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Patent applications and USPTO patent grants for Nguyen; Vietha.The latest application filed is for "methods of forming micropatterns and substrate processing apparatus".
Patent | Date |
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Methods of forming micropatterns and substrate processing apparatus Grant 10,916,437 - Jang , et al. February 9, 2 | 2021-02-09 |
Methods of Forming Micropatterns and Substrate Processing Apparatus App 20190198342 - JANG; SANG-SHIN ;   et al. | 2019-06-27 |
Semiconductor devices and methods of manufacturing the same Grant 10,304,734 - You , et al. | 2019-05-28 |
Method of manufacturing semiconductor device using a plurality of etch stop layers Grant 10,192,782 - Lee , et al. Ja | 2019-01-29 |
Planarized interlayer dielectric with air gap isolation Grant 10,186,485 - Nguyen , et al. Ja | 2019-01-22 |
Semiconductor Devices And Methods Of Manufacturing The Same App 20180330987 - YOU; WOO KYUNG ;   et al. | 2018-11-15 |
Semiconductor device including air-gap Grant 10,090,381 - Baek , et al. October 2, 2 | 2018-10-02 |
Semiconductor devices and methods of manufacturing the same Grant 10,062,609 - You , et al. August 28, 2 | 2018-08-28 |
Planarized Interlayer Dielectric With Air Gap Isolation App 20180174977 - Nguyen; VietHa ;   et al. | 2018-06-21 |
Semiconductor devices Grant 9,972,528 - Nguyen , et al. May 15, 2 | 2018-05-15 |
Planarized interlayer dielectric with air gap isolation Grant 9,929,099 - Nguyen , et al. March 27, 2 | 2018-03-27 |
Semiconductor Device Including Air-gap App 20180083099 - BAEK; JONGMIN ;   et al. | 2018-03-22 |
Semiconductor Devices And Methods Of Manufacturing The Same App 20180033691 - You; Woo Kyung ;   et al. | 2018-02-01 |
Semiconductor Devices App 20170178949 - Nguyen; VietHa ;   et al. | 2017-06-22 |
Planarized Interlayer Dielectric With Air Gap Isolation App 20170170184 - Nguyen; VietHa ;   et al. | 2017-06-15 |
Method Of Manufacturing Semiconductor Device Using A Plurality Of Etch Stop Layers App 20160133512 - LEE; Woojin ;   et al. | 2016-05-12 |
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