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Patent applications and USPTO patent grants for Ngion; Lee Fee.The latest application filed is for "shielded semiconductor device and lead frame therefor".
Patent | Date |
---|---|
Shielded semiconductor device and lead frame therefor Grant 10,654,709 - Ngion , et al. | 2020-05-19 |
Shielded Semiconductor Device And Lead Frame Therefor App 20200131030 - Ngion; Lee Fee ;   et al. | 2020-04-30 |
Substrate with electrically isolated bond pads Grant 9,209,144 - Ngion , et al. December 8, 2 | 2015-12-08 |
Method of forming pillar bump Grant 9,209,147 - Foong , et al. December 8, 2 | 2015-12-08 |
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