| Patent | Date |
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Electrochemical Plating System And Method Of Using
App 20220042197 - Nian; Jun-Nan ; et al. | 2022-02-10 |
Electrochemical plating system and method of using
Grant 11,230,784 - Nian , et al. January 25, 2 | 2022-01-25 |
N-work function metal with crystal structure
Grant 11,133,395 - Hung , et al. September 28, 2 | 2021-09-28 |
Method For Controlling Electrochemical Deposition To Avoid Defects In Inerconnect Structures
App 20210238765 - NIAN; Jun-Nan ; et al. | 2021-08-05 |
Method for controlling electrochemical deposition to avoid defects in interconnect structures
Grant 11,015,260 - Nian , et al. May 25, 2 | 2021-05-25 |
Method of electroplating metal into recessed feature and electroplating layer in recessed feature
Grant 10,879,629 - Nian , et al. December 29, 2 | 2020-12-29 |
Formation of copper layer structure with self anneal strain improvement
Grant 10,840,184 - Nian , et al. November 17, 2 | 2020-11-17 |
Method of electroplating metal into recessed feature and electroplating layer in recessed feature
Grant 10,749,278 - Nian , et al. A | 2020-08-18 |
Method For Controlling Electrochemical Deposition To Avoid Defects In Inerconnect Structures
App 20200176310 - Nian; Jun-Nan ; et al. | 2020-06-04 |
Electrochemical Plating System And Method Of Using
App 20200173051 - Nian; Jun-Nan ; et al. | 2020-06-04 |
N-work Function Metal with Crystal Structure
App 20190252512 - Hung; Chi-Cheng ; et al. | 2019-08-15 |
N-work function metal with crystal structure
Grant 10,269,918 - Hung , et al. | 2019-04-23 |
Method Of Electroplating Metal Into Recessed Feature And Electroplating Layer In Recessed Feature
App 20190109389 - NIAN; Jun-Nan ; et al. | 2019-04-11 |
Formation Of Copper Layer Structure With Self Anneal Strain Improvement
App 20180138128 - NIAN; Jun-Nan ; et al. | 2018-05-17 |
Formation of copper layer structure with self anneal strain improvement
Grant 9,870,995 - Nian , et al. January 16, 2 | 2018-01-16 |
N-Work Function Metal with Crystal Structure
App 20170301768 - Hung; Chi-Cheng ; et al. | 2017-10-19 |
Method Of Electroplating Metal Into Recessed Feature And Electroplating Layer In Recessed Feature
App 20170204529 - NIAN; Jun-Nan ; et al. | 2017-07-20 |
N-work function metal with crystal structure
Grant 9,698,019 - Hung , et al. July 4, 2 | 2017-07-04 |
Formation Of Copper Layer Structure With Self Anneal Strain Improvement
App 20160372421 - NIAN; Jun-Nan ; et al. | 2016-12-22 |
N-work Function Metal With Crystal Structure
App 20150262822 - Hung; Chi-Cheng ; et al. | 2015-09-17 |
Image sensor cross-talk reduction system and method
Grant 8,759,928 - Chang , et al. June 24, 2 | 2014-06-24 |
Semiconductor device and method of formation
Grant 8,642,439 - Nian , et al. February 4, 2 | 2014-02-04 |
HfO.sub.2/SiO.sub.2-Si interface improvement for CMOS image sensor
Grant 8,610,230 - Nian , et al. December 17, 2 | 2013-12-17 |
Image Sensor Cross-Talk Reduction System and Method
App 20130264668 - Chang; Shih-Chieh ; et al. | 2013-10-10 |
Semiconductor Device and Method of Formation
App 20130264615 - Nian; Jun-Nan ; et al. | 2013-10-10 |
Semiconductor Device and Method of Formation
App 20130126950 - Nian; Jun-Nan ; et al. | 2013-05-23 |
Semiconductor device and method of formation
Grant 8,435,893 - Nian , et al. May 7, 2 | 2013-05-07 |
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