NIPPON DENKAI, LTD.
Patent Applications and Registrations
Patent applications and USPTO patent grants for NIPPON DENKAI, LTD..The latest application filed is for "electrolytic copper foil and method for producing same".
- NIPPON DENKAI, LTD. - Chikusei-shi, Ibaraki JP
- Nippon Denkai, Ltd. - Ibaraki JP
- Nippon Denkai, Ltd. - Tokyo JP
Trademarks
| Patent | Date |
|---|---|
| Electrolytic Copper Foil And Method For Producing Same App 20220112618 - KAWASAKI; Toshio ; et al. | 2022-04-14 |
| Composite copper foil and method for production thereof Grant 7,816,015 - Sato October 19, 2 | 2010-10-19 |
| Method and apparatus for producing electrolytic copper foil Grant 6,663,758 - Motohashi , et al. December 16, 2 | 2003-12-16 |
| Copper foil for printed wiring board Grant 5,712,047 - Aso , et al. January 27, 1 | 1998-01-27 |
| Copper clad laminate, multilayer printed circuit board and their processing method Grant 5,569,545 - Yokono , et al. October 29, 1 | 1996-10-29 |
| Non-cyanide copper-zinc electroplating bath, method of surface treatment of copper foil for printed wiring board using the same and copper foil for printed wiring board Grant 5,534,128 - Aso , et al. July 9, 1 | 1996-07-09 |
| NCAGE Code | SJNY6 | Nippon Denkai, Ltd. |
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