Ng; Man Chung
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ng; Man Chung.The latest application filed is for "apparatus and method for real-time alignment and lamination of substrates".
- Ng; Man Chung - Kwai Chung N/A CN
- Ng; Man Chung - Hong Kong CN
| Patent | Date |
|---|---|
| Apparatus for bonding substrates to each other Grant 8,905,109 - Ng , et al. December 9, 2 | 2014-12-09 |
| Apparatus and method for real-time alignment and lamination of substrates Grant 8,821,659 - Ng , et al. September 2, 2 | 2014-09-02 |
| Plastic container Grant D708,913 - Ng July 15, 2 | 2014-07-15 |
| Die bonding method utilizing rotary wafer table Grant 8,633,089 - Ng , et al. January 21, 2 | 2014-01-21 |
| Apparatus And Method For Real-time Alignment And Lamination Of Substrates App 20130299062 - NG; Man Chung ; et al. | 2013-11-14 |
| Apparatus For Bonding Substrates To Each Other App 20130149839 - NG; Man Chung ; et al. | 2013-06-13 |
| Transfer apparatus for multiple adhesives Grant 8,397,785 - Chau , et al. March 19, 2 | 2013-03-19 |
| Apparatus for transporting substrates for bonding Grant 8,336,757 - Ng , et al. December 25, 2 | 2012-12-25 |
| Die Bonding Method Utilizing Rotary Wafer Table App 20120252161 - NG; Man Chung ; et al. | 2012-10-04 |
| Apparatus For Transporting Substrates For Bonding App 20120168489 - NG; Man Chung ; et al. | 2012-07-05 |
| Rotary clip bonder Grant 8,166,638 - Chan , et al. May 1, 2 | 2012-05-01 |
| Transfer Apparatus For Multiple Adhesives App 20110114258 - CHAU; Keung ; et al. | 2011-05-19 |
| Rotary Clip Bonder App 20100313415 - CHAN; Wai Lik ; et al. | 2010-12-16 |
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