| Patent | Date |
|---|
Overlapping Die Stacks For Nand Package Architecture
App 20220271007 - Tai; Enyong ; et al. | 2022-08-25 |
Systems And Methods For Reducing The Size Of A Semiconductor Assembly
App 20220208744 - Ng; Hong Wan ; et al. | 2022-06-30 |
Reinforced Semiconductor Device Packaging And Associated Systems And Methods
App 20220208632 - Upadhyayula; Suresh K. ; et al. | 2022-06-30 |
Build-up package for integrated circuit devices, and methods of making same
Grant 11,367,667 - Ng , et al. June 21, 2 | 2022-06-21 |
Integrated Circuit Wire Bonded To A Multi-layer Substrate Having An Open Area That Exposes Wire Bond Pads At A Surface Of The Inner Layer
App 20220181307 - Boo; Kelvin Tam Aik ; et al. | 2022-06-09 |
Overlapping die stacks for NAND package architecture
Grant 11,309,281 - Tai , et al. April 19, 2 | 2022-04-19 |
Integrated circuit wire bonded to a multi-layer substrate having an open area that exposes wire bond pads at a surface of the inner layer
Grant 11,282,811 - Boo , et al. March 22, 2 | 2022-03-22 |
Surface Mount Device Bonded To An Inner Layer Of A Multi-layer Substrate
App 20220078915 - Boo; Kelvin Tan Aik ; et al. | 2022-03-10 |
Overlapping Die Stacks For Nand Package Architecture
App 20220068877 - Tai; Enyong ; et al. | 2022-03-03 |
Stacked Semiconductor Die Assemblies With Support Members And Associated Systems And Methods
App 20210384185 - Ng; Hong Wan ; et al. | 2021-12-09 |
Stacked Semiconductor Die Assemblies With Die Support Members And Associated Systems And Methods
App 20210384167 - Ye; Seng Kim ; et al. | 2021-12-09 |
Integrated Circuit Wire Bonded To A Multi-layer Substrate Having An Open Area That Exposes Wire Bond Pads At A Surface Of The Inner Layer
App 20210358888 - Boo; Kelvin Tan Aik ; et al. | 2021-11-18 |
Stacked semiconductor die assemblies with support members and associated systems and methods
Grant 11,101,262 - Ng , et al. August 24, 2 | 2021-08-24 |
Stacked semiconductor die assemblies with die support members and associated systems and methods
Grant 11,101,244 - Ye , et al. August 24, 2 | 2021-08-24 |
Semiconductor device assemblies including multiple shingled stacks of semiconductor dies
Grant 11,094,670 - Ng , et al. August 17, 2 | 2021-08-17 |
Methods of operating microelectronic devices including a controller
Grant 10,811,387 - Ye , et al. October 20, 2 | 2020-10-20 |
Memory Devices With Controllers Under Memory Packages And Associated Systems And Methods
App 20200321318 - Ye; Seng Kim ; et al. | 2020-10-08 |
Novel Build-up Package For Integrated Circuit Devices, And Methods Of Making Same
App 20200286801 - Ng; Hong Wan ; et al. | 2020-09-10 |
Stacked Semiconductor Die Assemblies With Die Support Members And Associated Systems And Methods
App 20200279832 - Ye; Seng Kim ; et al. | 2020-09-03 |
Memory devices with controllers under memory packages and associated systems and methods
Grant 10,727,206 - Ye , et al. | 2020-07-28 |
Stacked semiconductor die assemblies with die support members and associated systems and methods
Grant 10,658,336 - Ye , et al. | 2020-05-19 |
Stacked Semiconductor Die Assemblies With Support Members And Associated Systems And Methods
App 20200105737 - Ng; Hong Wan ; et al. | 2020-04-02 |
Build-up package for integrated circuit devices, and methods of making same
Grant 10,593,607 - Ng , et al. | 2020-03-17 |
Semiconductor Device Assemblies Including Multiple Shingled Stacks Of Semiconductor Dies
App 20200020667 - Ng; Hong Wan ; et al. | 2020-01-16 |
Semiconductor device assemblies including multiple shingled stacks of semiconductor dies
Grant 10,522,507 - Ng , et al. Dec | 2019-12-31 |
Stacked semiconductor die assemblies with support members and associated systems and methods
Grant 10,504,881 - Ng , et al. Dec | 2019-12-10 |
Semiconductor Device Assemblies Including Multiple Shingled Stacks Of Semiconductor Dies
App 20190244930 - Ng; Hong Wan ; et al. | 2019-08-08 |
Semiconductor device assemblies including multiple shingled stacks of semiconductor dies
Grant 10,312,219 - Ng , et al. | 2019-06-04 |
Semiconductor devices including a controller and methods of forming such devices
Grant 10,304,808 - Ye , et al. | 2019-05-28 |
Semiconductor Device Assemblies Including Multiple Shingled Stacks Of Semiconductor Dies
App 20190139934 - Ng; Hong Wan ; et al. | 2019-05-09 |
Methods Of Operating Semicondcutor Devices Including A Controller
App 20190088627 - Ye; Seng Kim Dalson ; et al. | 2019-03-21 |
Memory Devices With Controllers Under Memory Packages And Associated Systems And Methods
App 20180350776 - Ye; Seng Kim ; et al. | 2018-12-06 |
Memory devices with controllers under memory packages and associated systems and methods
Grant 10,128,217 - Ye , et al. November 13, 2 | 2018-11-13 |
Semiconductor Devices Including A Controller And Methods Of Forming Such Devices
App 20180315736 - Ye; Seng Kim Dalson ; et al. | 2018-11-01 |
Stacked Semiconductor Die Assemblies With Die Support Members And Associated Systems And Methods
App 20180240785 - Ye; Seng Kim ; et al. | 2018-08-23 |
Methods of manufacturing a semiconductor device package including a controller element
Grant 10,014,281 - Ye , et al. July 3, 2 | 2018-07-03 |
Stacked semiconductor die assemblies with die support members and associated systems and methods
Grant 9,985,000 - Ye , et al. May 29, 2 | 2018-05-29 |
Methods Of Manufacturing A Semiconductor Device Package Including A Controller Element
App 20170358559 - Ye; Seng Kim Dalson ; et al. | 2017-12-14 |
Semiconductor device packages including a controller element
Grant 9,761,562 - Ye , et al. September 12, 2 | 2017-09-12 |
Memory Devices With Controllers Under Memory Packages And Associated Systems And Methods
App 20170170149 - Ye; Seng Kim ; et al. | 2017-06-15 |
Memory devices with controllers under memory packages and associated systems and methods
Grant 9,627,367 - Ye , et al. April 18, 2 | 2017-04-18 |
Stacked Semiconductor Die Assemblies With Support Members And Associated Systems And Methods
App 20160343699 - Ng; Hong Wan ; et al. | 2016-11-24 |
Stacked Semiconductor Die Assemblies With Die Support Members And Associated Systems And Methods
App 20160336300 - Ye; Seng Kim ; et al. | 2016-11-17 |
Semiconductor Device Packages Including A Controller Element And Related Methods
App 20160329303 - Ye; Seng Kim Dalson ; et al. | 2016-11-10 |
Novel Build-up Package For Integrated Circuit Devices, And Methods Of Making Same
App 20160247737 - Ng; Hong Wan ; et al. | 2016-08-25 |
Stacked semiconductor die assemblies with support members and associated systems and methods
Grant 9,418,974 - Ng , et al. August 16, 2 | 2016-08-16 |
Stacked semiconductor die assemblies with die support members and associated systems and methods
Grant 9,406,660 - Ye , et al. August 2, 2 | 2016-08-02 |
Build-up package for integrated circuit devices, and methods of making same
Grant 9,355,994 - Ng , et al. May 31, 2 | 2016-05-31 |
Memory Devices With Controllers Under Memory Packages And Associated Systems And Methods
App 20160148918 - Ye; Seng Kim ; et al. | 2016-05-26 |
Semiconductor assemblies with multi-level substrates and associated methods of manufacturing
Grant 9,271,403 - Chong , et al. February 23, 2 | 2016-02-23 |
Stacked Semiconductor Die Assemblies With Support Members And Associated Systems And Methods
App 20150311185 - Ng; Hong Wan ; et al. | 2015-10-29 |
Stacked Semiconductor Die Assemblies With Die Support Members And Associated Systems And Methods
App 20150311186 - Ye; Seng Kim ; et al. | 2015-10-29 |
Microelectronic devices and microelectronic support devices, and associated assemblies and methods
Grant 9,129,862 - Lee , et al. September 8, 2 | 2015-09-08 |
Microelectronic packages with small footprints and associated methods of manufacturing
Grant 08923004 - | 2014-12-30 |
Microelectronic packages with small footprints and associated methods of manufacturing
Grant 8,923,004 - Low , et al. December 30, 2 | 2014-12-30 |
Microelectronic Devices And Microelectronic Support Devices, And Associated Assemblies And Methods
App 20140326488 - Lee; Teck Kheng ; et al. | 2014-11-06 |
Novel Build-up Package For Integrated Circuit Devices, And Methods Of Making Same
App 20140295622 - Ng; Hong Wan ; et al. | 2014-10-02 |
Microelectronic devices and microelectronic support devices, and associated assemblies and methods
Grant 8,778,732 - Lee , et al. July 15, 2 | 2014-07-15 |
Build-up package for integrated circuit devices, and methods of making same
Grant 8,754,537 - Ng , et al. June 17, 2 | 2014-06-17 |
Semiconductor Assemblies With Multi-level Substrates And Associated Methods Of Manufacturing
App 20140141572 - Chong; Chin Hui ; et al. | 2014-05-22 |
Semiconductor assemblies with multi-level substrates and associated methods of manufacturing
Grant 8,637,987 - Chong , et al. January 28, 2 | 2014-01-28 |
Semiconductor Assemblies With Multi-level Substrates And Associated Methods Of Manufacturing
App 20130037949 - Chong; Chin Hui ; et al. | 2013-02-14 |
Microelectronic devices and microelectronic support devices, and associated assemblies and methods
Grant 8,174,101 - Lee , et al. May 8, 2 | 2012-05-08 |
Microelectronic Devices And Microelectronic Support Devices, And Associated Assemblies And Methods
App 20110252623 - Lee; Teck Kheng ; et al. | 2011-10-20 |
Microelectronic devices and microelectronic support devices, and associated assemblies and methods
Grant 7,968,369 - Lee , et al. June 28, 2 | 2011-06-28 |
Novel Build-up Package For Integrated Circuit Devices, And Methods Of Making Same
App 20100187668 - Ng; Hong Wan ; et al. | 2010-07-29 |
Microelectronic Packages With Small Footprints And Associated Methods Of Manufacturing
App 20100027233 - Low; Peng Wang ; et al. | 2010-02-04 |
Microelectronic Devices And Microelectronic Support Devices, And Associated Assemblies And Methods
App 20070105272 - Lee; Teck Kheng ; et al. | 2007-05-10 |
Microelectronic devices and microelectronic support devices, and associated assemblies and methods
App 20070045797 - Lee; Teck Kheng ; et al. | 2007-03-01 |
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