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name:-0.013232946395874
name:-0.0090029239654541
name:-0.0054569244384766
Niklaus; Frank Patent Filings

Niklaus; Frank

Patent Applications and Registrations

Patent applications and USPTO patent grants for Niklaus; Frank.The latest application filed is for "method and apparatus for additively forming an optical component".

Company Profile
6.11.21
  • Niklaus; Frank - Taby SE
  • Niklaus; Frank - Taeby SE
  • Niklaus; Frank - 112 26 Stockholm SE
  • Niklaus; Frank - Stockholm 112 26 SE
  • Niklaus, Frank - Stockholm SE
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Crack structure and tunneling device with a layer exhibiting a crack-defined gap between two cantilevering parts
Grant 11,442,026 - Dubois , et al. September 13, 2
2022-09-13
Method And Apparatus For Additively Forming An Optical Component
App 20220250961 - Huang; Po-Han ;   et al.
2022-08-11
Method of Material Transfer
App 20220161537 - QUELLMALZ; Arne ;   et al.
2022-05-26
Device with a Waveguide with a Support Structure Comprising a Polymer Layer and Method for its Fabrication
App 20210349261 - Ottonello Briano; Floria ;   et al.
2021-11-11
Crack Structures, Tunneling Junctions Using Crack Structures And Methods Of Making Same
App 20210239625 - DUBOIS; Valentin ;   et al.
2021-08-05
Crack Structure And Tunneling Device With A Layer Exhibiting A Crack-defined Gap Between Two Cantilevering Parts
App 20200378902 - DUBOIS; Valentin ;   et al.
2020-12-03
Crack structures, tunneling junctions using crack structures and methods of making same
Grant 10,782,249 - Dubois , et al. Sept
2020-09-22
Crack Structures, Tunneling Junctions Using Crack Structures And Methods Of Making Same
App 20180372653 - DUBOIS; Valentin ;   et al.
2018-12-27
Method and an apparatus for forming electrically conductive vias in a substrate, an automated robot-based manufacturing system, a component comprising a substrate with via holes, and an interposer device
Grant 9,054,162 - Fischer , et al. June 9, 2
2015-06-09
Method for the wafer-level integration of shape memory alloy wires
Grant 9,054,224 - Braun , et al. June 9, 2
2015-06-09
Method for plugging a hole
Grant 9,027,239 - Fischer , et al. May 12, 2
2015-05-12
Mems
App 20150090043 - Ruhl; Guenther ;   et al.
2015-04-02
Method For The Wafer-level Integration Of Shape Memory Alloy Wires
App 20130292856 - Braun; Stefan ;   et al.
2013-11-07
Method And An Apparatus For Forming Electrically Conductive Vias In A Substrate, An Automated Robot-based Manufacturing System, A Component Comprising A Substrate With Via Holes, And An Interposer Device
App 20130285256 - Fischer; Andreas ;   et al.
2013-10-31
Free Form Printing Of Silicon Micro- And Nanostructures
App 20130029480 - Niklaus; Frank ;   et al.
2013-01-31
Method For Plugging A Hole And A Plugged Hole
App 20130012078 - Fischer; Andreas ;   et al.
2013-01-10
Method of joining components
Grant 7,067,345 - Kalvesten , et al. June 27, 2
2006-06-27
Adhesive sacrificial bonding of spatial light modulators
Grant 7,054,052 - Niklaus , et al. May 30, 2
2006-05-30
Adhesive sacrificial bonding of spatial light modulators
App 20050052725 - Niklaus, Frank ;   et al.
2005-03-10
Method of joining components
App 20030102079 - Kalvesten, Edvard ;   et al.
2003-06-05

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