loadpatents
name:-0.0097968578338623
name:-0.0097329616546631
name:-0.00040888786315918
Newton; Kenneth J. Patent Filings

Newton; Kenneth J.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Newton; Kenneth J..The latest application filed is for "method of forming dual-damascene structure".

Company Profile
0.6.5
  • Newton; Kenneth J. - McKinney TX
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Process flow for dual damescene interconnect structures
Grant 6,872,665 - Celii , et al. March 29, 2
2005-03-29
Pre-pattern surface modification of low-k dielectrics
Grant 6,861,348 - Kirkpatrick , et al. March 1, 2
2005-03-01
In-situ plasma ash/treatment after via etch of low-k films for poison-free dual damascene trench patterning
Grant 6,797,633 - Jiang , et al. September 28, 2
2004-09-28
Method of forming dual-damascene structure
Grant 6,774,031 - Ali , et al. August 10, 2
2004-08-10
Method of forming dual-damascene structure
App 20040121581 - Ali, Abbas ;   et al.
2004-06-24
Pre-pattern surface modification for low-k dielectrics using A H2 plasma
Grant 6,720,247 - Kirkpatrick , et al. April 13, 2
2004-04-13
Defect and etch rate control in trench etch for dual damascene patterning of low-k dielectrics
Grant 6,455,411 - Jiang , et al. September 24, 2
2002-09-24
Pre-pattern surface modification for low-k dielectrics using A H2 plasma
App 20020111017 - Kirkpatrick, Brian K. ;   et al.
2002-08-15
Pre-pattern surface modification for low-k dielectrics
App 20020111037 - Kirkpatrick, Brian K. ;   et al.
2002-08-15
In-situ plasma ash/treatment after via etch of low-k films for poison-free dual damascene trench patterning
App 20020081855 - Jiang, Ping ;   et al.
2002-06-27
Defect and etch rate control in trench etch for dual damascene patterning of low-k dielectrics
App 20020031906 - Jiang, Ping ;   et al.
2002-03-14

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