Nezu, Hiroki
Patent Applications and Registrations
Patent applications and USPTO patent grants for Nezu, Hiroki.The latest application filed is for "polishing apparatus".
- Nezu, Hiroki - Hamura JP
- Nezu; Hiroki - Tokyo JP
| Patent | Date |
|---|---|
| Polishing apparatus App 20050170760 - Homma, Yoshio ; et al. | 2005-08-04 |
| Polishing apparatus Grant 6,899,603 - Homma , et al. May 31, 2 | 2005-05-31 |
| Polishing apparatus App 20040152400 - Homma, Yoshio ; et al. | 2004-08-05 |
| Polishing apparatus Grant 6,719,618 - Homma , et al. April 13, 2 | 2004-04-13 |
| Polishing apparatus using substantially abrasive-free liquid with mixture unit near polishing unit, and plant using the polishing apparatus Grant 6,565,422 - Homma , et al. May 20, 2 | 2003-05-20 |
| Polishing apparatus App 20010051500 - Homma, Yoshio ; et al. | 2001-12-13 |
| Process for forming multilayer wiring Grant 5,670,421 - Nishitani , et al. September 23, 1 | 1997-09-23 |
| Process for forming multilayer wiring Grant 5,498,768 - Nishitani , et al. March 12, 1 | 1996-03-12 |
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