New Wave Research

Patent Applications and Registrations

Patent applications and USPTO patent grants for New Wave Research.The latest application filed is for "scribing sapphire substrates with a solid state uv laser".

Company Profile

0.13.12

New Wave Research - Fremont CA
NEW WAVE RESEARCH - 48660 Kato Road Fremont CA
New Wave Research - 47613 Warm Springs Blvd. Fremont CA
New Wave Research - Sunnyvale CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Scribing sapphire substrates with a solid state UV laser with edge detection Grant 8,822,882 - Liu , et al. September 2, 2	2014-09-02
Scribing Sapphire Substrates With A Solid State Uv Laser App 20070248126 - Liu; Kuo-Ching ; et al.	2007-10-25
Laser System With Multiple Operating Modes And Work Station Using Same App 20060289411 - Chang; Jerry ; et al.	2006-12-28
Method and apparatus for cutting devices from substrates Grant 7,112,518 - Liu September 26, 2	2006-09-26
Method and apparatus for cutting devices from conductive substrates secured during cutting by vacuum pressure Grant 7,052,976 - Liu May 30, 2	2006-05-30
Scribing sapphire substrates with a solid state UV laser with edge detection App 20050279740 - Liu, Kuo-Ching ; et al.	2005-12-22
Method and apparatus for cutting devices from substrates Grant 6,960,813 - Liu November 1, 2	2005-11-01
Scribing sapphire substrates with a solid state UV laser Grant 6,960,739 - Liu , et al. November 1, 2	2005-11-01
Scribing sapphire substrates with a solid state UV laser App 20050215078 - Liu, Kuo-Ching ; et al.	2005-09-29
Dual head laser system with intra-cavity polarization, and particle image velocimetry system using same Grant 6,940,888 - Liu September 6, 2	2005-09-06
Method and apparatus for cutting devices from substrates App 20050153525 - Liu, Kuo-Ching	2005-07-14
Method and apparatus for cutting devices from substrates App 20050095819 - Liu, Kuo-Ching	2005-05-05
Method and apparatus for cutting devices from conductive substrates secured during cutting by vacuum pressure App 20040212027 - Liu, Kuo-Ching	2004-10-28
Method and apparatus for cutting devices from conductive substrates secured during cutting by vacuum pressure Grant 6,806,544 - Liu October 19, 2	2004-10-19
Dual head laser system with intra-cavity polarization, and particle image velocimetry system using same App 20040100999 - Liu, Kuo-Ching	2004-05-27
Method and apparatus for cutting devices from conductive substrates secured during cutting by vacuum pressure App 20040087112 - Liu, Kuo-Ching	2004-05-06
Method and apparatus for cutting devices from substrates App 20040029362 - Liu, Kuo-Ching	2004-02-12
Scribing sapphire substrates with a solid state UV laser App 20030226830 - Liu, Kuo-Ching ; et al.	2003-12-11
Scribing sapphire substrates with a solid state UV laser App 20030226832 - Liu, Kuo-Ching ; et al.	2003-12-11
Scribing sapphire substrates with a solid state UV laser Grant 6,580,054 - Liu , et al. June 17, 2	2003-06-17
Method and apparatus for cleaning electronic test contacts Grant 6,573,702 - Marcuse , et al. June 3, 2	2003-06-03
Multi-wavelength variable attenuator and half wave plate Grant 5,963,364 - Leong , et al. October 5, 1	1999-10-05
Multi-wavelength laser system, probe station and laser cutter system using the same Grant 5,811,751 - Leong , et al. September 22, 1	1998-09-22
Multi-wavelength variable attenuator and half wave plate Grant 5,703,713 - Leong , et al. December 30, 1	1997-12-30
Multi-wavelength laser system, probe station and laser cutter system using the same Grant 5,611,946 - Leong , et al. March 18, 1	1997-03-18

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