Neo; Yong Loo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Neo; Yong Loo.The latest application filed is for "wafer level packaging".

Company Profile

0.24.20

Neo; Yong Loo - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Super high-density module with integrated wafer level packages Grant 8,698,295 - Chia , et al. April 15, 2	2014-04-15
Wafer level packaging Grant 8,564,106 - Chua , et al. October 22, 2	2013-10-22
Super high-density module with integrated wafer level packages Grant 8,304,894 - Chia , et al. November 6, 2	2012-11-06
Wafer Level Packaging App 20120119263 - Chua; Swee Kwang ; et al.	2012-05-17
Super high density module with integrated wafer level packages Grant 7,884,007 - Chia , et al. February 8, 2	2011-02-08
Wafer level packaging Grant 7,820,484 - Chua , et al. October 26, 2	2010-10-26
Microelectronic imagers and methods for manufacturing such microelectronic imagers Grant 7,659,134 - Chia , et al. February 9, 2	2010-02-09
Super high density module with integrated wafer level packages Grant 7,579,681 - Chia , et al. August 25, 2	2009-08-25
Multiple chip semiconductor package Grant 7,553,697 - Eng , et al. June 30, 2	2009-06-30
Method of making multichip wafer level packages and computing systems incorporating same Grant 7,485,562 - Chua , et al. February 3, 2	2009-02-03
Wafer Level Packaging App 20080211113 - Chua; Swee Kwang ; et al.	2008-09-04
Method of forming a conductive via through a wafer Grant 7,375,009 - Chua , et al. May 20, 2	2008-05-20
Super high density module with integrated wafer level packages Grant 7,368,374 - Chia , et al. May 6, 2	2008-05-06
Castellation wafer level packaging of integrated circuit chips Grant 7,304,375 - Boon , et al. December 4, 2	2007-12-04
Super High Density Module with Integrated Wafer Level Packages App 20070264751 - Chia; Yong Poo ; et al.	2007-11-15
Leadless packaging for image sensor devices Grant 7,274,094 - Boon , et al. September 25, 2	2007-09-25
Castellation wafer level packaging of integrated circuit chips Grant 7,271,027 - Boon , et al. September 18, 2	2007-09-18
Super high density module with integrated wafer level packages App 20070152327 - Chia; Yong Poo ; et al.	2007-07-05
Super high density module with integrated wafer level packages App 20070145558 - Chia; Yong Poo ; et al.	2007-06-28
Castellation wafer level packaging of integrated circuit chips Grant 7,193,312 - Boon , et al. March 20, 2	2007-03-20
Multiple chip semiconductor package App 20070059862 - Eng; Meow Koon ; et al.	2007-03-15
Multiple chip semiconductor package Grant 7,173,330 - Eng , et al. February 6, 2	2007-02-06
Leadless packaging for image sensor devices and methods of assembly Grant 7,112,471 - Boon , et al. September 26, 2	2006-09-26
Multichip wafer level packages and computing systems incorporating same Grant 7,087,992 - Chua , et al. August 8, 2	2006-08-08
Multiple chip semiconductor package and method of fabricating same Grant 6,987,031 - Eng , et al. January 17, 2	2006-01-17
Castellation wafer level packaging of integrated circuit chips App 20060001143 - Boon; Suan Jeung ; et al.	2006-01-05
Multi-chip wafer level system packages and methods of forming same Grant 6,964,881 - Chua , et al. November 15, 2	2005-11-15
Multiple chip semiconductor package and method of fabricating same App 20050236709 - Eng, Meow Koon ; et al.	2005-10-27
Multiple chip semiconductor package Grant 6,958,537 - Eng , et al. October 25, 2	2005-10-25
Method of making multichip wafer level packages and computing systems incorporating same App 20050116337 - Chua, Swee Kwang ; et al.	2005-06-02
Multichip wafer level packages and computing systems incorporating same App 20050073029 - Chua, Swee Kwang ; et al.	2005-04-07
Super high density module with integrated wafer level packages App 20050048695 - Chia, Yong Poo ; et al.	2005-03-03
Multiple chip semiconductor package App 20050006748 - Eng, Meow Koon ; et al.	2005-01-13
Multichip wafer level packages and computing systems incorporating same Grant 6,825,553 - Chua , et al. November 30, 2	2004-11-30
Multichip wafer level system packages and methods of forming same App 20040229400 - Chua, Swee Kwang ; et al.	2004-11-18
Leadless packaging for image sensor devices and methods of assembly App 20040084741 - Boon, Suan Jeung ; et al.	2004-05-06
Multichip wafer level packages and computing systems incorporating same App 20040046250 - Chua, Swee Kwang ; et al.	2004-03-11
Leadless packaging for image sensor devices and methods of assembly App 20040041221 - Boon, Suan Jeung ; et al.	2004-03-04
Multiple chip semiconductor package and method of fabricating same App 20040042190 - Eng, Meow Koon ; et al.	2004-03-04
Multi-chip wafer level system packages and methods of forming same App 20040043533 - Chua, Swee Kwang ; et al.	2004-03-04
Wafer level packaging App 20030232488 - Chua, Swee Kwang ; et al.	2003-12-18
Super high density module with integrated wafer level packages App 20030227079 - Chia, Yong Poo ; et al.	2003-12-11

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