Nguyen; Phuc M.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Nguyen; Phuc M..The latest application filed is for "semiconductor package with embedded capacitor and methods of manufacturing same".
- Nguyen; Phuc M. - Austin TX
| Patent | Date |
|---|---|
| Semiconductor manufacturing using disposable test circuitry within scribe lanes Grant 10,553,508 - Reber , et al. Fe | 2020-02-04 |
| Semiconductor package with embedded capacitor and methods of manufacturing same Grant 10,522,615 - Ajuria , et al. Dec | 2019-12-31 |
| Semiconductor Package With Embedded Capacitor And Methods Of Manufacturing Same App 20170084682 - AJURIA; SERGIO A. ; et al. | 2017-03-23 |
| Semiconductor manufacturing for forming bond pads and seal rings Grant 9,601,354 - Reber , et al. March 21, 2 | 2017-03-21 |
| Semiconductor Manufacturing For Forming Bond Pads And Seal Rings App 20160064294 - REBER; DOUGLAS M. ; et al. | 2016-03-03 |
| Method for forming a packaged semiconductor device Grant 9,134,366 - Ajuria , et al. September 15, 2 | 2015-09-15 |
| Semiconductor Manufacturing Using Disposable Test Circuitry Within Scribe Lanes App 20150200146 - Reber; Douglas M. ; et al. | 2015-07-16 |
| Method For Forming A Packaged Semiconductor Device App 20150061709 - Ajuria; Sergio A. ; et al. | 2015-03-05 |
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