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Patent applications and USPTO patent grants for Nettleton; Nyles I..The latest application filed is for "ramp-stack chip package with variable chip spacing".
Patent | Date |
---|---|
Ramp-stack chip package with variable chip spacing Grant 9,082,632 - Dayringer , et al. July 14, 2 | 2015-07-14 |
Ramp-stack Chip Package With Variable Chip Spacing App 20130299977 - Dayringer; Michael H. S. ;   et al. | 2013-11-14 |
Evaporative cooling system for electronic components App 20090002947 - Nettleton; Nyles I. ;   et al. | 2009-01-01 |
Multi-chip module structure with power delivery using flexible cables Grant 7,425,760 - Guenin , et al. September 16, 2 | 2008-09-16 |
Electronics equipment heat exchanger system Grant 7,372,698 - Tilton , et al. May 13, 2 | 2008-05-13 |
Method and apparatus for simulation processor Grant 7,043,596 - McWilliams , et al. May 9, 2 | 2006-05-09 |
Structures and methods for proximity communication using bridge chips App 20060095639 - Guenin; Bruce M. ;   et al. | 2006-05-04 |
Carbon nanoloop App 20030082092 - Nettleton, Nyles I. | 2003-05-01 |
Method and apparatus for simulation processor App 20030040898 - McWilliams, Thomas M. ;   et al. | 2003-02-27 |
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