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name:-0.00055599212646484
name:-0.0029101371765137
name:-0.00049901008605957
Neumann; Eugene F. Patent Filings

Neumann; Eugene F.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Neumann; Eugene F..The latest application filed is for "method of fabricating metallized chip carries from wafer-shaped substrates".

Company Profile
0.13.0
  • Neumann; Eugene F. - Chippewa Falls WI
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method of fabricating metallized chip carries from wafer-shaped substrates
Grant 5,358,826 - Steitz , et al. October 25, 1
1994-10-25
Integrated circuit chip carrier lid
Grant 5,258,576 - Neumann , et al. November 2, 1
1993-11-02
Metallized connector block
Grant 5,211,567 - Neumann , et al. May 18, 1
1993-05-18
Non-metallized chip carrier
Grant H1,153 - August , et al. March 2, 1
1993-03-02
Method of fabricating metallized chip carriers from wafer-shaped substrates
Grant 5,182,420 - Steitz , et al. January 26, 1
1993-01-26
Shielded connector block
Grant 5,178,549 - Neumann , et al. January 12, 1
1993-01-12
Computer signal interconnect apparatus
Grant 5,144,691 - August , et al. September 1, 1
1992-09-01
Flexible automated bonding method and apparatus
Grant 5,127,570 - Steitz , et al. July 7, 1
1992-07-07
Computer signal interconnect apparatus
Grant 5,123,848 - August , et al. June 23, 1
1992-06-23
Two-piece edge ZIF connector with sliding block
Grant 4,984,993 - Neumann , et al. January 15, 1
1991-01-15
Method of making a chip carrier with terminating resistive elements
Grant 4,949,453 - Neumann , et al. August 21, 1
1990-08-21
Cooling plate with interboard connector apertures for circuit board assemblies
Grant 4,884,168 - August , et al. November 28, 1
1989-11-28
Wire/disk board-to-board interconnect device
Grant 4,859,188 - Neumann August 22, 1
1989-08-22

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