Nicholls; Louis W.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Nicholls; Louis W..The latest application filed is for "fine pitch copper pillar package and method".

Company Profile

4.14.5

Nicholls; Louis W. - Gilbert AZ
Nicholls; Louis W. - Durham NC

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Fine Pitch Copper Pillar Package And Method App 20220189866 - Darveaux; Robert Francis ; et al.	2022-06-16
Semiconductor devices and methods of manufacturing semiconductor devices Grant 11,362,027 - St. Amand , et al. June 14, 2	2022-06-14
Semiconductor Devices And Methods Of Manufacturing Semiconductor Devices App 20210272887 - St. Amand; Roger D. ; et al.	2021-09-02
Fine pitch copper pillar package and method Grant 11,088,064 - Darveaux , et al. August 10, 2	2021-08-10
Methods And Structures For Increasing The Allowable Die Size In Tmv Packages App 20210166992 - Nicholls; Louis W. ; et al.	2021-06-03
Semiconductor devices and methods of making semiconductor devices Grant 10,714,408 - Nicholls , et al.	2020-07-14
Fine Pitch Copper Pillar Package And Method App 20200219802 - Darveaux; Robert Francis ; et al.	2020-07-09
Methods And Structures For Increasing The Allowable Die Size In Tmv Packages App 20190371706 - Nicholls; Louis W. ; et al.	2019-12-05
Fine pitch copper pillar package and method Grant 10,418,318 - Darveaux , et al. Sept	2019-09-17
Methods and structures for increasing the allowable die size in TMV packages Grant 10,347,562 - Nicholls , et al. July 9, 2	2019-07-09
Fine pitch copper pillar package and method Grant 10,224,270 - Darveaux , et al.	2019-03-05
Methods and structures for increasing the allowable die size in TMV packages Grant 9,721,872 - Nicholls , et al. August 1, 2	2017-08-01
Fine pitch copper pillar package and method Grant 9,462,690 - Darveaux , et al. October 4, 2	2016-10-04
Fine pitch copper pillar package and method Grant 8,536,458 - Darveaux , et al. September 17, 2	2013-09-17
Method and apparatus for controlling plating thickness of a workpiece Grant 5,788,829 - Joshi , et al. August 4, 1	1998-08-04
Method and apparatus using an anode basket for electroplating a workpiece Grant 5,776,327 - Botts , et al. July 7, 1	1998-07-07
Anode basket for controlling plating thickness distribution Grant 5,744,013 - Botts , et al. April 28, 1	1998-04-28

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