loadpatents
name:-0.035114049911499
name:-0.024410009384155
name:-0.0072288513183594
Ngai; Christopher S. Patent Filings

Ngai; Christopher S.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ngai; Christopher S..The latest application filed is for "film structure for electric field assisted bake process".

Company Profile
7.22.27
  • Ngai; Christopher S. - Burlingame CA
  • Ngai; Christopher S. - Santa Clara CA
  • Ngai; Christopher S - Burlingame CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Contact over active gate structure
Grant 11,437,284 - Wang , et al. September 6, 2
2022-09-06
Lithography process window enhancement for photoresist patterning
Grant 11,429,026 - Dai , et al. August 30, 2
2022-08-30
Film Structure For Electric Field Assisted Bake Process
App 20220091513 - BANGAR; Mangesh Ashok ;   et al.
2022-03-24
Spin-orbit Torque Mram Structure And Manufacture Thereof
App 20210351342 - YUI; Minrui ;   et al.
2021-11-11
Lithography Process Window Enhancement For Photoresist Patterning
App 20210294216 - Dai; Huixiong ;   et al.
2021-09-23
Method for forming a layer
Grant 10,957,590 - Wang , et al. March 23, 2
2021-03-23
Contact over active gate structure
Grant 10,930,555 - Wang , et al. February 23, 2
2021-02-23
Contact over active gate structure
Grant 10,930,556 - Wang , et al. February 23, 2
2021-02-23
Film Structure For Electric Field Guided Photoresist Patterning Process
App 20200233307 - DAI; Huixiong ;   et al.
2020-07-23
Method For Forming A Layer
App 20200161181 - WANG; Wenhui ;   et al.
2020-05-21
Contact Over Active Gate Structure
App 20200075422 - Wang; Wenhui ;   et al.
2020-03-05
Contact Over Active Gate Structure
App 20200075409 - Wang; Wenhui ;   et al.
2020-03-05
Contact Over Active Gate Structure
App 20200075408 - Wang; Wenhui ;   et al.
2020-03-05
PVD Films For EUV Lithography
App 20190212656 - Dai; Huixiong ;   et al.
2019-07-11
Surface Treatment For EUV Lithography
App 20180135183 - Zeng; Weimin ;   et al.
2018-05-17
Nanocrystalline diamond carbon film for 3D NAND hardmask application
Grant 9,865,464 - Chen , et al. January 9, 2
2018-01-09
Roll to roll wafer backside particle and contamination removal
Grant 9,815,091 - Ngai , et al. November 14, 2
2017-11-14
Multi materials and selective removal enabled reverse tone process
Grant 9,728,406 - Dai , et al. August 8, 2
2017-08-08
Nanocrystaline Diamond Carbon Film For 3d Nand Hardmask Application
App 20170062216 - CHEN; Yongmei ;   et al.
2017-03-02
Nanocrystalline diamond carbon film for 3D NAND hardmask application
Grant 9,502,262 - Chen , et al. November 22, 2
2016-11-22
Method for critical dimension reduction using conformal carbon films
Grant 9,337,051 - Mebarki , et al. May 10, 2
2016-05-10
Nanocrystaline Diamond Carbon Film For 3d Nand Hardmask Application
App 20160064500 - CHEN; Yongmei ;   et al.
2016-03-03
Method For Critical Dimension Reduction Using Conformal Carbon Films
App 20160049305 - MEBARKI; Bencherki ;   et al.
2016-02-18
Multi Materials And Selective Removal Enabled Reserve Tone Process
App 20160042950 - DAI; Huixiong ;   et al.
2016-02-11
Roll To Roll Wafer Backside Particle And Contamination Removal
App 20150371879 - NGAI; Christopher S. ;   et al.
2015-12-24
Line edge roughness reduction and double patterning
Grant 8,501,395 - Dai , et al. August 6, 2
2013-08-06
Dry Etch Processes
App 20130115778 - Xue; Jun ;   et al.
2013-05-09
Semiconductor device having silicon carbide and conductive pathway interface
Grant 8,183,150 - Huang , et al. May 22, 2
2012-05-22
Self Aligned Triple Patterning
App 20120085733 - Mebarki; Bencherki ;   et al.
2012-04-12
Line edge roughness reduction and double patterning
App 20090142926 - Dai; Huixiong ;   et al.
2009-06-04
Semiconductor Device Having Silicon Carbide And Conductive Pathway Interface
App 20090050902 - Huang; Judy H. ;   et al.
2009-02-26
Method of depositing an amorphous carbon layer
Grant 7,335,462 - Fairbairn , et al. February 26, 2
2008-02-26
Method of depositing an amorphous carbon layer
Grant 7,223,526 - Fairbairn , et al. May 29, 2
2007-05-29
Ashable layers for reducing critical dimensions of integrated circuit features
Grant 7,105,442 - Shan , et al. September 12, 2
2006-09-12
Semiconductor device having silicon carbide and conductive pathway interface
App 20050263900 - Huang, Judy H. ;   et al.
2005-12-01
Plasma treatment for copper oxide reduction
Grant 6,946,401 - Huang , et al. September 20, 2
2005-09-20
Method of depositing an amrphous carbon layer
App 20050112509 - Fairbairn, Kevin ;   et al.
2005-05-26
Method of depositing an amorphous carbon layer
Grant 6,841,341 - Fairbairn , et al. January 11, 2
2005-01-11
Plasma treatment for copper oxide reduction
App 20040046260 - Huang, Judy H. ;   et al.
2004-03-11
Semiconductor device having reduced oxidation interface
Grant 6,700,202 - Huang , et al. March 2, 2
2004-03-02
Method for forming silicon containing layers on a substrate
Grant 6,656,840 - Rajagopalan , et al. December 2, 2
2003-12-02
Ashable layers for reducing critical dimensions of integrated circuit features
App 20030219988 - Shan, Hongqing ;   et al.
2003-11-27
Method For Forming Silicon Containing Layers On A Substrate
App 20030203614 - Rajagopalan, Nagarajan ;   et al.
2003-10-30
Method for depositing an amorphous carbon layer
Grant 6,573,030 - Fairbairn , et al. June 3, 2
2003-06-03
Method of depositing an amorphous carbon layer
App 20030091938 - Fairbairn, Kevin ;   et al.
2003-05-15
Apparatus for reducing copper oxidation and contamination in a semiconductor device
App 20020081856 - Huang, Judy H. ;   et al.
2002-06-27
Method and apparatus for reducing copper oxidation and contamination in a semiconductor device
Grant 6,355,571 - Huang , et al. March 12, 2
2002-03-12

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