Nguty; Tennyson
Patent Applications and Registrations
Patent applications and USPTO patent grants for Nguty; Tennyson.The latest application filed is for "curing pre-applied and laser-ablated underfill via a laser".
- Nguty; Tennyson - Newcastle GB
- Nguty; Tennyson - Cork IE
| Patent | Date |
|---|---|
| Display device and its process for curing post-applied underfill material and bonding packaging contacts via pulsed lasers Grant 11,404,600 - Wu , et al. August 2, 2 | 2022-08-02 |
| Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heating Grant 11,374,148 - Brodoceanu , et al. June 28, 2 | 2022-06-28 |
| Flexible interconnect using conductive adhesive Grant 11,349,053 - Chio , et al. May 31, 2 | 2022-05-31 |
| Curved pillar interconnects Grant 11,239,400 - Chio , et al. February 1, 2 | 2022-02-01 |
| Curing Pre-applied And Laser-ablated Underfill Via A Laser App 20200395503 - Wu; Jeb ; et al. | 2020-12-17 |
| Dielectric-dielectric And Metallization Bonding Via Plasma Activation And Laser-induced Heating App 20200395520 - Brodoceanu; Daniel ; et al. | 2020-12-17 |
| Electrical component packaging Grant 9,307,665 - Asis , et al. April 5, 2 | 2016-04-05 |
| Electrical Component Packaging App 20140318854 - Asis; Michael ; et al. | 2014-10-30 |
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