,440 - Hosono , et al. December 22, 2	2009-12-22
Sb-Te Base Alloy Sinter Sputtering Target App 20090301872 - Yahagi; Masataka ; et al.	2009-12-10
Cu-ni-si-co Copper Alloy For Electronic Materials And Method For Manufacturing Same App 20090301614 - Era; Naohiko ; et al.	2009-12-10
Method for producing ZnTe system compound semiconductor single crystal, ZnTe system compound semiconductor single crystal, and semiconductor device Grant 7,629,625 - Yamamoto , et al. December 8, 2	2009-12-08
Lithium-manganese Composite Oxides For Lithium Ion Battery And Process For Preparing Same App 20090289218 - Kajiya; Yoshio ; et al.	2009-11-26
Target of high-purity nickel or nickel alloy and its producing method Grant 7,618,505 - Yamakoshi , et al. November 17, 2	2009-11-17
High-Purity Ru Alloy Target, Process for Producing the Same, and Sputtered Film App 20090280025 - Kanou; Gaku ; et al.	2009-11-12
Sputtering Target/Backing Plate Bonded Body App 20090277788 - Oda; Kunihiro ; et al.	2009-11-12
Ultrahigh-Purity Copper and Process for Producing the Same, and Bonding Wire Comprising Ultrahigh-Purity Copper App 20090272466 - Shindo; Yuichiro ; et al.	2009-11-05
Nickel alloy sputtering target and nickel alloy thin film Grant 7,605,481 - Yamakoshi , et al. October 20, 2	2009-10-20
Method for producing ammonium hexachlororuthenate and ruthenium powder, as well as ammonium hexachlororuthenate Grant 7,601,198 - Nagai , et al. October 13, 2	2009-10-13
Gallium Oxide/Zinc Oxide Sputtering Target, Method of Forming Transparent Conductive Film and Transparent Conductive Film App 20090250669 - Osada; Kozo	2009-10-08
Method for recovering metal from ore App 20090241736 - Abe; Yoshifumi ; et al.	2009-10-01
Method of obtaining copper from ore App 20090241732 - Abe; Yoshifumi ; et al.	2009-10-01
Nonmagnetic Material Particle Dispersed Ferromagnetic Material Sputtering Target App 20090242393 - Satoh; Kazuyuki	2009-10-01
Process Of Leaching Gold App 20090241735 - Abe; Yoshifumi ; et al.	2009-10-01
Cu-Zn Alloy Strip Superior in Thermal Peel Resistance of Sn Plating and Sn Plating Strip Thereof App 20090239094 - Hatano; Takaaki	2009-09-24
Target formed of Sintering-Resistant Material of High-Melting Point Metal Alloy, High-Melting Point Metal Silicide, High-Melting Point Metal Carbide, High-Melting Point Metal Nitride, or High-Melting Point Metal Boride, Process for Producing the Target, Assembly of the Sputtering Target-Backing Plat App 20090229975 - Yamakoshi; Yasuhiro	2009-09-17
High-Purity Hafnium, Target and Thin Film Comprising High-Purity Hafnium, and Process for Producing High-Purity Hafnium App 20090226341 - Shindo; Yuichiro	2009-09-10
High-purity Ru powder, sputtering target obtained by sintering the same, thin film obtained by sputtering the target and process for producing high-purity Ru powder Grant 7,578,965 - Shindo , et al. August 25, 2	2009-08-25
Copper Foil for Printed Wiring Board App 20090208762 - Akase; Fumiaki	2009-08-20
Gallium Oxide-Zinc Oxide Sputtering Target, Method for Forming Transparent Conductive Film, and Transparent Conductive Film App 20090206303 - Osada; Kozo	2009-08-20
Zinc Oxide Based Transparent Electric Conductor, Sputtering Target for Forming of the Conductor and Process for Producing the Target App 20090200525 - Ikisawa; Masakatsu ; et al.	2009-08-13
Lithium Nickel Manganese Cobalt Composite Oxide and Lithium Rechargeable Battery App 20090200508 - Nagase; Ryuichi ; et al.	2009-08-13
Hafnium Silicide Target for Forming Gate Oxide Film, and Method for Preparation Thereof App 20090194898 - Irumata; Shuichi ; et al.	2009-08-06
Method for recovering rhodium and silver from hydrochloric acid Grant 7,563,420 - Usui , et al. July 21, 2	2009-07-21
Sintered Sputtering Target Made of Refractory Metals App 20090173627 - Suzuki; Ryo	2009-07-09
Sn-Plated Cu-Ni-Si Alloy Strip App 20090176125 - Hatano; Takaaki	2009-07-09
Lithium-Containing Transition Metal Oxide Target, Process for Producing the same and Lithium Ion Thin Film Secondary Battery App 20090166187 - Nagase; Ryuichi ; et al.	2009-07-02
Rolled Copper or Copper Alloy Foil with Roughened Surface and Method of Roughening Rolled Copper or Copper Alloy Foil App 20090162685 - Kobayashi; Yousuke ; et al.	2009-06-25
CdTe system compound semiconductor single crystal Grant 7,544,343 - Arakawa , et al. June 9, 2	2009-06-09
Sputtering Target for Producing Metallic Glass Membrane and Manufacturing Method Thereof App 20090139858 - Nakamura; Atsushi ; et al.	2009-06-04
Copper Alloy Sputtering Target and Semiconductor Element Wiring App 20090140430 - Okabe; Takeo ; et al.	2009-06-04
Copper Alloy Sputtering Target and Semiconductor Element Wiring App 20090139863 - Okabe; Takeo ; et al.	2009-06-04
Chromic Oxide Powder for Sputtering Target, and Sputtering Target Manufactured from such Chromic Oxide Powder App 20090139859 - Takami; Hideo ; et al.	2009-06-04
Sputtering Target App 20090134021 - Oda; Kunihiro ; et al.	2009-05-28
Highly Pure Hafnium Material, Target and Thin Film Comprising the Same and Method for Producing Highly Pure Hafnium App 20090126529 - Shindo; Yuichiro	2009-05-21
Sn-Plated Copper Alloy Strip Having Improved Fatigue Characteristics App 20090130480 - Hatano; Takaaki	2009-05-21
Cathode Material for Lithium Secondary Battery and Manufacturing Method Thereof App 20090121198 - Kajiya; Yoshio ; et al.	2009-05-14
Gallium Oxide-Zinc Oxide Sputtering Target, Method of Forming Transparent Conductive Film, and Transparent Conductive Film App 20090120786 - Osada; Kozo	2009-05-14
Ruthenium-Alloy Sputtering Target App 20090114535 - Oda; Kunihiro	2009-05-07
Methods of making and washing scorodite App 20090104107 - Kimura; Yukio ; et al.	2009-04-23
Zirconium Crucible for Melting Analytical Sample, Method of Preparing Analytical Sample and Method of Analysis App 20090104082 - Sakaguchi; Masahiro ; et al.	2009-04-23
Method for producing ZnTe system compound semiconductor single crystal, ZnTe system compound semiconductor single crystal, and semiconductor device Grant 7,521,282 - Yamamoto , et al. April 21, 2	2009-04-21
High-Purity Tin or Tin Alloy and Process for Producing High-Purity Tin App 20090098012 - Shindo; Yuichiro ; et al.	2009-04-16
Method for producing ZnTe system compound semiconductor single crystal, ZnTe system compound semiconductor single crystal, and semiconductor device Grant 7,517,720 - Yamamoto , et al. April 14, 2	2009-04-14
Hafnium silicide target for forming gate oxide film and method for preparation thereof Grant 7,517,515 - Irumata , et al. April 14, 2	2009-04-14
Erbium Sputtering Target and Manufacturing Method App 20090090621 - Tsukamoto; Shiro	2009-04-09
Heat-Resistant Sn-Plated Cu-Zn Alloy Strip with Suppressed Whiskering App 20090092851 - Hatano; Takaaki	2009-04-09
Zinc Oxide-Based Transparent Conductor and Sputtering Target for forming the Transparent Conductor App 20090085014 - Ikisawa; Masakatsu ; et al.	2009-04-02
Wafer storage container Grant 7,510,082 - Kimura , et al. March 31, 2	2009-03-31
High purity zinc oxide powder and method for production thereof, and high purity zinc oxide target and thin film of high purity zinc oxide Grant 7,510,635 - Shindo , et al. March 31, 2	2009-03-31
Taphole cooling structure Grant 7,510,679 - Motomura , et al. March 31, 2	2009-03-31
Process for producing scorodite and recycling the post-scorodite-synthesis solution App 20090078584 - Kimura; Yukio ; et al.	2009-03-26
Copper alloy sputtering target and semiconductor element wiring Grant 7,507,304 - Okabe , et al. March 24, 2	2009-03-24
Sb-Te Alloy Powder for Sintering, Sintered Compact Sputtering Target Obtained by Sintering said Powder, and Manufacturing Method of Sb-Te Alloy Powder for Sintering App 20090071821 - Takahashi; Hideyuki	2009-03-19
ITO sputtering target Grant 7,504,351 - Kurihara March 17, 2	2009-03-17
Hydrogen Separation Membrane, Sputtering Target for forming said Hydrogen Separation Membrane, and Manufacturing Method Thereof App 20090064861 - Nakamura; Atsushi ; et al.	2009-03-12
Hafnium Alloy Target and Process for Producing the Same App 20090057142 - Okabe; Takeo ; et al.	2009-03-05
Pot-Shaped Copper Sputtering Target and Manufacturing Method Thereof App 20090057139 - Fukushima; Atsushi ; et al.	2009-03-05
Zirconium Crucible App 20090053112 - Shindo; Yuichiro ; et al.	2009-02-26
Method for Determining Machining Plane of Planar Material, Machining Method and Device for Determining Machining Plane and Flat Surface Machining Device App 20090055009 - Nakashima; Koichi ; et al.	2009-02-26
Hafnium Alloy Target and Process for Producing the Same App 20090050475 - Okabe; Takeo ; et al.	2009-02-26
Sputtering Target App 20090032392 - Miyashita; Hirohito	2009-02-05
Copper Alloy for Electronic Materials App 20090035174 - Era; Naohiko ; et al.	2009-02-05
Sputtering target for phase-change memory, film for phase change memory formed by using the target, and method for producing the target Grant 7,484,546 - Yahagi , et al. February 3, 2	2009-02-03
Cu-Ni-Si-Co-Cr Copper Alloy for Electronic Materials and Method for Manufacturing Same App 20090025840 - Era; Naohiko ; et al.	2009-01-29
Copper alloy App 20090022993 - Sugawara; Yasutaka ; et al.	2009-01-22
Apparatus for removing ruthenium from solution containing platinum group metal App 20090008840 - Nagai; Hifumi	2009-01-08
Method for Connecting Magnetic Substance Target to Backing Plate, and Magnetic Substance Target App 20090008245 - Yamakoshi; Yasuhiro ; et al.	2009-01-08
Manufacturing Method of High Purity Nickel, High Purity Nickel, Sputtering Target formed from said High Purity Nickel, and Thin Film formed with said Sputtering Target App 20090004498 - Shindo; Yuichiro ; et al.	2009-01-01
Hafnium Alloy Target and Process for Producing the Same App 20090000704 - Okabe; Takeo ; et al.	2009-01-01
Electrolytic method in diaphragm-type cell Grant 7,465,386 - Haiki , et al. December 16, 2	2008-12-16
Method for growing epitaxial crystal Grant 7,465,353 - Kawabe , et al. December 16, 2	2008-12-16
Sputtering Target, Thin Film for Optical Information Recording Medium and Process for Producing the Same App 20080299415 - Hosono; Hideo ; et al.	2008-12-04
Hafnium alloy target and process for producing the same Grant 7,459,036 - Okabe , et al. December 2, 2	2008-12-02
Copper, Copper Alloy, And Manufacturing Method Therefor App 20080277032 - TOMIOKA; Yasuo ; et al.	2008-11-13
Method for producing high purity nickle, high purity nickle, sputtering target comprising the high purity nickel, and thin film formed by using said spattering target Grant 7,435,325 - Shindo , et al. October 14, 2	2008-10-14
Compound Semiconductor Substrate App 20080247935 - Suzuki; Kenji ; et al.	2008-10-09
Method for recovering rhodium App 20080236337 - Usui; Shoujirou ; et al.	2008-10-02
Method for analyzing minute amounts of Pd, Rh and Ru, and high-frequency plasma mass spectroscope used for same App 20080230690 - Kamimura; Kenichi ; et al.	2008-09-25
Method for manufacturing scorodite App 20080233023 - Kimura; Yukio ; et al.	2008-09-25
Ultrahigh-Purity Copper and Process for Producing the Same App 20080223728 - Shindo; Yuichiro ; et al.	2008-09-18
High-strength copper alloys with excellent bending workability and terminal connectors using the same App 20080210353 - Fukamachi; Kazuhiko ; et al.	2008-09-04
Electrolytic Copper Plating Method, Phosphorous Copper Anode for Electrolytic Copper Plating, and Semiconductor Wafer having Low Particle Adhesion Plated with said Method and Anode App 20080210568 - Aiba; Akihiro ; et al.	2008-09-04
Method for producing ammonium hexachlororuthenate and ruthenium powder, as well as ammonium hexachlororuthenate App 20080199386 - Nagai; Hifumi ; et al.	2008-08-21
Cu-Ni-Si system copper alloy for electronic materials App 20080175746 - Era; Naohiko ; et al.	2008-07-24
Electroless gold plating solution Grant 7,396,394 - Aiba , et al. July 8, 2	2008-07-08
Surface-treating agent for metal Grant 7,393,395 - Aiba , et al. July 1, 2	2008-07-01
Method for producing sheet-form electrolytic copper from halide solution App 20080149494 - Tsuchiya; Hiroo	2008-06-26
Iron-Based Sintered Compact and Method for Production Thereof App 20080138642 - Yahagi; Masataka ; et al.	2008-06-12
Copper Alloy And Producing Method Therefor App 20080121320 - Sugawara; Yasutaka ; et al.	2008-05-29
Sputtering Target, Sputtering Target-Backing Plate Assembly and Deposition System App 20080116066 - Miyashita; Hirohito	2008-05-22
Electrolytic copper plating method, phosphorus-containing anode for electrolytic copper plating, and semiconductor wafer plated using them and having few particles adhering to it Grant 7,374,651 - Aiba , et al. May 20, 2	2008-05-20
Method for producing ZnTe system compound semiconductor single crystal, ZnTe system compound semiconductor single crystal, and semiconductor device App 20080089831 - Yamamoto; Tetsuya ; et al.	2008-04-17
Method for producing ZnTe system compound semiconductor single crystal, ZnTe system compound semiconductor single crystal, and semiconductor device App 20080090390 - Yamamoto; Tetsuya ; et al.	2008-04-17
Method for producing ZnTe system compound semiconductor single crystal, ZnTe system compound semiconductor single crystal, and semiconductor device App 20080090328 - Yamamoto; Tetsuya ; et al.	2008-04-17
Method for producing ZnTe system compound semiconductor single crystal, ZnTe system compound semiconductor single crystal, and semiconductor device App 20080090386 - Yamamoto; Tetsuya ; et al.	2008-04-17
Method for manufacturing ZnTe compound semiconductor single crystal ZnTe compound semiconductor single crystal, and semiconductor device Grant 7,358,159 - Yamamoto , et al. April 15, 2	2008-04-15
Method for leaching gold App 20080078269 - Abe; Yoshifumi ; et al.	2008-04-03
High Purity Zrb2 Powder and Manufacturing Method Thereof App 20080075648 - Shindo; Yuichiro ; et al.	2008-03-27
Method for connecting magnetic substance target to backing plate, and magnetic substance target Grant 7,347,353 - Yamakoshi , et al. March 25, 2	2008-03-25
Iron-based sintered compact and method for production thereof Grant 7,347,969 - Yahagi , et al. March 25, 2	2008-03-25
Sputtering target and process for producing the same Grant 7,344,660 - Hosono , et al. March 18, 2	2008-03-18
Vapor-phase growth apparatus Grant 7,344,597 - Shimizu , et al. March 18, 2	2008-03-18
Copper foil having blackened surface or layer Grant 7,341,796 - Hanafusa March 11, 2	2008-03-11
Epitaxial growth method and substrate for epitaxial growth Grant 7,338,902 - Nakamura , et al. March 4, 2	2008-03-04
High purity electrolytic copper and its production method Grant 7,335,289 - Haiki , et al. February 26, 2	2008-02-26
Method of leaching copper sulfide ores containing chalcopyrite App 20080026450 - Ohtsuka; Norimasa ; et al.	2008-01-31
Vapor-phase epitaxial apparatus and vapor phase epitaxial method Grant 7,314,519 - Shimizu , et al. January 1, 2	2008-01-01
Process for Production of Ge-Cr Alloy Sputtering Target App 20070297932 - Takami; Hideo ; et al.	2007-12-27
Sb-Te Alloy Sintered Compact Sputtering Target App 20070297938 - Takahashi; Hideyuki	2007-12-27
Metallic Powder for Powder Metallurgy Whose Main Component is Iron and Iron-Based Sintered Body App 20070292298 - Imori; Toru ; et al.	2007-12-20
Method for recovering RH App 20070248513 - Usui; Shoujirou ; et al.	2007-10-25
High- Purity Ru Powder, Sputtering Target Obtained by Sintering the Same, Thin Film Obtained by Sputtering the Target and Process for Producing High-Purity Ru Powder App 20070240992 - Shindo; Yuichiro ; et al.	2007-10-18
Sputtering target containing zinc sulfide as major component, optical recording medium on which phase change optical disk protective film containing zinc sulfide as major component is formed by using the target, and method for manufacturing the sputtering target Grant 7,279,211 - Yahagi , et al. October 9, 2	2007-10-09
Metallic Powder for Powder Metallurgy whose Main Component is Iron and Iron-Based Sintered Body App 20070231180 - Imori; Toru ; et al.	2007-10-04
Determination Method and Processing Method of Machined Surface of Plate-Like Material, and Apparatus for Use in said Methods App 20070233312 - Nakashima; Koichi ; et al.	2007-10-04
Barrier Film For Flexible Copper Substrate And Sputtering Target For Forming Barrier Film App 20070209547 - Irumata; Shuichi ; et al.	2007-09-13
Chloride ion-resistant sulfur-oxidizing bacteria App 20070202584 - Ohtsuka; Norimasa ; et al.	2007-08-30
Co-cr-pt-b alloy sputtering target App 20070187236 - Nakamura; Yuichiro ; et al.	2007-08-16
Vapor phase growth method App 20070190757 - Nakamura; Masashi ; et al.	2007-08-16
Crystal manufacturing method Grant 7,256,110 - Sasaki , et al. August 14, 2	2007-08-14
Electroconductive oxide sintered compact, sputtering target comprising the sintered compact and methods for producing them Grant 7,252,794 - Suzuki August 7, 2	2007-08-07
AlRu Sputtering Target and Manufacturing Method thereof App 20070175753 - Hisano; Akira	2007-08-02
Manganese Alloy Sputtering Target and Method for Producing the Same App 20070163878 - Nakamura; Yuichiro	2007-07-19
Hafnium silicide target for gate oxide film formation and its production method Grant 7,241,368 - Irumata , et al. July 10, 2	2007-07-10
Copper foil having blackened surface or layer App 20070141377 - Hanafusa; Mikio	2007-06-21
Manganese alloy sputtering target and method for producing the same Grant 7,229,510 - Nakamura June 12, 2	2007-06-12
Production method for compound semiconductor single crystal Grant 7,229,494 - Asahi , et al. June 12, 2	2007-06-12
Sputtering target with few surface defects, and surface processing method thereof App 20070125645 - Nakamura; Yuichiro ; et al.	2007-06-07
Metal powder for powder metallurgy and iron-based sintered compact Grant 7,217,310 - Yahagi , et al. May 15, 2	2007-05-15
CdTe single crystal and CdTe polycrystal, and method for preparation thereof Grant 7,211,142 - Hirano May 1, 2	2007-05-01
Tantalum Sputtering Target and Method for Preparation Thereof App 20070062807 - Oda; Kunihiro	2007-03-22
Tantalum Sputtering Target and Method for Preparation Thereof App 20070062806 - Oda; Kunihiro	2007-03-22
Sputtering Target for Phase-Change Memory, Film for Phase Change Memory formed by using the Target, and Method for Producing the Target App 20070062808 - Yahagi; Masataka ; et al.	2007-03-22
Process for producing compound semiconductor single crystal Grant 7,175,705 - Fujimura , et al. February 13, 2	2007-02-13
Tantalum sputtering target and method for preparation thereof Grant 7,156,963 - Oda January 2, 2	2007-01-02
Sputtering target for phase-change memory, film for phase change memory formed by using the target, and method for producing the target Grant 7,156,964 - Yahagi , et al. January 2, 2	2007-01-02
Electrolytic copper plating method, phosphorous copper anode for electrolytic plating method, and semiconductor wafer having low particle adhesion plated with said method and anode Grant 7,138,040 - Okabe , et al. November 21, 2	2006-11-21
Method of separating and processing catalyst carriers Grant 7,134,619 - Soe , et al. November 14, 2	2006-11-14
Sputtering target producing very few particles, backing plate or apparatus within sputtering device and roughening method by electric discharge machining Grant 7,115,193 - Takahashi October 3, 2	2006-10-03
Overhead traveling crane system Grant 6,755,313 - Kishimoto , et al. June 29, 2	2004-06-29
Method of manufacturing rolled copper foil for flexible printed circuit Grant 6,689,235 - Hatano , et al. February 10, 2	2004-02-10
Fe-Ni alloy material for shadow mask and method for manufacturing thereof App 20040012321 - Kurosaki, Ikuya ; et al.	2004-01-22
Titanium copper alloy having excellent strength and bendability, and manufacturing method thereof App 20040003878 - Izumi, Chihiro ; et al.	2004-01-08
Copper alloy material having efficient press properties and process for production thereof App 20030211357 - Harada, Koji ; et al.	2003-11-13
Overhead traveling crane system Grant 6,631,818 - Ito October 14, 2	2003-10-14
Fe-Ni alloy used for a shadow mask and a method for producing a shadow mask Grant 6,624,556 - Ono September 23, 2	2003-09-23
Metallic material Grant 6,613,451 - Asahara , et al. September 2, 2	2003-09-02
Fe-Ni alloy with excellent magnetic properties for semi-tension mask, semi-tension mask of the alloy, and color picture tube using the mask Grant 6,600,259 - Ono , et al. July 29, 2	2003-07-29
Copper, copper alloy, and manufacturing method therefor App 20020189729 - Tomioka, Yasuo ; et al.	2002-12-19
High strength titanium copper alloy, manufacturing method therefor, and terminal connector using the same App 20020157741 - Yamamoto, Michiharu ; et al.	2002-10-31
Method of manufacturing rolled copper foil for flexible printed circuit App 20020139459 - Hatano, Takaaki ; et al.	2002-10-03
Method of manufacturing fe-ni alloy App 20020043314 - Eto, Masatoshi	2002-04-18
Rolled copper foil for flexible printed circuit and method of manufacturing the same Grant 6,197,433 - Hatano March 6, 2	2001-03-06
Method of recovering gold powder Grant 5,942,024 - Yoshifumi , et al. August 24, 1	1999-08-24
Composition of mold release agent for casting Grant 5,900,456 - Hashiuchi , et al. May 4, 1	1999-05-04
Method of purifying copper electrolytic solution Grant 5,783,057 - Tomita , et al. July 21, 1	1998-07-21
Vacuum melting-pressure pouring induction furnace Grant 5,559,827 - Shimada , et al. September 24, 1	1996-09-24
Method of producing refractory metal or alloy materials Grant 5,224,534 - Shimizu , et al. July 6, 1	1993-07-06