NexPlanar Corporation

Patent Applications and Registrations

Patent applications and USPTO patent grants for NexPlanar Corporation.The latest application filed is for "polishing pad having polishing surface with continuous protrusions".

Company Profile

4.44.13

NexPlanar Corporation - Hillsboro OR US
NexPlanar Corporation -
NexPlanar Corporation - Hilsboro OR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Low density polishing pad Grant 10,946,495 - Huang , et al. March 16, 2	2021-03-16
Polishing pad having polishing surface with continuous protrusions Grant 10,293,459 - Lefevre , et al.	2019-05-21
Customized polishing pads for CMP and methods of fabrication and use thereof Grant 10,220,487 - Roy , et al.	2019-03-05
Polishing pad having polishing surface with continuous protrusions having tapered sidewalls Grant 10,160,092 - Lefevre , et al. Dec	2018-12-25
Polishing pad with foundation layer and polishing surface layer Grant 9,931,728 - Allison , et al. April 3, 2	2018-04-03
Polishing pad with grooved foundation layer and polishing surface layer Grant 9,931,729 - Lefevre , et al. April 3, 2	2018-04-03
Polishing Pad Having Polishing Surface With Continuous Protrusions App 20170203409 - LEFEVRE; Paul Andre ; et al.	2017-07-20
Polishing pad having polishing surface with continuous protrusions Grant 9,649,742 - Lefevre , et al. May 16, 2	2017-05-16
Homogeneous polishing pad for eddy current end-point detection Grant 9,597,777 - Allison , et al. March 21, 2	2017-03-21
Method of fabricating a polishing Grant 9,597,770 - Allison , et al. March 21, 2	2017-03-21
Polishing pad with multi-modal distribution of pore diameters Grant 9,555,518 - Huang , et al. January 31, 2	2017-01-31
Customized Polishing Pads For Cmp And Methods Of Fabrication And Use Thereof App 20160229025 - ROY; Pradip K. ; et al.	2016-08-11
Grooved CMP pads Grant 9,375,823 - Kerprich , et al. June 28, 2	2016-06-28
Polishing pad with homogeneous body having discrete protrusions thereon Grant 9,296,085 - Bajaj , et al. March 29, 2	2016-03-29
Customized polishing pads for CMP and methods of fabrication and use thereof Grant 9,278,424 - Roy , et al. March 8, 2	2016-03-08
Polishing systems Grant 9,272,388 - Misra March 1, 2	2016-03-01
Polishing pad with alignment feature Grant 9,249,273 - Kerprich , et al. February 2, 2	2016-02-02
Polishing pad having porogens with liquid filler Grant 9,238,294 - Lefevre , et al. January 19, 2	2016-01-19
Polishing pad with concentric or approximately concentric polygon groove pattern Grant 9,211,628 - Allison , et al. December 15, 2	2015-12-15
Grooved CMP pad Grant 9,180,570 - Kerprich , et al. November 10, 2	2015-11-10
Soft polishing pad for polishing a semiconductor substrate Grant 9,156,124 - Allison , et al. October 13, 2	2015-10-13
Polishing pad with foundation layer and polishing surface layer Grant 9,067,297 - Allison , et al. June 30, 2	2015-06-30
Polishing pad with grooved foundation layer and polishing surface layer Grant 9,067,298 - Lefevre , et al. June 30, 2	2015-06-30
Polishing pad for eddy current end-point detection Grant 9,028,302 - Allison , et al. May 12, 2	2015-05-12
CMP pad with local area transparency Grant 9,017,140 - Allison , et al. April 28, 2	2015-04-28
Polishing pad with alignment feature Grant 8,968,058 - Kerprich , et al. March 3, 2	2015-03-03
Low Density Polishing Pad App 20150038066 - Huang; Ping ; et al.	2015-02-05
Methods for producing in-situ grooves in chemical mechanical planarization (CMP) pads, and novel CMP pad designs Grant 8,932,116 - Deopura , et al. January 13, 2	2015-01-13
Polishing pad with alignment aperture Grant 08920219 -	2014-12-30
Polishing pad with alignment aperture Grant 8,920,219 - Allison , et al. December 30, 2	2014-12-30
Customized polishing pads for CMP and methods of fabrication and use thereof Grant 8,864,859 - Roy , et al. October 21, 2	2014-10-21
Polishing Pad Having Polishing Surface With Continuous Protrusions Having Tapered Sidewalls App 20140273777 - Lefevre; Paul Andre ; et al.	2014-09-18
Polishing Pad Having Polishing Surface With Continuous Protrusions App 20140206268 - Lefevre; Paul Andre ; et al.	2014-07-24
Homogeneous Polishing Pad For Eddy Current End-point Detection App 20140123563 - Allison; William C. ; et al.	2014-05-08
Customized polishing pads for CMP and methods of fabrication and use thereof Grant 8,715,035 - Roy , et al. May 6, 2	2014-05-06
Polishing pad with multi-modal distribution of pore diameters Grant 8,702,479 - Huang , et al. April 22, 2	2014-04-22
Homogeneous polishing pad for eddy current end-point detection Grant 8,657,653 - Allison , et al. February 25, 2	2014-02-25
Polishing pad for eddy current end-point detection Grant 8,628,384 - Allison , et al. January 14, 2	2014-01-14
Method of fabricating a polishing pad with an end-point detection region for eddy current end-point detection Grant 8,439,994 - Allison , et al. May 14, 2	2013-05-14
Polishing systems Grant 8,383,003 - Misra February 26, 2	2013-02-26
Customized polish pads for chemical mechanical planarization Grant 8,380,339 - Misra , et al. February 19, 2	2013-02-19
Methods for producing in-situ grooves in chemical mechanical planarization (CMP) pads, and novel CMP pad designs Grant 8,287,793 - Deopura , et al. October 16, 2	2012-10-16
CMP pad with local area transparency App 20110171883 - Allison; William ; et al.	2011-07-14
Customized polish pads for chemical mechanical planarization Grant 7,704,122 - Misra , et al. April 27, 2	2010-04-27
Customized polishing pads for CMP and methods of fabrication and use thereof Grant 7,704,125 - Roy , et al. April 27, 2	2010-04-27
Polishing systems App 20090318063 - Misra; Sudhanshu	2009-12-24
Grooved CMP pad App 20090311955 - Kerprich; Robert ; et al.	2009-12-17
Customized polish pads for chemical mechanical planarization Grant 7,425,172 - Misra , et al. September 16, 2	2008-09-16

Company Registrations

SEC

0001395772

NEXPLANAR CORP of DELAWARE