loadpatents
Patent applications and USPTO patent grants for Ngai; Christopher S..The latest application filed is for "film structure for electric field assisted bake process".
Patent | Date |
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Contact over active gate structure Grant 11,437,284 - Wang , et al. September 6, 2 | 2022-09-06 |
Lithography process window enhancement for photoresist patterning Grant 11,429,026 - Dai , et al. August 30, 2 | 2022-08-30 |
Film Structure For Electric Field Assisted Bake Process App 20220091513 - BANGAR; Mangesh Ashok ;   et al. | 2022-03-24 |
Spin-orbit Torque Mram Structure And Manufacture Thereof App 20210351342 - YUI; Minrui ;   et al. | 2021-11-11 |
Lithography Process Window Enhancement For Photoresist Patterning App 20210294216 - Dai; Huixiong ;   et al. | 2021-09-23 |
Method for forming a layer Grant 10,957,590 - Wang , et al. March 23, 2 | 2021-03-23 |
Contact over active gate structure Grant 10,930,555 - Wang , et al. February 23, 2 | 2021-02-23 |
Contact over active gate structure Grant 10,930,556 - Wang , et al. February 23, 2 | 2021-02-23 |
Film Structure For Electric Field Guided Photoresist Patterning Process App 20200233307 - DAI; Huixiong ;   et al. | 2020-07-23 |
Method For Forming A Layer App 20200161181 - WANG; Wenhui ;   et al. | 2020-05-21 |
Contact Over Active Gate Structure App 20200075422 - Wang; Wenhui ;   et al. | 2020-03-05 |
Contact Over Active Gate Structure App 20200075409 - Wang; Wenhui ;   et al. | 2020-03-05 |
Contact Over Active Gate Structure App 20200075408 - Wang; Wenhui ;   et al. | 2020-03-05 |
PVD Films For EUV Lithography App 20190212656 - Dai; Huixiong ;   et al. | 2019-07-11 |
Surface Treatment For EUV Lithography App 20180135183 - Zeng; Weimin ;   et al. | 2018-05-17 |
Nanocrystalline diamond carbon film for 3D NAND hardmask application Grant 9,865,464 - Chen , et al. January 9, 2 | 2018-01-09 |
Roll to roll wafer backside particle and contamination removal Grant 9,815,091 - Ngai , et al. November 14, 2 | 2017-11-14 |
Multi materials and selective removal enabled reverse tone process Grant 9,728,406 - Dai , et al. August 8, 2 | 2017-08-08 |
Nanocrystaline Diamond Carbon Film For 3d Nand Hardmask Application App 20170062216 - CHEN; Yongmei ;   et al. | 2017-03-02 |
Nanocrystalline diamond carbon film for 3D NAND hardmask application Grant 9,502,262 - Chen , et al. November 22, 2 | 2016-11-22 |
Method for critical dimension reduction using conformal carbon films Grant 9,337,051 - Mebarki , et al. May 10, 2 | 2016-05-10 |
Nanocrystaline Diamond Carbon Film For 3d Nand Hardmask Application App 20160064500 - CHEN; Yongmei ;   et al. | 2016-03-03 |
Method For Critical Dimension Reduction Using Conformal Carbon Films App 20160049305 - MEBARKI; Bencherki ;   et al. | 2016-02-18 |
Multi Materials And Selective Removal Enabled Reserve Tone Process App 20160042950 - DAI; Huixiong ;   et al. | 2016-02-11 |
Roll To Roll Wafer Backside Particle And Contamination Removal App 20150371879 - NGAI; Christopher S. ;   et al. | 2015-12-24 |
Line edge roughness reduction and double patterning Grant 8,501,395 - Dai , et al. August 6, 2 | 2013-08-06 |
Dry Etch Processes App 20130115778 - Xue; Jun ;   et al. | 2013-05-09 |
Semiconductor device having silicon carbide and conductive pathway interface Grant 8,183,150 - Huang , et al. May 22, 2 | 2012-05-22 |
Self Aligned Triple Patterning App 20120085733 - Mebarki; Bencherki ;   et al. | 2012-04-12 |
Line edge roughness reduction and double patterning App 20090142926 - Dai; Huixiong ;   et al. | 2009-06-04 |
Semiconductor Device Having Silicon Carbide And Conductive Pathway Interface App 20090050902 - Huang; Judy H. ;   et al. | 2009-02-26 |
Method of depositing an amorphous carbon layer Grant 7,335,462 - Fairbairn , et al. February 26, 2 | 2008-02-26 |
Method of depositing an amorphous carbon layer Grant 7,223,526 - Fairbairn , et al. May 29, 2 | 2007-05-29 |
Ashable layers for reducing critical dimensions of integrated circuit features Grant 7,105,442 - Shan , et al. September 12, 2 | 2006-09-12 |
Semiconductor device having silicon carbide and conductive pathway interface App 20050263900 - Huang, Judy H. ;   et al. | 2005-12-01 |
Plasma treatment for copper oxide reduction Grant 6,946,401 - Huang , et al. September 20, 2 | 2005-09-20 |
Method of depositing an amrphous carbon layer App 20050112509 - Fairbairn, Kevin ;   et al. | 2005-05-26 |
Method of depositing an amorphous carbon layer Grant 6,841,341 - Fairbairn , et al. January 11, 2 | 2005-01-11 |
Plasma treatment for copper oxide reduction App 20040046260 - Huang, Judy H. ;   et al. | 2004-03-11 |
Semiconductor device having reduced oxidation interface Grant 6,700,202 - Huang , et al. March 2, 2 | 2004-03-02 |
Method for forming silicon containing layers on a substrate Grant 6,656,840 - Rajagopalan , et al. December 2, 2 | 2003-12-02 |
Ashable layers for reducing critical dimensions of integrated circuit features App 20030219988 - Shan, Hongqing ;   et al. | 2003-11-27 |
Method For Forming Silicon Containing Layers On A Substrate App 20030203614 - Rajagopalan, Nagarajan ;   et al. | 2003-10-30 |
Method for depositing an amorphous carbon layer Grant 6,573,030 - Fairbairn , et al. June 3, 2 | 2003-06-03 |
Method of depositing an amorphous carbon layer App 20030091938 - Fairbairn, Kevin ;   et al. | 2003-05-15 |
Apparatus for reducing copper oxidation and contamination in a semiconductor device App 20020081856 - Huang, Judy H. ;   et al. | 2002-06-27 |
Method and apparatus for reducing copper oxidation and contamination in a semiconductor device Grant 6,355,571 - Huang , et al. March 12, 2 | 2002-03-12 |
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