NIPPON MICROMETAL CORPORATION
Patent Applications and Registrations
Patent applications and USPTO patent grants for NIPPON MICROMETAL CORPORATION.The latest application filed is for "ag alloy bonding wire for semiconductor device".
Company Profile
29.76.48
- NIPPON MICROMETAL CORPORATION - Saitama JP
- NIPPON MICROMETAL CORPORATION - Iruma-shi JP
- NIPPON MICROMETAL CORPORATION - Iruma N/A JP
- NIPPON MICROMETAL CORPORATION - Iruma-shi, Saitama N/A JP
- Nippon Micrometal Corporation - Tokyo JP
Patent Activity
| Patent | Date |
|---|---|
| Ag ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE App 20220266396 - OYAMADA; Tetsuya ; et al. | 2022-08-25 |
| Junction Structure, Method For Manufacturing Junction Structure, And Solder Ball App 20220241903 - TANAKA; Masamoto ; et al. | 2022-08-04 |
| Bonding wire for semiconductor device Grant 11,373,934 - Oda , et al. June 28, 2 | 2022-06-28 |
| Bonding wire for semiconductor devices Grant 11,342,299 - Oda , et al. May 24, 2 | 2022-05-24 |
| Al Bonding Wire App 20220152749 - YAMADA; Takashi ; et al. | 2022-05-19 |
| Bonding Wire App 20220157766 - YAMADA; Takashi ; et al. | 2022-05-19 |
| Bonding Wire For Semiconductor Devices App 20220108971 - ODA; Daizo ; et al. | 2022-04-07 |
| Cu pillar cylindrical preform for semiconductor connection Grant 11,101,234 - Yamada , et al. August 24, 2 | 2021-08-24 |
| Cu alloy bonding wire for semiconductor device Grant 10,991,672 - Oyamada , et al. April 27, 2 | 2021-04-27 |
| Cu alloy bonding wire for semiconductor device Grant 10,985,130 - Oyamada , et al. April 20, 2 | 2021-04-20 |
| Bonding wire for semiconductor device Grant 10,950,570 - Oyamada , et al. March 16, 2 | 2021-03-16 |
| Bonding wire for semiconductor device Grant 10,950,571 - Oyamada , et al. March 16, 2 | 2021-03-16 |
| Cu ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE App 20210043599 - Oyamada; Tetsuya ; et al. | 2021-02-11 |
| Bonding Wire For Semiconductor Device App 20200373226 - ODA; Daizo ; et al. | 2020-11-26 |
| Bonding wire for semiconductor device Grant 10,840,208 - Oyamada , et al. November 17, 2 | 2020-11-17 |
| Copper Alloy Bonding Wire For Semiconductor Devices App 20200312808 - ODA; Daizo ; et al. | 2020-10-01 |
| Cu alloy bonding wire for semiconductor device Grant 10,790,259 - Oyamada , et al. September 29, 2 | 2020-09-29 |
| Cu ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE App 20200279824 - OYAMADA; Tetsuya ; et al. | 2020-09-03 |
| Bonding wire for semiconductor device Grant 10,737,356 - Yamada , et al. A | 2020-08-11 |
| Cu alloy core bonding wire with Pd coating for semiconductor device Grant 10,672,733 - Yamada , et al. | 2020-06-02 |
| Cu ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE App 20200168578A1 - | 2020-05-28 |
| Bonding wire for semiconductor device Grant 10,610,976 - Yamada , et al. | 2020-04-07 |
| Bonding Wire For Semiconductor Device App 20200013748 - YAMADA; Takashi ; et al. | 2020-01-09 |
| Cu ALLOY CORE BONDING WIRE WITH Pd COATING FOR SEMICONDUCTOR DEVICE App 20200013747 - YAMADA; Takashi ; et al. | 2020-01-09 |
| Bonding wire for semiconductor device Grant 10525555 - | 2020-01-07 |
| Bonding wire for semiconductor device Grant 10,529,683 - Oyamada , et al. J | 2020-01-07 |
| Cu alloy core bonding wire with Pd coating for semiconductor device Grant 10,497,663 - Yamada , et al. De | 2019-12-03 |
| Bonding wire for semiconductor device Grant 10,468,370 - Yamada , et al. No | 2019-11-05 |
| Cu alloy core bonding wire with Pd coating for semiconductor device Grant 10461055 - | 2019-10-29 |
| Bonding Wire For Semiconductor Device App 20190326246 - OYAMADA; Tetsuya ; et al. | 2019-10-24 |
| Bonding wire for semiconductor device Grant 10,414,002 - Yamada , et al. Sept | 2019-09-17 |
| Silver bonding wire for semiconductor device containing indium, gallium, and/or cadmium Grant 10,381,320 - Oyamada , et al. A | 2019-08-13 |
| Cu ALLOY CORE BONDING WIRE WITH Pd COATING FOR SEMICONDUCTOR DEVICE App 20190164927 - YAMADA; Takashi ; et al. | 2019-05-30 |
| Cu alloy core bonding wire with Pd coating for semiconductor device Grant 10,236,272 - Yamada , et al. | 2019-03-19 |
| Bonding Wire For Semiconductor Device App 20180374815 - OYAMADA; Tetsuya ; et al. | 2018-12-27 |
| Bonding Wire For Semiconductor Devices App 20180374816 - ODA; Daizo ; et al. | 2018-12-27 |
| Bonding wire for semiconductor device Grant 10,137,534 - Yamada , et al. November 27, 2 | 2018-11-27 |
| Method for forming ball in bonding wire Grant 10,121,764 - Araki , et al. November 6, 2 | 2018-11-06 |
| Bonding wire for semiconductor device Grant 10,121,758 - Oda , et al. November 6, 2 | 2018-11-06 |
| Bonding wire for semiconductor device Grant 10,032,741 - Oda , et al. July 24, 2 | 2018-07-24 |
| Bonding Wire For Semiconductor Device App 20180133843 - YAMADA; Takashi ; et al. | 2018-05-17 |
| Bonding Wire For Semiconductor Device App 20180130763 - YAMADA; Takashi ; et al. | 2018-05-10 |
| Bonding Wire For Semiconductor Device App 20180122765 - ODA; Daizo ; et al. | 2018-05-03 |
| Method For Forming Ball In Bonding Wire App 20180096965 - ARAKI; Noritoshi ; et al. | 2018-04-05 |
| Bonding wire for semiconductor device Grant 9,887,172 - Oda , et al. February 6, 2 | 2018-02-06 |
| Bonding Wire For Semiconductor Device App 20170365576 - OYAMADA; Tetsuya ; et al. | 2017-12-21 |
| Bonding Wire For Semiconductor Device App 20170323864 - ODA; Daizo ; et al. | 2017-11-09 |
| Bonding wire for semiconductor devices Grant 9,812,421 - Uno , et al. November 7, 2 | 2017-11-07 |
| Cu PILLAR CYLINDRICAL PREFORM FOR SEMICONDUCTOR CONNECTION App 20170287861 - YAMADA; Takashi ; et al. | 2017-10-05 |
| Bonding wire for semiconductor device Grant 9,773,748 - Yamada , et al. September 26, 2 | 2017-09-26 |
| Lead-free Solder Bump Joining Structure App 20170259366 - ISHIKAWA; Shinji ; et al. | 2017-09-14 |
| Bonding Wire For Semiconductor Device App 20170216974 - YAMADA; Takashi ; et al. | 2017-08-03 |
| Solder Ball And Electronic Member App 20170209964 - TERASHIMA; Shinichi ; et al. | 2017-07-27 |
| Bonding Wire For Semiconductor Device App 20170200690 - YAMADA; Takashi ; et al. | 2017-07-13 |
| Bonding Wire For Semiconductor Device App 20170200689 - YAMADA; Takashi ; et al. | 2017-07-13 |
| Bonding Wire For Semiconductor Device App 20170194280 - ODA; Daizo ; et al. | 2017-07-06 |
| Bonding Wire For Semiconductor Device App 20170179064 - YAMADA; Takashi ; et al. | 2017-06-22 |
| Bonding Wire For Semiconductor Device App 20170117244 - YAMADA; Takashi ; et al. | 2017-04-27 |
| Bonding Wire For Semiconductor Device App 20170110430 - OYAMADA; Tetsuya ; et al. | 2017-04-20 |
| Bonding Wire For Semiconductor Device App 20170040281 - OYAMADA; Tetsuya ; et al. | 2017-02-09 |
| Bonding wire for semiconductor device use and method of production of same Grant 9,543,266 - Yamada , et al. January 10, 2 | 2017-01-10 |
| Bonding wire for semiconductor device use and method of production of same Grant 9,536,854 - Yamada , et al. January 3, 2 | 2017-01-03 |
| Bonding Wire For Semiconductor Devices App 20160315063 - UNO; Tomohiro ; et al. | 2016-10-27 |
| Bonding wire and method for manufacturing same Grant 9,434,027 - Togashi September 6, 2 | 2016-09-06 |
| Copper alloy bonding wire for semiconductor Grant 9,427,830 - Uno , et al. August 30, 2 | 2016-08-30 |
| Bonding Wire For Semiconductor Device Use And Method Of Production Of Same App 20160111389 - YAMADA; Takashi ; et al. | 2016-04-21 |
| Solder ball and electronic member Grant 9,320,152 - Terashima , et al. April 19, 2 | 2016-04-19 |
| Bonding Wire For Semiconductor Device Use And Method Of Production Of Same App 20160104687 - YAMADA; Takashi ; et al. | 2016-04-14 |
| Bonding wire for semiconductor device Grant 9,112,059 - Uno , et al. August 18, 2 | 2015-08-18 |
| Power semiconductor device, method of manufacturing the device and bonding wire Grant 9,059,003 - Tatsumi , et al. June 16, 2 | 2015-06-16 |
| Solder Ball And Electronic Member App 20150146394 - Terashima; Shinichi ; et al. | 2015-05-28 |
| Solder ball for semiconductor packaging and electronic member using the same Grant 9,024,442 - Terashima , et al. May 5, 2 | 2015-05-05 |
| Power Semiconductor Device, Method Of Manufacturing The Device And Bonding Wire App 20140327018 - Tatsumi; Kohei ; et al. | 2014-11-06 |
| Bonding Wire And Method For Manufacturing Same App 20140329106 - TOGASHI; Ryo | 2014-11-06 |
| Bonding wire for semiconductor Grant 8,815,019 - Uno , et al. August 26, 2 | 2014-08-26 |
| Bonding wire for semiconductor Grant 8,742,258 - Terashima , et al. June 3, 2 | 2014-06-03 |
| Copper bonding wire for semiconductor device and bonding structure thereof Grant 8,653,668 - Uno , et al. February 18, 2 | 2014-02-18 |
| Copper alloy bonding wire for semiconductor device Grant 8,610,291 - Uno , et al. December 17, 2 | 2013-12-17 |
| Lead-free solder alloy, solder ball and electronic member, and lead-free solder alloy, solder ball and electronic member for automobile-mounted electronic member Grant 8,562,906 - Tanaka , et al. October 22, 2 | 2013-10-22 |
| Solder alloy, solder ball and electronic member having solder bump Grant 8,501,088 - Kobayashi , et al. August 6, 2 | 2013-08-06 |
| Bonding Structure Of Multilayer Copper Bonding Wire App 20130180757 - Uno; Tomohiro ; et al. | 2013-07-18 |
| Gold wire for semiconductor element connection Grant 8,415,797 - Kimura , et al. April 9, 2 | 2013-04-09 |
| Bonding wire for semiconductor devices Grant 8,299,356 - Uno , et al. October 30, 2 | 2012-10-30 |
| Wire bonding structure and method for forming same Grant 8,247,911 - Uno , et al. August 21, 2 | 2012-08-21 |
| Bonding Wire For Semiconductor App 20120118610 - Terashima; Shinichi ; et al. | 2012-05-17 |
| Bonding Wire For Semiconductor Device App 20120104613 - Uno; Tomohiro ; et al. | 2012-05-03 |
| Copper Alloy Bonding Wire For Semiconductor App 20120094121 - Uno; Tomohiro ; et al. | 2012-04-19 |
| Lead-free Solder Alloy, Solder Ball, And Electronic Member Comprising Solder Bump App 20120038042 - Sasaki; Tsutomu ; et al. | 2012-02-16 |
| Semiconductor device bonding wire and wire bonding method Grant 8,102,061 - Uno , et al. January 24, 2 | 2012-01-24 |
| Semiconductor mounting bonding wire Grant 8,097,960 - Terashima , et al. January 17, 2 | 2012-01-17 |
| Copper alloy bonding wire for semiconductor device Grant 8,004,094 - Uno , et al. August 23, 2 | 2011-08-23 |
| Bonding wire for semiconductor device Grant 7,952,028 - Uno , et al. May 31, 2 | 2011-05-31 |
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