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Patent applications and USPTO patent grants for Neumann; Jay R..The latest application filed is for "rigid-flex assembly for high-speed sensor modules".
Patent | Date |
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Rigid-flex assembly for high-speed sensor module comprising a flexible wiring section with dual flexible strips stacked and attached together Grant 10,410,760 - Neumann , et al. Sept | 2019-09-10 |
Rigid-Flex Assembly for High-Speed Sensor Modules App 20170200529 - Neumann; Jay R. ;   et al. | 2017-07-13 |
Direct read pixel alignment Grant 9,704,907 - Neumann , et al. July 11, 2 | 2017-07-11 |
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