Nemoto; Tomoaki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Nemoto; Tomoaki.The latest application filed is for "pneumatic tire".

Company Profile

0.9.12

Nemoto; Tomoaki - Kodaira N/A JP
Nemoto; Tomoaki - Osaka JP
Nemoto; Tomoaki - Tokyo JP
Nemoto; Tomoaki - Kodaira-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Pneumatic tire Grant 9,085,200 - Ochi , et al. July 21, 2	2015-07-21
Pneumatic tire with tread having lug grooves and sub-grooves Grant 8,627,864 - Ochi , et al. January 14, 2	2014-01-14
Material for substrate mounting optical circuit-electrical circuit mixedly and substrate mounting optical circuit-electrical circuit mixedly Grant 8,073,295 - Nakashiba , et al. December 6, 2	2011-12-06
Pneumatic Tire App 20110192514 - Ochi; Naoya ; et al.	2011-08-11
Pneumatic Tire App 20110114237 - Ochi; Naoya ; et al.	2011-05-19
Material For Substrate Mounting Optical Circuit-electrical Circuit Mixedly And Substrate Mounting Optical Circuit-electrical Circuit Mixedly App 20080113168 - Nakashiba; Tooru ; et al.	2008-05-15
Material For Substrate Mounting Optical Circuit-electrical Circuit Mixedly And Substrate Mounting Optical Circuit-electrical Circuit Mixedly App 20080107881 - Nakashiba; Tooru ; et al.	2008-05-08
Material for substrate mounting optical circuit-electric circuit mixedly and substrate mounting optical circuit-electric circuit mixedly Grant 7,330,612 - Nakashiba , et al. February 12, 2	2008-02-12
Material for substrate mounting optical circuit-electrical circuit mixedly and substrate mounting optical circuit-electrical circuit mixedly App 20070189661 - Nakashiba; Tooru ; et al.	2007-08-16
Chip package structure and process for fabricating the same Grant 7,230,331 - Chen , et al. June 12, 2	2007-06-12
Process For Fabricating Chip Package Structure App 20070072339 - Chen; Kai-Chi ; et al.	2007-03-29
Chip Package Structure App 20060261499 - Chen; Kai-Chi ; et al.	2006-11-23
Chip package structure Grant 7,061,103 - Chen , et al. June 13, 2	2006-06-13
Chip package structure Grant 7,057,277 - Chen , et al. June 6, 2	2006-06-06
Material for substrate mounting optical circuit-electric circuit mixedly and substrate mounting optical circuit-electric circuit mixedly App 20050238278 - Nakashiba, Tooru ; et al.	2005-10-27
Chip package structure and process for fabricating the same App 20050087852 - Chen, Kai-Chi ; et al.	2005-04-28
[chip Package Structure And Process For Fabricating The Same] App 20040212080 - Chen, Kai-Chi ; et al.	2004-10-28
[chip Package Structure] App 20040212056 - Chen, Kai-Chi ; et al.	2004-10-28
[chip Package Structure] App 20040212970 - Chen, Kai-Chi ; et al.	2004-10-28

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