Patent | Date |
---|
Insulated thermal cut-off device Grant 9,831,054 - Chen , et al. November 28, 2 | 2017-11-28 |
Method for manufacturing a surface mount device Grant 9,659,690 - Sepulveda , et al. May 23, 2 | 2017-05-23 |
Method for manufacturing a surface mount device Grant 9,646,744 - Sepulveda , et al. May 9, 2 | 2017-05-09 |
Method for Manufacturing a Surface Mount Device App 20160104559 - Sepulveda; Mario G. ;   et al. | 2016-04-14 |
Method for Manufacturing a Surface Mount Device App 20160105965 - Sepulveda; Mario G. ;   et al. | 2016-04-14 |
Insulated Thermal Cut-Off Device App 20150279596 - Chen; Jianhua ;   et al. | 2015-10-01 |
Tensile strained substrate Grant 7,701,019 - Ngo , et al. April 20, 2 | 2010-04-20 |
Protection of charge trapping dielectric flash memory devices from UV-induced charging in BEOL processing Grant 7,118,967 - Ngo , et al. October 10, 2 | 2006-10-10 |
Tensile strained substrate App 20060138479 - Ngo; Minh V. ;   et al. | 2006-06-29 |
UV-blocking layer for reducing UV-induced charging of SONOS dual-bit flash memory devices in BEOL processing Grant 7,018,896 - Ngo , et al. March 28, 2 | 2006-03-28 |
Sidewall formation for high density polymer memory element array Grant 7,015,504 - Lyons , et al. March 21, 2 | 2006-03-21 |
Semiconductor with tensile strained substrate and method of making the same Grant 7,001,837 - Ngo , et al. February 21, 2 | 2006-02-21 |
Post CMP precursor treatment Grant 6,982,188 - Xie , et al. January 3, 2 | 2006-01-03 |
Method of decontaminating equipment Grant 6,951,220 - Arasnia , et al. October 4, 2 | 2005-10-04 |
Strained silicon MOSFET having reduced leakage and method of its formation Grant 6,924,182 - Xiang , et al. August 2, 2 | 2005-08-02 |
Method of forming strained silicon MOSFET having improved threshold voltage under the gate ends Grant 6,893,929 - Xiang , et al. May 17, 2 | 2005-05-17 |
Structure and method for preventing UV radiation damage in a memory cell and improving contact CD control Grant 6,894,342 - Hui , et al. May 17, 2 | 2005-05-17 |
Sidewall formation for high density polymer memory element array App 20050092983 - Lyons, Christopher F. ;   et al. | 2005-05-05 |
Selective epitaxy to improve silicidation Grant 6,878,592 - Besser , et al. April 12, 2 | 2005-04-12 |
Depletion to avoid cross contamination Grant 6,858,503 - Ngo , et al. February 22, 2 | 2005-02-22 |
Structure and method for preventing process-induced UV radiation damage in a memory cell Grant 6,833,581 - Hui , et al. December 21, 2 | 2004-12-21 |
Isolation trench fill process Grant 6,806,165 - Hopper , et al. October 19, 2 | 2004-10-19 |
UV-blocking layer for reducing UV-induced charging of SONOS dual-bit flash memory devices in BEOL processing App 20040191989 - Ngo, Minh V. ;   et al. | 2004-09-30 |
Nickel alloy for SMOS process silicidation Grant 6,797,614 - Paton , et al. September 28, 2 | 2004-09-28 |
Mosfets incorporating nickel germanosilicided gate and methods for their formation Grant 6,787,864 - Paton , et al. September 7, 2 | 2004-09-07 |
UV-blocking layer for reducing UV-induced charging of SONOS dual-bit flash memory devices in BEOL Grant 6,774,432 - Ngo , et al. August 10, 2 | 2004-08-10 |
Uv-blocking Layer For Reducing Uv-induced Charging Of Sonos Dual-bit Flash Memory Devices In Beol Processing App 20040151025 - Ngo, Minh V. ;   et al. | 2004-08-05 |
Semiconductor with tensile strained substrate and method of making the same App 20040142545 - Ngo, Minh V. ;   et al. | 2004-07-22 |
Structure and method for preventing UV radiation damage and increasing data retention in memory cells Grant 6,765,254 - Hui , et al. July 20, 2 | 2004-07-20 |
Method of forming a thick strained silicon layer and semiconductor structures incorporating a thick strained silicon layer Grant 6,730,576 - Wang , et al. May 4, 2 | 2004-05-04 |
Mosfets incorporating nickel germanosilicided gate and methods for their formation App 20040061191 - Paton, Eric N. ;   et al. | 2004-04-01 |
Process for forming fully silicided gates Grant 6,562,718 - Xiang , et al. May 13, 2 | 2003-05-13 |
HSQ processing for reduced dielectric constant Grant 5,888,911 - Ngo , et al. March 30, 1 | 1999-03-30 |
HSQ baking for reduced dielectric constant Grant 5,888,898 - Ngo , et al. March 30, 1 | 1999-03-30 |