loadpatents
name:-0.011010885238647
name:-0.0083818435668945
name:-0.00040006637573242
NIKAIDO; Shinichi Patent Filings

NIKAIDO; Shinichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for NIKAIDO; Shinichi.The latest application filed is for "partially multilayered wiring board and method of manufacturing partially multilayered wiring board".

Company Profile
0.8.8
  • NIKAIDO; Shinichi - Sakura-shi JP
  • Nikaido; Shinichi - Sakura JP
  • Nikaido; Shinichi - Chiba JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Partially Multilayered Wiring Board And Method Of Manufacturing Partially Multilayered Wiring Board
App 20120222887 - NIKAIDO; Shinichi ;   et al.
2012-09-06
Socket contact terminal and semiconductor device
Grant 8,177,561 - Ouchi , et al. May 15, 2
2012-05-15
Socket, method for manufacturing socket, and semiconductor device
Grant 8,137,113 - Ouchi , et al. March 20, 2
2012-03-20
Connector and electronic component provided with same
Grant 8,109,768 - Nikaido , et al. February 7, 2
2012-02-07
Double-sided connector with protrusions
Grant 7,887,336 - Nikaido , et al. February 15, 2
2011-02-15
IC socket and manufacturing method for the same
Grant 7,748,991 - Nikaido , et al. July 6, 2
2010-07-06
Double-sided Connector
App 20100081342 - NIKAIDO; Shinichi ;   et al.
2010-04-01
Connector And Electronic Component Provided With Same
App 20100025096 - Nikaido; Shinichi ;   et al.
2010-02-04
Connection configuration for rigid substrates
Grant 7,642,466 - Nikaido , et al. January 5, 2
2010-01-05
IC socket and IC package mounting device
Grant 7,635,268 - Nikaido , et al. December 22, 2
2009-12-22
Socket Contact Terminal And Semiconductor Device
App 20090250256 - Ouchi; Yasuhiro ;   et al.
2009-10-08
Socket, Method For Manufacturing Socket, And Semiconductor Device
App 20090197437 - Ouchi; Yasuhiro ;   et al.
2009-08-06
Hybrid sensor including electrostatic capacitance sensor
Grant 7,337,681 - Nikaido , et al. March 4, 2
2008-03-04
Ic Socket And Ic Package Mounting Device
App 20080032521 - NIKAIDO; Shinichi ;   et al.
2008-02-07
Ic Socket And Manufacturing Method For The Same
App 20080020624 - NIKAIDO; Shinichi ;   et al.
2008-01-24
Hybrid sensor including electrostatic capacitance sensor
App 20050257628 - Nikaido, Shinichi ;   et al.
2005-11-24

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.

© 2024 USPTO.report | Privacy Policy | Resources | RSS Feed of Trademarks | Trademark Filings Twitter Feed