NIE; Bai

Patent Applications and Registrations

Patent applications and USPTO patent grants for NIE; Bai.The latest application filed is for "embedded bridge architecture with thinned surface".

Company Profile

7.3.14

NIE; Bai - Chandler AZ
Nie; Bai - Lansing MI US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Embedded Bridge Architecture With Thinned Surface App 20220310518 - CHEN; Haobo ; et al.	2022-09-29
Lithographic Cavity Formation To Enable Emib Bump Pitch Scaling App 20220223527 - DARMAWIKARTA; Kristof ; et al.	2022-07-14
Waveguide With Self-aligned Mirror In Package For Long Range Chip-to-chip Communications App 20220196914 - ECTON; Jeremy D. ; et al.	2022-06-23
High Bandwidth Optical Interconnection Architectures App 20220155539 - PIETAMBARAM; Srinivas V. ; et al.	2022-05-19
Lithographic cavity formation to enable EMIB bump pitch scaling Grant 11,322,444 - Darmawikarta , et al. May 3, 2	2022-05-03
Microelectronic Structures Including Bridges App 20210391263 - Nie; Bai ; et al.	2021-12-16
Microelectronic Structures Including Bridges App 20210391264 - Nie; Bai ; et al.	2021-12-16
Microelectronic Structures Including Bridges App 20210391266 - Gamba; Jason M. ; et al.	2021-12-16
Embedded Patch For Local Material Property Modulation App 20210028101 - NIE; Bai ; et al.	2021-01-28
Patternable Die Attach Materials And Processes For Patterning App 20200312771 - NIE; Bai ; et al.	2020-10-01
Hybrid Fine Line Spacing Architecture For Bump Pitch Scaling App 20200312665 - NAD; Suddhasattwa ; et al.	2020-10-01
Laser Planarization With In-situ Surface Topography Control And Method Of Planarization App 20200078884 - Nie; Bai ; et al.	2020-03-12
Structures Within A Substrate Layer To Cure Magnetic Paste App 20200005990 - PAITAL; Sameer ; et al.	2020-01-02
Lithographic Cavity Formation To Enable Emib Bump Pitch Scaling App 20190295951 - DARMAWIKARTA; Kristof ; et al.	2019-09-26
Substrate With Variable Height Conductive And Dielectric Elements App 20190206781 - ALEKSOV; Aleksandar ; et al.	2019-07-04
Ultrafast laser apparatus Grant 9,048,632 - Dantus , et al. June 2, 2	2015-06-02

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