Niekawa; Jun
Patent Applications and Registrations
Patent applications and USPTO patent grants for Niekawa; Jun.The latest application filed is for "wick, plate type heat pipe and container".
- Niekawa; Jun - Tokyo JP
- Niekawa, Jun - Yokohama-shi JP
| Patent | Date |
|---|---|
| Plate type heat pipe Grant 6,745,825 - Nakamura , et al. June 8, 2 | 2004-06-08 |
| Wick, plate type heat pipe and container App 20040011512 - Noda, Hajime ; et al. | 2004-01-22 |
| Semiconductor laser device and semiconductor laser module using the same Grant 6,567,447 - Yoshida , et al. May 20, 2 | 2003-05-20 |
| Wick, plate type heat pipe and container App 20020189793 - Noda, Hajime ; et al. | 2002-12-19 |
| Cooling system for electronic device Grant 6,487,074 - Kimura , et al. November 26, 2 | 2002-11-26 |
| Thermal transfer device and working fluid therefor including a kinetic ice inhibitor App 20020144804 - Liang, Yue ; et al. | 2002-10-10 |
| Electronic equipment housing Grant 6,400,571 - Kimura , et al. June 4, 2 | 2002-06-04 |
| Flat type heat pipe Grant 6,397,935 - Yamamoto , et al. June 4, 2 | 2002-06-04 |
| Flat type heat pipe App 20020056542 - Yamamoto, Masaaki ; et al. | 2002-05-16 |
| Cooling device with heat pipe Grant 6,269,866 - Yamamoto , et al. August 7, 2 | 2001-08-07 |
| Heat sink Grant 6,085,833 - Kimura , et al. July 11, 2 | 2000-07-11 |
| Cooling device with heat pipe Grant 6,082,443 - Yamamoto , et al. July 4, 2 | 2000-07-04 |
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