Nephos (Hefei) Co. Ltd.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Nephos (Hefei) Co. Ltd..The latest application filed is for "wafer-level package having one die with its clock source shared by multiple dies and associated clock generating method".
- Nephos (Hefei) Co. Ltd. - Hefei
| Patent | Date |
|---|---|
| Wafer-level package having one die with its clock source shared by multiple dies and associated clock generating method Grant 10,261,928 - Chen , et al. | 2019-04-16 |
| Supporting flow control mechanism of bus between semiconductor dies assembled in wafer-level package Grant 10,127,169 - Su November 13, 2 | 2018-11-13 |
| Wafer-level Package Having One Die With Its Clock Source Shared By Multiple Dies And Associated Clock Generating Method App 20180300272 - Chen; Yi-Hung ; et al. | 2018-10-18 |
| Wafer-level package having asynchronous FIFO buffer used to deal with data transfer between different dies and associated method Grant 10,037,293 - Chen , et al. July 31, 2 | 2018-07-31 |
| Packet processing apparatus using packet processing units located at parallel packet flow paths and with different programmability Grant 9,674,084 - Lu , et al. June 6, 2 | 2017-06-06 |
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