loadpatents
name:-0.012290000915527
name:-0.0060529708862305
name:-0.002392053604126
Ninomiya; Junji Patent Filings

Ninomiya; Junji

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ninomiya; Junji.The latest application filed is for "hydrophilic film, and heat exchanger fin and heat exchanger using the hydrophilic film".

Company Profile
2.4.9
  • Ninomiya; Junji - Tokyo JP
  • NINOMIYA; Junji - Aichi JP
  • Ninomiya; Junji - Chiyoda-ku JP
  • Ninomiya; Junji - Imaichi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Heat exchanger, and fin material for said heat exchanger
Grant 10,408,550 - Murase , et al. Sept
2019-09-10
Hydrophilic Film, And Heat Exchanger Fin And Heat Exchanger Using The Hydrophilic Film
App 20190178591 - Shiomi; Kohei ;   et al.
2019-06-13
Aluminum Alloy Fin Material, Aluminum Alloy Brazing Sheet, And Heat Exchanger
App 20190162492 - KUROSAKI; Tomohito ;   et al.
2019-05-30
Method Of Manufacturing An Aluminum Structure
App 20180214964 - ITOH; Yasunaga ;   et al.
2018-08-02
Method Of Manufacturing An Aluminum Structure
App 20180133845 - ITOH; Yasunaga ;   et al.
2018-05-17
Heat Exchanger, And Fin Material For Said Heat Exchanger
App 20160116234 - MURASE; Takashi ;   et al.
2016-04-28
Micro-reactor And Method Of Manufacturing The Same
App 20110041986 - KIHARA; Takeshi ;   et al.
2011-02-24
Micro-reactor and method of manufacturing the same
Grant 7,857,874 - Kihara , et al. December 28, 2
2010-12-28
Heat exchanger and fin material for the heat exchanger
Grant 7,485,374 - Suzuki , et al. February 3, 2
2009-02-03
Aluminum Piping Material For Automobile Heat Exchanger
App 20080050269 - TANAKA; Satoshi ;   et al.
2008-02-28
Micro-reactor and method of manufacturing the same
App 20070163175 - Kihara; Takeshi ;   et al.
2007-07-19
Heat exchanger and fin material for the heat exchanger
App 20060166030 - Suzuki; Yoshikazu ;   et al.
2006-07-27
Composite substrate for heat-generating semiconductor device and semiconductor apparatus using the same
Grant 5,981,085 - Ninomiya , et al. November 9, 1
1999-11-09

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