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Fluorine-free interface for semiconductor device performance gain
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Semiconductor Arrangement And Method Of Making
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Semiconductor Structures Having A Micro-Battery and Methods for Making the Same
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Semiconductor structures having a micro-battery and methods for making the same
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Target Measurement Device And Method For Measuring A Target
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Semiconductor Fabrication Apparatus
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Wafer Bonding Method And Wafer Bonding Apparatus
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Bonding alignment tool
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Deep trench capacitor with scallop profile
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Bonding Alignment Tool
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Semiconductor Structures Having a Micro-Battery and Methods for Making the Same
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Bonding alignment tool
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Semiconductor structures having a micro-battery and methods for making the same
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Deep Trench Capacitor With Scallop Profile
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Methods of fabricating micro electro mechanical system structures
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Deep Trench Capacitor With Scallop Profile
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Method and apparatus for a seal ring structure
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Semiconductor structure and fabricating process for the same
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Image-sensor device structure and method of manufacturing
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Method and Apparatus for a Seal Ring Structure
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Semiconductor apparatus
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Semiconductor Structures Having a Micro-Battery and Methods for Making the Same
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Method and apparatus for a seal ring structure
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Systems and method for transferring a semiconductor substrate
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Semiconductor structures having a micro-battery and methods for making the same
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Methods Of Fabricating Micro Electro Mechanical System Structures
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Bonding Alignment Tool
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Micro electro mechanical system structures
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Bonding alignment tool and method
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Image-sensor Device Structure And Method Of Manufacturing
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Systems And Method For Transferring A Semiconductor Substrate
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Method and Apparatus for a Seal Ring Structure
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Semiconductor Structure And Fabricating Process For The Same
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Semiconductor Structures Having a Micro-Battery and Methods for Making the Same
App 20140199597 - Ni; Chyi-Tsong ; et al. | 2014-07-17 |
Method of fabrication of a semiconductor apparatus comprising substrates including Al/Ge and Cu contact layers to form a metallic alloy
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Passivation layer for semiconductor devices
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Micro Electro Mechanical System Structures
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Semiconductor Apparatus
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Bonding Alignment Tool And Method
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Semiconductor apparatus including a metal alloy between a first contact and a second contact
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Semiconductor Apparatus
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Semiconductor Apparatus
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Passivation Layer For Semiconductor Devices
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Low temperature method for minimizing copper hillock defects
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Method of smoothening dielectric layer
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Methods of spin-on wafer cleaning
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Low temperature method for minimizing copper hillock defects
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Metallization target optimization method providing enhanced metallization layer uniformity
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Methods of spin-on wafer cleaning
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Method of smoothening dielectric layer
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Solution for FSG induced metal corrosion & metal peeling defects with extra bias liner and smooth RF bias ramp up
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Solution for FSG induced metal corrosion & metal peeling defects with extra bias liner and smooth RF bias ramp up
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Method to produce porous oxide including forming a precoating oxide and a thermal oxide
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High crack resistance nitride process
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Method of fabricating A1N anti-reflection coating on metal layer
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