Nikawa; Kiyoshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Nikawa; Kiyoshi.The latest application filed is for "method and apparatus for inspection and fault analysis".

Company Profile

0.16.11

Nikawa; Kiyoshi - Kanagawa JP
Nikawa; Kiyoshi - Kawasaki JP
Nikawa; Kiyoshi - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method and apparatus for inspection and fault analysis Grant 8,090,191 - Nikawa January 3, 2	2012-01-03
Failure analysis method and failure analysis apparatus Grant 7,825,673 - Nikawa November 2, 2	2010-11-02
Non-destructive testing apparatus and non-destructive testing method Grant 7,495,449 - Nikawa February 24, 2	2009-02-24
Non-destructive testing apparatus and non-destructive testing method Grant 7,484,883 - Nikawa February 3, 2	2009-02-03
Failure Analysis Method And Failure Analysis Apparatus App 20090002000 - Nikawa; Kiyoshi	2009-01-01
Method And Apparatus For Inspection And Fault Analysis App 20090003685 - NIKAWA; Kiyoshi	2009-01-01
Inspection method and apparatus using scanning laser SQUID microscope Grant 7,250,758 - Nikawa July 31, 2	2007-07-31
Inspection Method And Apparatus Using Scanning Laser Squid Microscope App 20070152664 - Nikawa; Kiyoshi	2007-07-05
Non-destructive testing apparatus and non-destructive testing method App 20070115003 - Nikawa; Kiyoshi	2007-05-24
Inspection method and device for semiconductor equipment App 20070103151 - Nikawa; Kiyoshi	2007-05-10
Method and apparatus for diagnosing fault in semiconductor device Grant 7,173,447 - Yamashita , et al. February 6, 2	2007-02-06
Non-destructive testing apparatus and non-destructive testing method App 20060280222 - Nikawa; Kiyoshi	2006-12-14
Method and apparatus for diagnosing fault in semiconductor device App 20060006886 - Yamashita; Masatsugu ; et al.	2006-01-12
Nondestructive and noncontact analysis system App 20050140367 - Nikawa, Kiyoshi	2005-06-30
Device and method for nondestructive inspection on semiconductor device Grant 6,759,259 - Nikawa July 6, 2	2004-07-06
Device and method for nondestructive inspection on semiconductor device Grant 6,610,918 - Nikawa August 26, 2	2003-08-26
Device and method for nondestructive inspection on semiconductor device Grant 6,444,895 - Nikawa September 3, 2	2002-09-03
Device and method for nondestructive inspection on semiconductor device App 20020106820 - Nikawa, Kiyoshi	2002-08-08
Device and method for nondestructive inspection on semiconductor device App 20020105577 - Nikawa, Kiyoshi	2002-08-08
Non-destructive inspection method App 20020052055 - Nikawa, Kiyoshi	2002-05-02
Parasitic MIM structural spot analysis method for semiconductor device and parasitic MIM structure spot analysis method for silicon semiconductor device Grant 6,320,396 - Nikawa November 20, 2	2001-11-20
Inspection method and wiring current observation method for semiconductor device and apparatus of the same Grant 6,160,407 - Nikawa December 12, 2	2000-12-12
Inspection method and wiring current observation method for semiconductor device Grant 6,066,956 - Nikawa May 23, 2	2000-05-23
Semiconductor device evaluation system using optical fiber Grant 6,028,435 - Nikawa February 22, 2	2000-02-22
Method and system for testing an interconnection in a semiconductor integrated circuit Grant 5,804,980 - Nikawa September 8, 1	1998-09-08
Apparatus for diagnosing interconnections of semiconductor integrated circuits Grant 5,422,498 - Nikawa , et al. June 6, 1	1995-06-06
Semiconductor device having improved structure of multi-wiring layers Grant 4,734,754 - Nikawa March 29, 1	1988-03-29

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