NI; CUO-YO
Patent Applications and Registrations
Patent applications and USPTO patent grants for NI; CUO-YO.The latest application filed is for "apparatus and method for quantifying the amount of evaporation deposition of a solid substance".
- NI; CUO-YO - TAOYUAN CITY TW
- Ni; Cuo-Yo - Taoyuan TW
- NI; CUO-YO - LONGTAN TOWNSHIP TW
| Patent | Date |
|---|---|
| Apparatus And Method For Quantifying The Amount Of Evaporation Deposition Of A Solid Substance App 20180148828 - CHUNG; TE-JU ; et al. | 2018-05-31 |
| Linear evaporation apparatus for improving uniformity of thin films and utilization of evaporation materials Grant 9,783,881 - Liang , et al. October 10, 2 | 2017-10-10 |
| Method and apparatus for stably evaporation depositing uniform thin films Grant 9,574,264 - Liang , et al. February 21, 2 | 2017-02-21 |
| Apparatus For Stably Evaporation Depositing Uniform Thin Films App 20160312355 - LIANG; SHIH-CHANG ; et al. | 2016-10-27 |
| High-conductivity Thin-film Structure For Reducing Metal Contact Resistance App 20160155904 - LIANG; SHIH-CHANG ; et al. | 2016-06-02 |
| Method And Apparatus For Stably Evaporation Depositing Uniform Thin Films App 20160097117 - LIANG; SHIH-CHANG ; et al. | 2016-04-07 |
| Linear Evaporation Apparatus For Improving Uniformity Of Thin Films And Utilization Of Evaporation Materials App 20160047033 - LIANG; SHIH-CHANG ; et al. | 2016-02-18 |
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