Trademark applications and grants for Nickerson Robert. Nickerson Robert has 1 trademark applications. The latest application filed is for "P2E2"
Patent Application | Date |
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ULTRA-THIN, HYPER-DENSITY SEMICONDUCTOR PACKAGES 20200273784 - 16/646529 MALLIK; Debendra ;   et al. | 2020-08-27 |
OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-ON-PACKAGE STRUCTURES 20200251462 - Kind Code | 2020-08-06 |
MICRO-TRENCHING MOLD INTERFACE IN A POP PACKAGE 20200035658 - 16/049696 SINGH; Kumar Abhishek ;   et al. | 2020-01-30 |
SUBSTRATE ARCHITECTURE FOR SOLDER JOINT RELIABILTY IN MICROELECTRONIC PACKAGE STRUCTURES AND METHODS OF FORMING THE SAME 20190104610 - 15/720488 Nickerson; Robert ;   et al. | 2019-04-04 |
METHODS OF FORMING TRENCHES IN PACKAGES STRUCTURES AND STRUCTURES FORMED THEREBY 20160381800 - 14/748496 Yagnamurthy; Naga Sivakumar ;   et al. | 2016-12-29 |
Ultra-thin, hyper-density semiconductor packages 11,430,724 - 16/646,529 Mallik , et al. August 30, 2 | 2022-08-30 |
Methods of forming trenches in packages structures and structures formed thereby 10,231,338 - 14/748,496 Yagnamurthy , et al. | 2019-03-12 |
Methods for solder for through-mold interconnect 9,666,549 - 14/879,418 Chiu , et al. May 30, 2 | 2017-05-30 |
Gasifying system and method 9,446,975 - 13/657,263 Nickerson , et al. September 20, 2 | 2016-09-20 |
Screw conveyer system 9,290,330 - 14/265,033 Nickerson , et al. March 22, 2 | 2016-03-22 |
Mark Image Registration | Serial | Trademark Application Date |
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![]() "P2E2" 87306289 |
P2E2 2017-01-18 |
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