| Patent | Date |
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Imaging Module And Method For Fabricating Same
App 20220308304 - HUANG; Herb He ; et al. | 2022-09-29 |
Wafer-level package structure
Grant 11,450,582 - Luo , et al. September 20, 2 | 2022-09-20 |
Thin Film Piezoelectric Acoustic Wave Resonator And Manufacturing Method Therefor, And Filter
App 20220294414 - HUANG; Herb He ; et al. | 2022-09-15 |
Mask plate and fabrication method thereof
Grant 11,444,244 - Liu , et al. September 13, 2 | 2022-09-13 |
Image capturing assembly, lens module and electronic device
Grant 11,430,825 - Chen , et al. August 30, 2 | 2022-08-30 |
Composite Substrate For Manufacturing Acoustic Wave Resonator And Surface Acoustic Wave Resonator, And Manufacturing Method Thereof
App 20220247375 - HUANG; Herb He ; et al. | 2022-08-04 |
Interconnect structure having metal layers enclosing a dielectric
Grant 11,373,949 - He , et al. June 28, 2 | 2022-06-28 |
Cmos Image Sensor Encapsulation Module And Method For Forming Same, And Camera Apparatus
App 20220173151 - XIANG; Yanghui | 2022-06-02 |
Package structure of wafer-level system-in-package
Grant 11,309,279 - Liu , et al. April 19, 2 | 2022-04-19 |
Image capturing assembly and packaging method thereof, lens module, and electronic device
Grant 11,296,141 - Chen , et al. April 5, 2 | 2022-04-05 |
Method For Manufacturing Imaging Module
App 20220068986 - GUI; Luo | 2022-03-03 |
Imaging Module
App 20220070338 - GUI; Luo | 2022-03-03 |
Camera Assembly, Lens Module, And Electronic Device
App 20220045112 - CHEN; Da ; et al. | 2022-02-10 |
CMOS image sensor packaging structure and fabrication method thereof, and camera device
Grant 11,201,187 - Xiang December 14, 2 | 2021-12-14 |
Fabrication Method Of Photodetector And Imaging Sensor
App 20210366971 - LUO; Hailong | 2021-11-25 |
Camera assembly and packaging method thereof, lens module, electronic device
Grant 11,171,166 - Chen , et al. November 9, 2 | 2021-11-09 |
Camera Assembly, Lens Module, And Electronic Device
App 20210320095 - CHEN; Da ; et al. | 2021-10-14 |
Packaging method and packaging structure
Grant 11,130,673 - Yang September 28, 2 | 2021-09-28 |
Film Bulk Acoustic Resonator And Fabrication Method Thereof, Filter, And Radio Frequency Communication System
App 20210281243 - SUI; Huan ; et al. | 2021-09-09 |
Semiconductor Device
App 20210280527 - LIU; Mengbin | 2021-09-09 |
Photodetector and fabrication method, and imaging sensor
Grant 11,101,311 - Luo August 24, 2 | 2021-08-24 |
Film Bulk Acoustic Resonator And Fabrication Method Thereof
App 20210234531 - SUI; Huan ; et al. | 2021-07-29 |
Camera assembly and packaging method thereof, lens module, and electronic device
Grant 11,069,670 - Chen , et al. July 20, 2 | 2021-07-20 |
Photoelectric Sensing Integrated System And Packaging Method, Lens Module, And Electronic Device
App 20210210542 - QIN; Xiaoshan | 2021-07-08 |
Microcontroller unit and fabrication method thereof
Grant 11,056,476 - Tang , et al. July 6, 2 | 2021-07-06 |
Alignment mark and semiconductor device, and fabrication methods thereof
Grant 11,049,816 - Liu June 29, 2 | 2021-06-29 |
Fingerprint Identification Module, Method For Forming Fingerprint Identification Module, And Electronic Device
App 20210193903 - SHI; Hu ; et al. | 2021-06-24 |
Film Bulk Acoustic Resonator And Fabrication Method Thereof
App 20210184643 - YANG; Guohuang | 2021-06-17 |
Substrate having two semiconductor materials on insulator
Grant 11,011,410 - Zhu , et al. May 18, 2 | 2021-05-18 |
Gate driver integrated circuit
Grant 10,998,439 - Yang , et al. May 4, 2 | 2021-05-04 |
Wafer-level packaging method and package structure
Grant 10,978,421 - Luo , et al. April 13, 2 | 2021-04-13 |
Wafer-level Package Structure
App 20210082869 - LUO; Hailong ; et al. | 2021-03-18 |
Image Capturing Assembly, Lens Module And Electronic Device
App 20210066381 - CHEN; Da ; et al. | 2021-03-04 |
Packaging method and package structure of wafer-level system-in-package
Grant 10,930,617 - Liu February 23, 2 | 2021-02-23 |
Package Structure Of Wafer-level System-in-package
App 20210043601 - LIU; Mengbin ; et al. | 2021-02-11 |
Wafer-level system-in-package packaging method and package structure thereof
Grant 10,910,286 - Luo , et al. February 2, 2 | 2021-02-02 |
Camera assembly and packaging methods thereof, lens module, and electronic device
Grant 10,887,499 - Chen , et al. January 5, 2 | 2021-01-05 |
Photosensitive assembly and formation methods thereof, lens module, and electronic device
Grant 10,886,315 - Chen January 5, 2 | 2021-01-05 |
Film Bulk Acoustic Resonator
App 20200412318 - WANG; Xiaochuan | 2020-12-31 |
Wafer-level Package Structure
App 20200402876 - LUO; Hailong ; et al. | 2020-12-24 |
Method For Forming Film Bulk Acoustic Resonator
App 20200403594 - WANG; Xiaochuan | 2020-12-24 |
Wafer-level packaging method and package structure thereof
Grant 10,861,822 - Luo , et al. December 8, 2 | 2020-12-08 |
Packaging method and package structure of wafer-level system-in-package
Grant 10,861,821 - Liu , et al. December 8, 2 | 2020-12-08 |
Image capturing assembly and packaging method thereof, lens module and electronic device
Grant 10,861,895 - Chen , et al. December 8, 2 | 2020-12-08 |
Wafer-level system-in-package structure and electronic apparatus thereof
Grant 10,811,385 - Liu October 20, 2 | 2020-10-20 |
Wafer-level packaging method and package structure thereof
Grant 10,804,177 - Luo , et al. October 13, 2 | 2020-10-13 |
Wafer-level packaging method and package structure thereof
Grant 10,790,211 - Luo , et al. September 29, 2 | 2020-09-29 |
Wafer level package structure and wafer level packaging method
Grant 10,784,229 - Luo , et al. Sept | 2020-09-22 |
Film bulk acoustic resonator and method of fabrication same
Grant 10,784,832 - Wang Sept | 2020-09-22 |
Thin-film Bulk Acoustic Resonator And Semiconductor Apparatus Comprising The Same
App 20200280294 - HUANG; Herb He ; et al. | 2020-09-03 |
Cmos Image Sensor Packaging Structure And Fabrication Method Thereof, And Camera Device
App 20200273904 - XIANG; Yanghui | 2020-08-27 |
Wafer-level packaging methods using a photolithographic bonding material
Grant 10,755,979 - Shi , et al. A | 2020-08-25 |
Gate driver integrated circuit
Grant 10,756,193 - Yang , et al. A | 2020-08-25 |
Methods and structures for wafer-level system in package
Grant 10,756,056 - Liu A | 2020-08-25 |
Wafer-level system packaging method and package structure
Grant 10,756,051 - Luo , et al. A | 2020-08-25 |
Thin-film Bulk Acoustic Resonator And Semiconductor Apparatus Comprising The Same
App 20200266790A1 - | 2020-08-20 |
Microcontroller Unit And Fabrication Method Thereof
App 20200212028 - Tang; Ying ; et al. | 2020-07-02 |
Resonator and related manufacturing method
Grant 10,700,663 - Huang , et al. | 2020-06-30 |
Packaging Method And Packaging Structure
App 20200198964 - YANG; Tianlun | 2020-06-25 |
Manufacturing of thin-film bulk acoustic resonator and semiconductor apparatus comprising the same
Grant 10,693,431 - Huang , et al. | 2020-06-23 |
Gate Driver Integrated Circuit
App 20200195248 - YANG; Weicheng ; et al. | 2020-06-18 |
Gate Driver Integrated Circuit
App 20200194586 - YANG; Weicheng ; et al. | 2020-06-18 |
Manufacturing of thin-film bulk acoustic resonator and semiconductor apparatus comprising the same
Grant 10,686,422 - Huang , et al. | 2020-06-16 |
Camera Assembly And Packaging Methods Thereof, Lens Module, And Electronic Device
App 20200162645 - CHEN; Da ; et al. | 2020-05-21 |
Image Capturing Assembly And Packaging Method Thereof, Lens Module, And Electronic Device
App 20200161346 - CHEN; Da ; et al. | 2020-05-21 |
Camera Assembly And Packaging Method Thereof, Lens Module, Electronic Device
App 20200161350 - CHEN; Da ; et al. | 2020-05-21 |
Camera Assembly And Packaging Method, Lens Module And Electronic Device
App 20200161356 - CHEN; Da ; et al. | 2020-05-21 |
Image Capturing Assembly And Packaging Method Thereof, Lens Module And Electronic Device
App 20200161359 - CHEN; Da ; et al. | 2020-05-21 |
Camera Assembly And Packaging Method Thereof, Lens Module, And Electronic Device
App 20200161289 - CHEN; Da ; et al. | 2020-05-21 |
Alignment Mark And Semiconductor Device, And Fabrication Methods Thereof
App 20200161251 - LIU; Mengbin | 2020-05-21 |
Interconnect Structure And Manufacturing Method Thereof
App 20200144175A1 - | 2020-05-07 |
Wafer-level Packaging Methods Using A Photolithographic Bonding Material
App 20200135689 - SHI; Hu ; et al. | 2020-04-30 |
Photosensitive Assembly And Formation Methods Thereof, Lens Module, And Electronic Device
App 20200135782 - CHEN; Da | 2020-04-30 |
Image Sensor Module And Method For Forming The Same
App 20200098807 - LIU; Mengbin | 2020-03-26 |
Wafer-level Packaging Method And Package Structure Thereof
App 20200075536 - LUO; Hailong ; et al. | 2020-03-05 |
Wafer-level Packaging Method And Package Structure Thereof
App 20200075444 - LUO; Hailong ; et al. | 2020-03-05 |
Wafer-level System-in-package Packaging Method And Package Structure Thereof
App 20200075442 - LUO; Hailong ; et al. | 2020-03-05 |
Wafer-level Packaging Method And Package Structure
App 20200075537 - LUO; Hailong ; et al. | 2020-03-05 |
Wafer-level Packaging Method And Package Structure Thereof
App 20200075443 - LUO; Hailong ; et al. | 2020-03-05 |
Wafer-level System Packaging Method And Package Structure
App 20200075538 - LUO; Hailong ; et al. | 2020-03-05 |
Wafer Level Package Structure And Wafer Level Packaging Method
App 20200075539 - LUO; Hailong ; et al. | 2020-03-05 |
Method of fabricating RFIC device
Grant 10,559,516 - Wang Feb | 2020-02-11 |
Method of manufacturing an interconnect structure by forming metal layers in mask openings
Grant 10,553,536 - He , et al. Fe | 2020-02-04 |
Photodetector And Fabrication Method, And Imaging Sensor
App 20190393256 - LUO; Hailong | 2019-12-26 |
Resonator and related manufacturing method
Grant 10,511,284 - Huang , et al. Dec | 2019-12-17 |
Method Of Fabricating Rfic Device
App 20190371698 - WANG; Xiaochuan | 2019-12-05 |
Image sensor module and method for forming the same
Grant 10,490,589 - Liu Nov | 2019-11-26 |
Packaging Method And Package Structure Of Wafer-level System-in-package
App 20190341365 - LIU; Mengbin ; et al. | 2019-11-07 |
Mask And Fabrication Method Thereof
App 20190341265 - LIU; Mengbin ; et al. | 2019-11-07 |
Mask Plate And Fabrication Method Thereof
App 20190326514 - LIU; Mengbin ; et al. | 2019-10-24 |
Semiconductor device, related manufacturing method, and related electronic device
Grant 10,433,435 - Huang , et al. O | 2019-10-01 |
RFIC device and method of fabricating same
Grant 10,431,518 - Wang O | 2019-10-01 |
Substrate Having Two Semiconductor Materials On Insulator
App 20190244854 - ZHU; Ji Guang ; et al. | 2019-08-08 |
Method of forming interconnect structure with partial copper plating
Grant 10,347,530 - Zhu , et al. July 9, 2 | 2019-07-09 |
Vertically integrated three-dimensional CMOS image sensors (3D CIS) bonded with control circuit substrate
Grant 10,269,852 - Liu , et al. | 2019-04-23 |
Methods And Structures For Wafer-level System In Package
App 20190115314 - LIU; Mengbin | 2019-04-18 |
Packaging Method And Package Structure Of Wafer-level System-in-package
App 20190115316 - LIU; Mengbin | 2019-04-18 |
Substrate having two semiconductor materials on insulator
Grant 10,262,891 - Zhu , et al. | 2019-04-16 |
Wafer-level System-in-package Structure And Electronic Apparatus Thereof
App 20190103332 - LIU; Mengbin | 2019-04-04 |
Transistor and method for forming the same
Grant 10,199,478 - Huang , et al. Fe | 2019-02-05 |
Rfic Device And Method Of Fabricating Same
App 20180331010 - WANG; Xiaochuan | 2018-11-15 |
Inductor device
Grant 10,026,801 - Huang , et al. July 17, 2 | 2018-07-17 |
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