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Laminating apparatus
Grant 11,446,913 - Iwata , et al. September 20, 2 | 2022-09-20 |
Laminating apparatus
Grant 11,331,892 - Iwata , et al. May 17, 2 | 2022-05-17 |
Laminating apparatus
Grant 11,325,365 - Iwata , et al. May 10, 2 | 2022-05-10 |
Laminating Apparatus
App 20210370656 - IWATA; Kazutoshi ; et al. | 2021-12-02 |
Laminating Apparatus
App 20210362480 - IWATA; Kazutoshi ; et al. | 2021-11-25 |
Laminating apparatus
Grant 10,239,299 - Iwata , et al. | 2019-03-26 |
Laminating apparatus
Grant 10,081,170 - Yasumoto , et al. September 25, 2 | 2018-09-25 |
Laminating Apparatus
App 20180162111 - IWATA; Kazutoshi ; et al. | 2018-06-14 |
Copper electrolytic solution and electrolytic copper foil produced therewith
App 20100270163 - Kumagai; Masashi ; et al. | 2010-10-28 |
Copper electrolytic solution and electrolytic copper foil produced therewith
Grant 7,777,078 - Kumagai , et al. August 17, 2 | 2010-08-17 |
Copper electrolytic solution containing quaternary amine compound polymer with specific skeleton and organo-sulfur compound as additives, and electrolytic copper foil manufactured using the same
Grant 7,678,257 - Kumagai , et al. March 16, 2 | 2010-03-16 |
Surface treated copper film
Grant 7,651,783 - Tsuchida , et al. January 26, 2 | 2010-01-26 |
Method of surface treatment using imidazole compound
App 20090068364 - Imori; Toru ; et al. | 2009-03-12 |
Basic silane coupling agent organic carboxylate composition, method for producing the same, and epoxy resin composition containing the same
Grant 7,432,335 - Kumagai , et al. October 7, 2 | 2008-10-07 |
Electroless gold plating liquid
Grant 7,419,536 - Aiba , et al. September 2, 2 | 2008-09-02 |
Electroless gold plating solution
Grant 7,390,354 - Aiba , et al. June 24, 2 | 2008-06-24 |
Copper electrolytic solution containing amine compound having specific skeleton and organosulfur compound as additives, and electrolytic copper foil produced using the same
Grant 7,378,160 - Kumagai , et al. May 27, 2 | 2008-05-27 |
Copper electrolytic solution containing amine compound having specific skeleton and organosulfur compound as additives, and electrolytic copper foil produced using the same
App 20080073219 - Kumagai; Masashi ; et al. | 2008-03-27 |
Copper electrolytic solution containing quaternary amine compound polymer with specific skeleton and organo-sulfur compound as additives, and electrolytic copper foil manufactured using the same
App 20080075972 - Kumagai; Masashi ; et al. | 2008-03-27 |
Electroless gold plating liquid
Grant 7,300,501 - Hino , et al. November 27, 2 | 2007-11-27 |
Lithium-containing complex oxide and method of producing same
Grant 7,288,242 - Tasaki , et al. October 30, 2 | 2007-10-30 |
Packaging device and packaging method for hollow cathode type sputtering target
App 20070131545 - Okabe; Takeo ; et al. | 2007-06-14 |
Resin composition
App 20070123681 - Kobayashi; Hironori ; et al. | 2007-05-31 |
Sputtering target and method for finishing surface of such target
App 20070108046 - Tsukamoto; Shiro | 2007-05-17 |
Tantalum sputtering target and method of manufacturing same
App 20070102288 - Oda; Kunihiro ; et al. | 2007-05-10 |
High purity zinc oxide powder and method for production thereof, and high purity zinc oxide target and thin film of high purity zinc oxide
App 20070098626 - Shindo; Yuichiro ; et al. | 2007-05-03 |
Ni-pt Alloy And Target Comprising The Alloy
App 20070098590 - Shindo; Yuichiro | 2007-05-03 |
Nickel alloy sputtering target and nickel alloy thin film
App 20070074790 - Yamakoshi; Yasuhiro ; et al. | 2007-04-05 |
Copper or copper alloy target/copper alloy backing plate assembly
App 20070051624 - Okabe; Takeo ; et al. | 2007-03-08 |
High purity copper sulfate and method for production thereof
App 20070053828 - Shindo; Yuichiro | 2007-03-08 |
Copper electrolytic solution containing quaternary amine compound with specific skeleton and organo-sulfur compound as additives, and electrolytic copper foil manufactured using the same
App 20070042201 - Kumagai; Masashi ; et al. | 2007-02-22 |
Electroless plating method and semiconductor wafer on which metal plating layer is formed
Grant 7,179,741 - Imori , et al. February 20, 2 | 2007-02-20 |
Tantalum sputtering target
App 20070023281 - Oda; Kunihiro | 2007-02-01 |
Highly pure hafnium material, target thin film comprising the same and method for producing highly pure hafnium
App 20070018138 - Shindo; Yuichiro | 2007-01-25 |
High-purity ni-v alloy target therefrom high-purity ni-v alloy thin film and process for producing high-purity ni-v alloy
App 20060292028 - Shindo; Yuichiro ; et al. | 2006-12-28 |
Copper electrolytic solution containing organic sulfur compound and quaternary amine compound of specified skeleton as additives and electrolytic copper foil produced therewith
Grant 7,144,491 - Kumagai , et al. December 5, 2 | 2006-12-05 |
High purity hafnium, target and thin film comprising said high purity hafnium, and method for producing high purity hafnium
App 20060266158 - Shindo; Yuichiro | 2006-11-30 |
Basic silane coupling agent organic carboxylate composition, method for producing the same, and epoxy resin composition containing the same
App 20060217494 - Kumagai; Masashi ; et al. | 2006-09-28 |
Solid silane coupling agent composition, process for producing the same, and resin composition containing the same
Grant 7,109,273 - Tsuchida , et al. September 19, 2 | 2006-09-19 |
Hafnium alloy target and process for producing the same
App 20060189164 - Okabe; Takeo ; et al. | 2006-08-24 |
Basic silane coupling agent organic carboxylate composition, method for producing the same, and epoxy resin composition containing the same
Grant 7,094,845 - Kumagai , et al. August 22, 2 | 2006-08-22 |
Epitaxial growth process
App 20060178000 - Takakusaki; Misao ; et al. | 2006-08-10 |
Sputtering target, thin film for optical information recording medium and process for producing the same
App 20060147740 - Hosono; Hideo ; et al. | 2006-07-06 |
Target of high-purity nickel or nickel alloy and its producing method
App 20060137782 - Yamakoshi; Yasuhiro ; et al. | 2006-06-29 |
II-VI compound semiconductor crystal and photoelectric conversion device
Grant 7,045,871 - Kishino , et al. May 16, 2 | 2006-05-16 |
Sputtering target and process for producing the same
App 20060099126 - Hosono; Hideo ; et al. | 2006-05-11 |
Ge-cr alloy sputtering target and process for producing the same
App 20060086610 - Takami; Hideo ; et al. | 2006-04-27 |
Electroconductive oxide sintered compact, sputtering target comprising the sintered compact and methods for producing them
App 20060071197 - Suzuki; Ryo | 2006-04-06 |
Iron silicide sputtering target and method for production thereof
App 20060057014 - Oda; Kunihiro ; et al. | 2006-03-16 |
Copper electrolytic solution containing amine compound having specific skeleton and organosulfur compound as additives, and electrolytic copper foil produced using the same
Grant 7,005,055 - Kumagai , et al. February 28, 2 | 2006-02-28 |
Nickel alloy sputtering target
App 20060037680 - Yamakoshi; Yasuhiro | 2006-02-23 |
CdTe-base compound semiconductor single crystal for electro-optic element
Grant 7,002,230 - Hirano , et al. February 21, 2 | 2006-02-21 |
Process for producing single crystal of compound semiconductor and crystal growing apparatus
Grant 6,989,059 - Asahi , et al. January 24, 2 | 2006-01-24 |
Hafnium silicide target and manufacturing method for preparation thereof
Grant 6,986,834 - Irumata , et al. January 17, 2 | 2006-01-17 |
Iron silicide powder and method for production thereof
App 20060002838 - Oda; Kunihiro ; et al. | 2006-01-05 |
Copper alloy sputtering target and semiconductor element wiring
App 20050285273 - Okabe, Takeo ; et al. | 2005-12-29 |
Iron-based sintered compact and method for production thereof
App 20050271540 - Yahagi, Masataka ; et al. | 2005-12-08 |
Ta sputtering target and method for preparation thereof
App 20050268999 - Oda, Kunihiro | 2005-12-08 |
Copper electrolytic solution containing amine compound having specific skeleton and organosulfur compound as additives, and electrolytic copper foil produced using the same
App 20050252778 - Kumagai, Masashi ; et al. | 2005-11-17 |
Carrier-attached copper foil and printed board using the copper foil
Grant 6,960,391 - Natsume , et al. November 1, 2 | 2005-11-01 |
High purity copper sulfate and method for production thereof
App 20050232849 - Shindo, Yuichiro ; et al. | 2005-10-20 |
II-VI compound semiconductor crystal and photoelectric conversion device
App 20050189553 - Kishino, Katsumi ; et al. | 2005-09-01 |
II-VI compound semiconductor crystal
Grant 6,933,519 - Kishino , et al. August 23, 2 | 2005-08-23 |
Manufacturing method of ito powder with tin dissolved in indium oxide, and manufacturing method of ito target
Grant 6,929,772 - Yanai , et al. August 16, 2 | 2005-08-16 |
Water-based metal surface treatment agent
Grant 6,921,577 - Ouchi , et al. July 26, 2 | 2005-07-26 |
Organic carboxylic acid salt composition, process for preparation thereof and additives for epoxy resins
Grant 6,916,865 - Kumagai , et al. July 12, 2 | 2005-07-12 |
Production method for compound semiconductor single crystal
App 20050118739 - Asahi, Toshiaki ; et al. | 2005-06-02 |
Chamfered semiconductor wafer and method of manufacturing the same
Grant 6,900,522 - Kurita , et al. May 31, 2 | 2005-05-31 |
Method of producing a higher-purity metal
Grant 6,896,788 - Shindo , et al. May 24, 2 | 2005-05-24 |
Sputtering target producing few particles
Grant 6,875,325 - Miyashita , et al. April 5, 2 | 2005-04-05 |
Method for preparing GaN based compound semiconductor crystal
Grant 6,875,272 - Kainosho , et al. April 5, 2 | 2005-04-05 |
Method of manufacturing high purity zirconium and hafnium
Grant 6,861,030 - Shindo March 1, 2 | 2005-03-01 |
Sputtering target producing few particles, backing plate or sputtering apparatus and sputtering method producing few particles
Grant 6,858,116 - Okabe , et al. February 22, 2 | 2005-02-22 |
MoSi2 arc-shaped heater, and method and device for manufacturing the heater
Grant 6,844,532 - Takamura , et al. January 18, 2 | 2005-01-18 |
Oxide sintered body and manufacturing method thereof
Grant 6,843,975 - Suzuki January 18, 2 | 2005-01-18 |
Surface treatment for copper foil
Grant 6,835,241 - Tsuchida , et al. December 28, 2 | 2004-12-28 |
Copper clad laminate
Grant 6,833,198 - Sakamoto , et al. December 21, 2 | 2004-12-21 |
Adhesion accelerator for bonding rubber to metal and rubber composition
Grant 6,809,138 - Imori , et al. October 26, 2 | 2004-10-26 |
Metal plating method, pretreatment agent, and semiconductor wafer and semiconductor device obtained using these
App 20040182714 - Imori, Toru ; et al. | 2004-09-23 |
Diffusion-joined target assemly of high-purity cobalt target and copper alloy backing plate and production method therefor
Grant 6,793,124 - Takahashi , et al. September 21, 2 | 2004-09-21 |
Plating pretreatment agent and metal plating method using the same
Grant 6,780,467 - Imori August 24, 2 | 2004-08-24 |
Tantalum or tungsten target-copper alloy backing plate assembly and production method therefor
Grant 6,759,143 - Oda , et al. July 6, 2 | 2004-07-06 |
Titanium target for sputtering
Grant 6,755,948 - Fukuyo , et al. June 29, 2 | 2004-06-29 |
Product management system, and host computer and recorded medium used in the system
Grant 6,745,092 - Nakajima , et al. June 1, 2 | 2004-06-01 |
Silicide target for depositing less embrittling gate oxide and method of manufacturing silicide target
Grant 6,723,183 - Oda , et al. April 20, 2 | 2004-04-20 |
Imidazole/organic monocarboxylic acid salt derivative reaction product, method for producing the same, and surface treatment agent, resin additive and resin composition using the same
Grant 6,710,181 - Kumagai , et al. March 23, 2 | 2004-03-23 |
Copper foil excellent in laser beam drilling performance and production method therefor
Grant 6,638,642 - Kitano , et al. October 28, 2 | 2003-10-28 |
Metal surface treatment agent, and metal material coated with same
Grant 6,605,356 - Ouchi , et al. August 12, 2 | 2003-08-12 |
Copper electroplating liquid, pretreatment liquid for copper electroplating and method of copper electroplating
Grant 6,562,222 - Sekiguchi , et al. May 13, 2 | 2003-05-13 |
Optical transparent film and sputtering target for forming optical transparent film
Grant 6,528,442 - Kuwano , et al. March 4, 2 | 2003-03-04 |
Cathode material for a lithium secondary battery and method for manufacturing same
Grant 6,497,854 - Kohiro , et al. December 24, 2 | 2002-12-24 |
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