loadpatents
name:-0.012157917022705
name:-0.034374952316284
name:-0.0009620189666748
Ngo; Minh V. Patent Filings

Ngo; Minh V.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ngo; Minh V..The latest application filed is for "method for manufacturing a surface mount device".

Company Profile
0.25.11
  • Ngo; Minh V. - San Jose CA
  • Ngo; Minh V. - Fremont CA
  • Ngo; Minh V. - Union City CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Insulated thermal cut-off device
Grant 9,831,054 - Chen , et al. November 28, 2
2017-11-28
Method for manufacturing a surface mount device
Grant 9,659,690 - Sepulveda , et al. May 23, 2
2017-05-23
Method for manufacturing a surface mount device
Grant 9,646,744 - Sepulveda , et al. May 9, 2
2017-05-09
Method for Manufacturing a Surface Mount Device
App 20160104559 - Sepulveda; Mario G. ;   et al.
2016-04-14
Method for Manufacturing a Surface Mount Device
App 20160105965 - Sepulveda; Mario G. ;   et al.
2016-04-14
Insulated Thermal Cut-Off Device
App 20150279596 - Chen; Jianhua ;   et al.
2015-10-01
Tensile strained substrate
Grant 7,701,019 - Ngo , et al. April 20, 2
2010-04-20
Protection of charge trapping dielectric flash memory devices from UV-induced charging in BEOL processing
Grant 7,118,967 - Ngo , et al. October 10, 2
2006-10-10
Tensile strained substrate
App 20060138479 - Ngo; Minh V. ;   et al.
2006-06-29
UV-blocking layer for reducing UV-induced charging of SONOS dual-bit flash memory devices in BEOL processing
Grant 7,018,896 - Ngo , et al. March 28, 2
2006-03-28
Sidewall formation for high density polymer memory element array
Grant 7,015,504 - Lyons , et al. March 21, 2
2006-03-21
Semiconductor with tensile strained substrate and method of making the same
Grant 7,001,837 - Ngo , et al. February 21, 2
2006-02-21
Post CMP precursor treatment
Grant 6,982,188 - Xie , et al. January 3, 2
2006-01-03
Method of decontaminating equipment
Grant 6,951,220 - Arasnia , et al. October 4, 2
2005-10-04
Strained silicon MOSFET having reduced leakage and method of its formation
Grant 6,924,182 - Xiang , et al. August 2, 2
2005-08-02
Method of forming strained silicon MOSFET having improved threshold voltage under the gate ends
Grant 6,893,929 - Xiang , et al. May 17, 2
2005-05-17
Structure and method for preventing UV radiation damage in a memory cell and improving contact CD control
Grant 6,894,342 - Hui , et al. May 17, 2
2005-05-17
Sidewall formation for high density polymer memory element array
App 20050092983 - Lyons, Christopher F. ;   et al.
2005-05-05
Selective epitaxy to improve silicidation
Grant 6,878,592 - Besser , et al. April 12, 2
2005-04-12
Depletion to avoid cross contamination
Grant 6,858,503 - Ngo , et al. February 22, 2
2005-02-22
Structure and method for preventing process-induced UV radiation damage in a memory cell
Grant 6,833,581 - Hui , et al. December 21, 2
2004-12-21
Isolation trench fill process
Grant 6,806,165 - Hopper , et al. October 19, 2
2004-10-19
UV-blocking layer for reducing UV-induced charging of SONOS dual-bit flash memory devices in BEOL processing
App 20040191989 - Ngo, Minh V. ;   et al.
2004-09-30
Nickel alloy for SMOS process silicidation
Grant 6,797,614 - Paton , et al. September 28, 2
2004-09-28
Mosfets incorporating nickel germanosilicided gate and methods for their formation
Grant 6,787,864 - Paton , et al. September 7, 2
2004-09-07
UV-blocking layer for reducing UV-induced charging of SONOS dual-bit flash memory devices in BEOL
Grant 6,774,432 - Ngo , et al. August 10, 2
2004-08-10
Uv-blocking Layer For Reducing Uv-induced Charging Of Sonos Dual-bit Flash Memory Devices In Beol Processing
App 20040151025 - Ngo, Minh V. ;   et al.
2004-08-05
Semiconductor with tensile strained substrate and method of making the same
App 20040142545 - Ngo, Minh V. ;   et al.
2004-07-22
Structure and method for preventing UV radiation damage and increasing data retention in memory cells
Grant 6,765,254 - Hui , et al. July 20, 2
2004-07-20
Method of forming a thick strained silicon layer and semiconductor structures incorporating a thick strained silicon layer
Grant 6,730,576 - Wang , et al. May 4, 2
2004-05-04
Mosfets incorporating nickel germanosilicided gate and methods for their formation
App 20040061191 - Paton, Eric N. ;   et al.
2004-04-01
Process for forming fully silicided gates
Grant 6,562,718 - Xiang , et al. May 13, 2
2003-05-13
HSQ processing for reduced dielectric constant
Grant 5,888,911 - Ngo , et al. March 30, 1
1999-03-30
HSQ baking for reduced dielectric constant
Grant 5,888,898 - Ngo , et al. March 30, 1
1999-03-30

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