NEOH; Din-Ghee

Patent Applications and Registrations

Patent applications and USPTO patent grants for NEOH; Din-Ghee.The latest application filed is for "lead frame surface finishing".

Company Profile

6.3.8

NEOH; Din-Ghee - Singapore SG
Neoh; Din-Ghee - Berlin DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Lead Frame Surface Finishing App 20210375787 - CREMA; Paolo ; et al.	2021-12-02
Lead frame surface finishing Grant 11,011,476 - Crema , et al. May 18, 2	2021-05-18
Lead-frame structure, lead-frame, surface mount electronic device and methods of producing same Grant 10,867,895 - Neoh , et al. December 15, 2	2020-12-15
Lead-frame structure, lead-frame, surface mount electronic device and methods of producing same Grant 10,832,997 - Neoh , et al. November 10, 2	2020-11-10
Lead Frame Surface Finishing App 20190279942 - Crema; Paolo ; et al.	2019-09-12
A Method Of Depositing A Tin Layer On A Metal Substrate And A Use Of A Structure Comprising A Nickel/phosphorous Alloy Underlaye App 20190271093 - NEOH; Din-Ghee ; et al.	2019-09-05
Lead-frame Structure, Lead-frame, Surface Mount Electronic Device And Methods Of Producing Same App 20190172777 - NEOH; Din-Ghee ; et al.	2019-06-06
Lead-frame Structure, Lead-frame, Surface Mount Electronic Device And Methods Of Producing Same App 20190080930 - NEOH; Din-Ghee ; et al.	2019-03-14
Solution And Process To Treat Surfaces Of Copper Alloys In Order To Improve The Adhesion Between The Metal Surface And The Bonded Polymeric Material App 20160222523 - Wunderlich; Christian ; et al.	2016-08-04
Solution And Process To Treat Surfaces Of Copper Alloys In Order To Improve The Adhesion Between The Metal Surface And The Bonded Polymeric Material App 20160168722 - Wunderlich; Christian ; et al.	2016-06-16
Solution and Process to Treat Surfaces of Copper Alloys in Order to Improve the Adhesion Between the Metal Surface and the Bonded Polymeric Material App 20100288731 - Wunderlich; Christian ; et al.	2010-11-18

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