Niimi; Akihiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Niimi; Akihiro.The latest application filed is for "semiconductor device".

Company Profile

0.7.7

Niimi; Akihiro - Nagoya N/A JP
Niimi; Akihiro - Nagoya-city JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device with heat spreaders Grant 8,421,235 - Ide , et al. April 16, 2	2013-04-16
Semiconductor Device App 20120001341 - Ide; Shigeo ; et al.	2012-01-05
Metallic electrode forming method and semiconductor device having metallic electrode Grant 7,910,460 - Tomisaka , et al. March 22, 2	2011-03-22
Metallic electrode forming method and semiconductor device having metallic electrode App 20100311191 - Tomisaka; Manabu ; et al.	2010-12-09
Metallic electrode forming method and semiconductor device having metallic electrode Grant 7,800,232 - Tomisaka , et al. September 21, 2	2010-09-21
Method for manufacturing mold type semiconductor device Grant 7,468,318 - Hirano , et al. December 23, 2	2008-12-23
Metallic electrode forming method and semiconductor device having metallic electrode App 20080217771 - Tomisaka; Manabu ; et al.	2008-09-11
Method for manufacturing mold type semiconductor device App 20070158850 - Hirano; Naohiko ; et al.	2007-07-12
Mold type semiconductor device Grant 7,193,326 - Hirano , et al. March 20, 2	2007-03-20
Package type semiconductor device Grant 7,009,292 - Miura , et al. March 7, 2	2006-03-07
Method of manufacturing a semiconductor device including electrodes on main and reverse sides of a semiconductor chip App 20050170555 - Hirano, Naohiko ; et al.	2005-08-04
Package type semiconductor device App 20050077599 - Miura, Shoji ; et al.	2005-04-14
Mold type semiconductor device and method for manufacturing the same App 20040256730 - Hirano, Naohiko ; et al.	2004-12-23

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