| Patent | Date |
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Die bond pad design to enable different electrical configurations
Grant 10,490,719 - Yu , et al. Nov | 2019-11-26 |
Die Bond Pad Design To Enable Different Electrical Configurations
App 20180337315 - YU; Wen ; et al. | 2018-11-22 |
Gap-filling with uniform properties
Grant 8,415,256 - Nickel , et al. April 9, 2 | 2013-04-09 |
Methods for forming a memory cell having a top oxide spacer
Grant 8,384,146 - Fang , et al. February 26, 2 | 2013-02-26 |
SiH.sub.4 soak for low hydrogen SiN deposition to improve flash memory device performance
Grant 8,309,455 - Kim , et al. November 13, 2 | 2012-11-13 |
Methods For Forming A Memory Cell Having A Top Oxide Spacer
App 20120181601 - FANG; Shenqing ; et al. | 2012-07-19 |
Methods for forming a memory cell having a top oxide spacer
Grant 8,202,779 - Fang , et al. June 19, 2 | 2012-06-19 |
SiH4 SOAK FOR LOW HYDROGEN SIN DEPOSITION TO IMPROVE FLASH MEMORY DEVICE PERFORMANCE
App 20110266609 - KIM; Sung Jin ; et al. | 2011-11-03 |
Self-aligned patterning method by using non-conformal film and etch for flash memory and other semiconductor applications
Grant 8,035,153 - Fang , et al. October 11, 2 | 2011-10-11 |
Methods For Forming A Memory Cell Having A Top Oxide Spacer
App 20110233647 - FANG; Shenqing ; et al. | 2011-09-29 |
Cu annealing for improved data retention in flash memory devices
Grant 8,026,169 - You , et al. September 27, 2 | 2011-09-27 |
Fastening device for a line
Grant 8,017,870 - Kawakami , et al. September 13, 2 | 2011-09-13 |
SiH.sub.4 soak for low hydrogen SiN deposition to improve flash memory device performance
Grant 7,985,674 - Kim , et al. July 26, 2 | 2011-07-26 |
Gap-filling with uniform properties
Grant 7,884,030 - Nickel , et al. February 8, 2 | 2011-02-08 |
Self-aligned Patterning Method By Using Non-conformal Film And Etch For Flash Memory And Other Semiconductor Applications
App 20100230743 - Fang; Shenqing ; et al. | 2010-09-16 |
Ordered porosity to direct memory element formation
Grant 7,776,682 - Nickel , et al. August 17, 2 | 2010-08-17 |
Self-aligned patterning method by using non-conformal film and etch back for flash memory and other semiconductor applications
Grant 7,732,276 - Fang , et al. June 8, 2 | 2010-06-08 |
SiH4 soak for low hydrogen SiN deposition to improve flash memory device performance
App 20100109067 - Kim; Sung Jin ; et al. | 2010-05-06 |
Fastening Device For A Line
App 20090242235 - Kawakami; Keiji ; et al. | 2009-10-01 |
Semiconductor devices with copper interconnects and composite silicon nitride capping layers
Grant 7,534,732 - Ngo , et al. May 19, 2 | 2009-05-19 |
Self-aligned patterning method by using non-conformal film and etch back for flash memory and other semiconductor applications
App 20080265301 - Fang; Shenqing ; et al. | 2008-10-30 |
Flash Memory Devices And Methods For Fabricating The Same
App 20080153236 - Cheng; Ning ; et al. | 2008-06-26 |
Cu annealing for improved data retention in flash memory devices
App 20080108193 - You; Lu ; et al. | 2008-05-08 |
Conformal liner for gap-filling
App 20080096364 - Wilson; Erik ; et al. | 2008-04-24 |
Void free interlayer dielectric
Grant 7,307,027 - Ngo , et al. December 11, 2 | 2007-12-11 |
Memory elements using organic active layer
Grant 7,102,156 - Kingsborough , et al. September 5, 2 | 2006-09-05 |
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