Ng; Han Wah
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ng; Han Wah.The latest application filed is for "method of controlled low-k via etch for cu interconnections".
- Ng; Han Wah - Johor MY
| Patent | Date |
|---|---|
| Method of controlled low-k via etch for Cu interconnections Grant 7,906,426 - Liu , et al. March 15, 2 | 2011-03-15 |
| Method of controlled low-k via etch for Cu interconnections App 20080258308 - Liu; Wuping ; et al. | 2008-10-23 |
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