| Patent | Date |
|---|
Discrete and Monolithic Phase-Change Material (PCM) Radio Frequency (RF) Switches with Sheet of Thermally Conductive and Electrically Insulating Material
App 20210135100 - Slovin; Gregory P. ; et al. | 2021-05-06 |
Semiconductor Structure Having Porous Semiconductor Segment for RF Devices and Bulk Semiconductor Region for Non-RF Devices
App 20210111249 - Hurwitz; Paul D. ; et al. | 2021-04-15 |
Semiconductor Structure Having Porous Semiconductor Layer for RF Devices
App 20210111019 - Hurwitz; Paul D. ; et al. | 2021-04-15 |
Semiconductor Structure Having Through-Substrate Via (TSV) in Porous Semiconductor Region
App 20210111101 - Howard; David J. | 2021-04-15 |
Integrated Optical/Electrical Probe Card for Testing Optical, Electrical, and Optoelectronic Devices in a Semiconductor Die
App 20210080295 - Qamar; Yasir ; et al. | 2021-03-18 |
Semiconductor-On-Insulator (SOI) Device with Reduced Parasitic Capacitance
App 20210005630 - Hurwitz; Paul D. | 2021-01-07 |
Capacitive tuning circuit using RF switches with PCM capacitors and PCM contact capacitors
Grant 10,833,004 - El-Hinnawy , et al. November 10, 2 | 2020-11-10 |
Power Handling Improvements for Phase-Change Material (PCM) Radio Frequency (RF) Switch Circuits
App 20200335697 - El-Hinnawy; Nabil ; et al. | 2020-10-22 |
Segmented slot contacts for improving performance in phase-change material (PCM) radio frequency (RF) switches
Grant 10,811,605 - Howard , et al. October 20, 2 | 2020-10-20 |
Method of Tuning a Radio Frequency (RF) Module Including a Non-Volatile Tunable RF Filter
App 20200169239A1 - | 2020-05-28 |
High-Yield Tunable Radio Frequency (RF) Filter with Auxiliary Capacitors and Non-Volatile RF Switches
App 20200161548A1 - | 2020-05-21 |
Length-Wise Segmented Slot Contacts for Improving Performance in Phase-Change Material (PCM) Radio Frequency (RF) Switches
App 20200152868A1 - | 2020-05-14 |
Width-Wise Segmented Slot Contacts for Improving Performance in Phase-Change Material (PCM) Radio Frequency (RF) Switches
App 20200144497A1 - | 2020-05-07 |
Uniform Plate Slot Contacts for Improving Performance in Phase-Change Material (PCM) Radio Frequency (RF) Switches
App 20200136041A1 - | 2020-04-30 |
Segmented Slot Contacts for Improving Performance in Phase-Change Material (PCM) Radio Frequency (RF) Switches
App 20200136042A1 - | 2020-04-30 |
Phase-Change Material (PCM) RF Switch with Top Metal Contact to Heating Element
App 20200119266A1 - | 2020-04-16 |
Phase-Change Material (PCM) RF Switch Having Contacts to PCM and Heating Element
App 20200119265A1 - | 2020-04-16 |
Method for Fabricating Contacts in a Phase-Change Material (PCM) RF Switch Having a Heating Element
App 20200111952A1 - | 2020-04-09 |
High Reliability Phase-Change Material (PCM) Radio Frequency (RF) Switch Using Trap-Rich Region
App 20200091429A1 - | 2020-03-19 |
PCM RF Switch with PCM Contacts Having Slot Lower Portions
App 20200091424A1 - | 2020-03-19 |
Phase-Change Material (PCM) Radio Frequency (RF) Switch
App 20200091428A1 - | 2020-03-19 |
Phase-Change Material (PCM) Radio Frequency (RF) Switches with Capacitive Couplings Between Lower Portions and Upper Portions of RF Terminals
App 20200083159A1 - | 2020-03-12 |
Phase-Change Material (PCM) Radio Frequency (RF) Switches with Trench Metal Plugs for RF Terminals
App 20200083161A1 - | 2020-03-12 |
Phase-Change Material (PCM) Radio Frequency (RF) Switches with Capacitively Coupled Upper Portions of RF Terminals
App 20200083160A1 - | 2020-03-12 |
Using a Shared Material for Fabrication of a Phase-Change Material (PCM) Switch and a Resonator
App 20200075672A1 - | 2020-03-05 |
Bonded Two-Die Device Including an Integrated Circuit (IC) Die and a Phase-Change Material (PCM) Switch Die
App 20200066695A1 - | 2020-02-27 |
Circuits for Reducing RF Signal Interference and for Reducing DC Power Loss in Phase-Change Material (PCM) RF Switches
App 20200058850A1 - | 2020-02-20 |
Phase-Change Material (PCM) Radio Frequency (RF) Switch Using a Chemically Protective and Thermally Conductive Layer
App 20200058849A1 - | 2020-02-20 |
Semiconductor Devices Having Phase-Change Material (PCM) Radio Frequency (RF) Switches and Integrated Passive Devices
App 20200058851A1 - | 2020-02-20 |
Method of Manufacturing Phase-Change Material (PCM) Radio Frequency (RF) Switch Using a Chemically Protective and Thermally Conductive Layer
App 20200058853A1 - | 2020-02-20 |
Fabrication of Contacts in an RF Switch Having a Phase-Change Material (PCM) and a Heating Element
App 20200058854A1 - | 2020-02-20 |
Phase-Change Material (PCM) Radio Frequency (RF) Switch with Reduced Parasitic Capacitance
App 20200058848A1 - | 2020-02-20 |
Semiconductor Devices Having Phase-Change Material (PCM) Radio Frequency (RF) Switches and Integrated Active Devices
App 20200058852A1 - | 2020-02-20 |
Device Including PCM RF Switch Integrated with Group III-V Semiconductors
App 20200058638A1 - | 2020-02-20 |
Array Architecture for Large Scale Integration of Phase-Change Material (PCM) Radio Frequency (RF) Switches
App 20200058354A1 - | 2020-02-20 |
Read Out Integrated Circuit (ROIC) for Rapid Testing and Characterization of Conductivity Skew of Phase-Change Material (PCM) in PCM Radio Frequency (RF) Switches
App 20200057013A1 - | 2020-02-20 |
Phase-Change Material (PCM) Radio Frequency (RF) Switches with Capacitively Coupled RF Terminals
App 20200058581A1 - | 2020-02-20 |
Method of Manufacturing PCM RF Switch
App 20200058855A1 - | 2020-02-20 |
Fabrication of Semiconductor Device Using a Shared Material in a Phase-Change Material (PCM) Switch Region and a Resonator Region
App 20200058703A1 - | 2020-02-20 |
Wafer-to-Wafer and Die-to-Wafer Bonding of Phase-Change Material (PCM) Switches with Integrated Circuits and Bonded Two-Die Devices
App 20200058628A1 - | 2020-02-20 |
Stacked Phase-Change Material (PCM) Radio Frequency (RF) Switches with Improved RF Power Handling
App 20200058706A1 - | 2020-02-20 |
Capacitive Tuning Circuit Using RF Switches with PCM Capacitors and PCM Contact Capacitors
App 20200058582A1 - | 2020-02-20 |
Phase-Change Material RF Switch
App 20200058872A1 - | 2020-02-20 |
High Reliability RF Switch Based on Phase-Change Material
App 20200058869A1 - | 2020-02-20 |
Read Out Integrated Circuit (ROIC) for Rapid Testing and Characterization of Resistivity Change of Heating Element in Phase-Change Material (PCM) Radio Frequency (RF) Switch
App 20200058868A1 - | 2020-02-20 |
Radio Frequency (RF) Module Using a Tunable RF Filter with Non-Volatile RF Switches
App 20200059217A1 - | 2020-02-20 |
Radio Frequency (RF) Filtering Using Phase-Change Material (PCM) RF Switches
App 20200059219A1 - | 2020-02-20 |
Read Out Integrated Circuit (ROIC) for Rapid Testing of Functionality of Phase-Change Material (PCM) Radio Frequency (RF) Switches
App 20200059229A1 - | 2020-02-20 |
Phase-Change Material (PCM) Radio Frequency (RF) Switches
App 20200058856A1 - | 2020-02-20 |
Integrated Semiconductor Device Including RF Isolation Regions Under Phase-Change Material (PCM) Radio Frequency (RF) Switches
App 20200058867A1 - | 2020-02-20 |
Non-Volatile Adjustable Phase Shifter Using Non-Volatile Radio Frequency (RF) Switch
App 20200059220A1 - | 2020-02-20 |
Integrated Semiconductor Device Including an Electrically Insulative Substrate Under an Electrically Conductive or Semiconductive Heat Spreader and Phase-Change Material (PCM) Radio Frequency (RF) Switches
App 20200058866A1 - | 2020-02-20 |
Phase-Change Material (PCM) Contact Configurations for Improving Performance in PCM RF Switches
App 20200058860A1 - | 2020-02-20 |
Phase-Change Material (PCM) Contacts with Slot Lower Portions and Contact Dielectric for Reducing Parasitic Capacitance and Improving Manufacturability in PCM RF Switches
App 20200058857A1 - | 2020-02-20 |
Concurrent Fabrication of and Structure for Capacitive Terminals and Ohmic Terminals in a Phase-Change Material (PCM) Radio Frequency (RF) Switch
App 20200058861A1 - | 2020-02-20 |
Phase-Change Material (PCM) Radio Frequency (RF) Switch with Reduced Parasitic Capacitance
App 20200058862A1 - | 2020-02-20 |
Semiconductor Chips and Systems Having Phase-Change Material (PCM) Switches Integrated with Micro-Electrical-Mechanical Systems (MEMS) and/or Resonators
App 20200058865A1 - | 2020-02-20 |
Heat Management for Increased Manufacturability and Performance of Phase-Change Material (PCM) Radio Frequency (RF) Switches
App 20200058864A1 - | 2020-02-20 |
Heating Element Designs For Phase-change Material (pcm) Radio Frequency (rf) Switches
App 20200058863A1 - | 2020-02-20 |
Thermally Conductive and Electrically Isolating Layers in Semiconductor Structures
App 20170372983 - Howard; David J. | 2017-12-28 |
Integration of Thermally Conductive but Electrically Isolating Layers with Semiconductor Devices
App 20170372982 - Howard; David J. | 2017-12-28 |
Reduced Substrate Effects in Monolithically Integrated RF Circuits
App 20170372945 - Howard; David J. ; et al. | 2017-12-28 |
Structure and Method for Mitigating Substrate Parasitics in Bulk High Resistivity Substrate Technology
App 20170338305 - Hurwitz; Paul D. ; et al. | 2017-11-23 |
Structure Having Isolated Deep Substrate Vias With Decreased Pitch And Increased Aspect Ratio And Related Method
App 20170330789 - Kar-Roy; Arjun ; et al. | 2017-11-16 |
Isolated through silicon vias in RF technologies
Grant 9,577,035 - Hurwitz , et al. February 21, 2 | 2017-02-21 |
Integration Of Active Devices With Passive Components And MEMS Devices
App 20160368764 - DeBar; Michael J. ; et al. | 2016-12-22 |
Semiconductor Device Having Reduced Drain-To-Source Capacitance
App 20160343813 - Hurwitz; Paul D. ; et al. | 2016-11-24 |
Integration of Active Devices with Passive Components and MEMS Devices
App 20160289065 - DeBar; Michael J. ; et al. | 2016-10-06 |
Structure Having Isolated Deep Substrate Vias with Decreased Pitch and Increased Aspect Ratio and Related Method
App 20160118339 - Kar-Roy; Arjun ; et al. | 2016-04-28 |
Light Sensor with Chemically Resistant and Robust Reflector Stack
App 20160069739 - Howard; David J. ; et al. | 2016-03-10 |
Structure and Method for Reducing Substrate Parasitics in Semiconductor On Insulator Technology
App 20160071927 - Hurwitz; Paul D. | 2016-03-10 |
Thinned Processed Wafer Having Devices and Vias and Related Method
App 20160049355 - Howard; David J. ; et al. | 2016-02-18 |
Robust MEMS Structure with Via Cap and Related Method
App 20150368094 - Howard; David J. ; et al. | 2015-12-24 |
Scalable Self-Supported MEMS Structure and Related Method
App 20150368092 - Howard; David J. ; et al. | 2015-12-24 |
Deep Trench Isolation Structure and Method for Improved Product Yield
App 20150340267 - Parker; George E. ; et al. | 2015-11-26 |
BiCMOS Integration with Reduced Masking Steps
App 20150303188 - Preisler; Edward ; et al. | 2015-10-22 |
Low-Cost Complementary BiCMOS Integration Scheme
App 20150303185 - Preisler; Edward ; et al. | 2015-10-22 |
BiCMOS Integration Using a Shared SiGe Layer
App 20150303187 - Preisler; Edward ; et al. | 2015-10-22 |
Efficient Fabrication of BiCMOS Devices
App 20150303186 - Preisler; Edward ; et al. | 2015-10-22 |
MEMS Device with Sealed Cavity and Release Chamber and Related Double Release Method
App 20150158721 - DeBar; Michael J. ; et al. | 2015-06-11 |
MEMS Device with Sealed Cavity and Method for Fabricating Same
App 20150158719 - DeBar; Michael J. ; et al. | 2015-06-11 |
Selective Amorphization for Signal Isolation and Linearity
App 20140377935 - Hurwitz; Paul D. ; et al. | 2014-12-25 |
SOI Structure for Signal Isolation and Linearity
App 20140370686 - Hurwitz; Paul D. ; et al. | 2014-12-18 |
Electrical Signal Isolation in Semiconductor Structures
App 20140363949 - Hurwitz; Paul D. ; et al. | 2014-12-11 |
Heterojunction Bipolar Transistor having a Germanium Raised Extrinsic Base
App 20140264457 - Preisler; Edward ; et al. | 2014-09-18 |
Heterojunction Bipolar Transistor having a Germanium Extrinsic Base Utilizing a Sacrificial Emitter Post
App 20140264458 - Preisler; Edward ; et al. | 2014-09-18 |
Integrated Passive Device Having Improved Linearity and Isolation
App 20140252535 - Hurwitz; Paul D. | 2014-09-11 |
Anchor Vias for Improved Backside Metal Adhesion to Semiconductor Substrate
App 20140252651 - Jebory; Hadi ; et al. | 2014-09-11 |
RF Switch Branch Having Improved Linearity
App 20140062575 - Hurwitz; Paul D. | 2014-03-06 |
Isolated Through Silicon Vias in RF Technologies
App 20140054743 - Hurwitz; Paul D. ; et al. | 2014-02-27 |
Isolated Through Silicon Via and Isolated Deep Silicon Via Having Total or Partial Isolation
App 20130313682 - Jebory; Hadi ; et al. | 2013-11-28 |
Semiconductor Fabrication Utilizing Grating and Trim Masks
App 20130256844 - Talor; George ; et al. | 2013-10-03 |
SOI Structure and Method for Utilizing Trenches for Signal Isolation and Linearity
App 20130181321 - Hurwitz; Paul D. ; et al. | 2013-07-18 |
Electrical Signal Isolation and Linearity in SOI Structures
App 20130181322 - Hurwitz; Paul D. ; et al. | 2013-07-18 |
Selective Amorphization for Electrical Signal Isolation and Linearity in SOI Structures
App 20130181290 - Hurwitz; Paul D. ; et al. | 2013-07-18 |
Method for forming deep silicon via for grounding of circuits and devices, emitter ballasting and isolation
App 20130109176 - Blaschke; Volker ; et al. | 2013-05-02 |
Through Silicon Via Structure, Method of Formation, and Integration in Semiconductor Substrate
App 20130087893 - Jebory; Hadi ; et al. | 2013-04-11 |
Method for Encapsulating Microelectronic Devices
App 20120270371 - DeBar; Michael J. ; et al. | 2012-10-25 |
Deep silicon via for grounding of circuits and devices, emitter ballasting and isolation
App 20110018109 - Blaschke; Volker ; et al. | 2011-01-27 |
MOS transistor with a reduced on-resistance and area product
App 20100127326 - Lee; Zachary K. | 2010-05-27 |
Fabricating a Top Conductive Layer in a Semiconductor Die
App 20090298285 - Kar-Roy; Arjun ; et al. | 2009-12-03 |
Densely packed metal segments patterned in a semiconductor die
App 20090243114 - Wang; Tinghao F. ; et al. | 2009-10-01 |
Method for integrating SIGE NPN and Vertical PNP Devices
App 20090203183 - Hurwitz; Paul D. ; et al. | 2009-08-13 |
Semiconductor on insulator (SOI) structure and method for fabrication
App 20090146210 - Zwingman; Robert L. ; et al. | 2009-06-11 |
Semiconductor on insulator (SOI) switching circuit
App 20090149213 - Zwingman; Robert L. ; et al. | 2009-06-11 |
Self-planarized passivation dielectric for liquid crystal on silicon structure and related method
App 20090128768 - Kar-Roy; Arjun | 2009-05-21 |
Integration of an NPN device with phosphorus emitter and controlled emitter-base junction depth in a BiCMOS process
App 20090127585 - U'ren; Greg D. | 2009-05-21 |
Method for integrating high voltage and high speed bipolar transistors on a substrate and related structure
App 20090085066 - Preisler; Edward | 2009-04-02 |
MIM capacitor high-k dielectric for increased capacitance density
App 20090065895 - Abdul-Ridha; Hadi H. ; et al. | 2009-03-12 |
Composite series resistor having reduced temperature sensitivity in an IC chip
Grant 7,078,786 - Racanelli , et al. July 18, 2 | 2006-07-18 |
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