Ng; Mei Chin

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ng; Mei Chin.The latest application filed is for "molded semiconductor package".

Company Profile

5.9.8

Ng; Mei Chin - Melaka MY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Manufacturing a package using plateable encapsulant Grant 11,081,417 - Chan , et al. August 3, 2	2021-08-03
Molded Semiconductor Package App 20200006267 - Lee; Swee Kah ; et al.	2020-01-02
Semiconductor package and method for fabricating a semiconductor package Grant 10,490,470 - Chong , et al. Nov	2019-11-26
Manufacturing a package using plateable encapsulant App 20190341324 - CHAN; Sook Woon ; et al.	2019-11-07
Molded semiconductor package having an optical inspection feature Grant 10,431,560 - Lee , et al. O	2019-10-01
Semiconductor package with plateable encapsulant and a method for manufacturing the same Grant 10,396,007 - Chan , et al. A	2019-08-27
Semiconductor package and method for fabricating a semiconductor package App 20180174935 - CHONG; Hock Heng ; et al.	2018-06-21
Molded Semiconductor Package Having an Optical Inspection Feature App 20180033752 - Lee; Swee Kah ; et al.	2018-02-01
Method of manufacturing molded semiconductor packages having an optical inspection feature Grant 9,806,043 - Lee , et al. October 31, 2	2017-10-31
Method of Manufacturing Molded Semiconductor Packages Having an Optical Inspection Feature App 20170256509 - Lee; Swee Kah ; et al.	2017-09-07
Manufacturing a package using plateable encapsulant App 20170256472 - CHAN; Sook Woon ; et al.	2017-09-07
Molded package structure with glue bleed stopper for sealing a MEMs device method of packaging a MEMs device Grant 9,475,691 - Chua , et al. October 25, 2	2016-10-25
Molded flip-clip semiconductor package Grant 9,219,025 - Lee , et al. December 22, 2	2015-12-22
Clip frame semiconductor packages and methods of formation thereof Grant 8,951,841 - Ng , et al. February 10, 2	2015-02-10
Clip Frame Semiconductor Packages and Methods of Formation Thereof App 20130249067 - Ng; Melissa Mei Ching ; et al.	2013-09-26

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