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Patent applications and USPTO patent grants for Nie; Heng Yong.The latest application filed is for "method for producing hyperthermal hydrogen molecules and using same for selectively breaking c-h and/or si-h bonds of molecules at or on substrate surfaces".
Patent | Date |
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Method for producing hyperthermal hydrogen molecules and using same for selectively breaking C--H and/or Si--H bonds of molecules at or on substrate surfaces Grant 9,113,544 - Lau , et al. August 18, 2 | 2015-08-18 |
Method for fabrication of layered heterojunction polymeric devices Grant 8,648,336 - Lau , et al. February 11, 2 | 2014-02-11 |
METHOD FOR PRODUCING HYPERTHERMAL HYDROGEN MOLECULES AND USING SAME FOR SELECTIVELY BREAKING C-H AND/OR Si-H BONDS OF MOLECULES AT OR ON SUBSTRATE SURFACES App 20120061558 - Lau; Leo W.M. ;   et al. | 2012-03-15 |
Method For Fabrication Of Layered Heterojunction Polymeric Devices App 20120056167 - Lau; Leo W.M. ;   et al. | 2012-03-08 |
Method of Controllable Morphology of Self-Assembled Monolayers on Substrates App 20080075885 - Nie; Heng-Yong ;   et al. | 2008-03-27 |
Method of selective removal of organophosphonic acid molecules from their self-assembled monolayer on Si substrates App 20070212808 - Nie; Heng-Yong ;   et al. | 2007-09-13 |
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