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Patent applications and USPTO patent grants for Nesmith; Gene B..The latest application filed is for "plated polymeric article including tin/copper tie/seed layer".
Patent | Date |
---|---|
Plating bronze on polymer sheets Grant 11,293,111 - Yu , et al. April 5, 2 | 2022-04-05 |
Plated Polymeric Article Including Tin/Copper Tie/Seed Layer App 20210310145 - Hebert; Larry S. ;   et al. | 2021-10-07 |
Plated polymeric article including tin/copper tie/seed layer Grant 11,066,753 - Hebert , et al. July 20, 2 | 2021-07-20 |
Plating Bronze On Polymer Sheets App 20180347059 - Yu; Steven Y. ;   et al. | 2018-12-06 |
Plated Polymeric Article Including Tin/copper Tie/seed Layer App 20180187323 - Hebert; Larry S. ;   et al. | 2018-07-05 |
Metallization Of Fluoroelastomer Films App 20160010205 - Nesmith; Gene B. ;   et al. | 2016-01-14 |
Metallization Of Fluoroelastomer Films App 20150010772 - Nesmith; Gene B. ;   et al. | 2015-01-08 |
Corona etching App 20070138405 - Shirck; James R. ;   et al. | 2007-06-21 |
Multi-channel current probe App 20060289299 - LeBlanc; Stephen P. ;   et al. | 2006-12-28 |
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