Ng; Cheong Huat
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ng; Cheong Huat.The latest application filed is for "capillary underfill and mold encapsulation method and apparatus".
- Ng; Cheong Huat - Penang MY
| Patent | Date |
|---|---|
| Capillary Underfill And Mold Encapsulation Method And Apparatus App 20080017976 - Lai; Yin Men ; et al. | 2008-01-24 |
| Capillary underfill and mold encapsulation method and apparatus Grant 7,262,077 - Lai , et al. August 28, 2 | 2007-08-28 |
| Capillary underfill and mold encapsulation method and apparatus App 20060214311 - Lai; Yin Men ; et al. | 2006-09-28 |
| Combination back grind tape and underfill for flip chips App 20050126686 - Cheong, Yew Wee ; et al. | 2005-06-16 |
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