Nguyen; Hiep Xuan
Patent Applications and Registrations
Patent applications and USPTO patent grants for Nguyen; Hiep Xuan.The latest application filed is for "integrated system-in-package with radiation shielding".
- Nguyen; Hiep Xuan - Cedar Hill TX
- Nguyen; Hiep Xuan - Grand Prairie TX
| Patent | Date |
|---|---|
| Integrated System-in-package With Radiation Shielding App 20220285293 - Sridharan; Vivek Swaminathan ; et al. | 2022-09-08 |
| Power module with enhanced heat dissipation Grant 11,404,360 - Zhang , et al. August 2, 2 | 2022-08-02 |
| Power Module With Enhanced Heat Dissipation App 20220208662 - ZHANG; Zhemin ; et al. | 2022-06-30 |
| Integrated system-in-package with radiation shielding Grant 11,362,047 - Sridharan , et al. June 14, 2 | 2022-06-14 |
| Enhanced Mold Compound Thermal Conductivity App 20220122936 - WILLIAMSON; Jaimal Mallory ; et al. | 2022-04-21 |
| Integrated System-in-package With Radiation Shielding App 20210327829 - Sridharan; Vivek Swaminathan ; et al. | 2021-10-21 |
| Integrated circuit package mold assembly Grant 10,573,537 - Nguyen Feb | 2020-02-25 |
| Integrated Circuit Package Mold Assembly App 20190157110 - Nguyen; Hiep Xuan | 2019-05-23 |
| Integrated circuit package mold assembly Grant 10,186,431 - Nguyen Ja | 2019-01-22 |
| Integrated Circuit Package Mold Assembly App 20180190509 - Nguyen; Hiep Xuan | 2018-07-05 |
| Integrated Circuit Package Mold Assembly App 20170103904 - Nguyen; Hiep Xuan | 2017-04-13 |
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