Nelson; William John
Patent Applications and Registrations
Patent applications and USPTO patent grants for Nelson; William John.The latest application filed is for "methods for singulating semiconductor wafer".
- Nelson; William John - Singapore SG
- Nelson; William John - Danville CA
- NELSON, WILLIAM JOHN - TAIPEI TW
| Patent | Date |
|---|---|
| Methods for singulating semiconductor wafer Grant 9,741,619 - Nelson , et al. August 22, 2 | 2017-08-22 |
| Methods For Singulating Semiconductor Wafer App 20170117185 - NELSON; William John ; et al. | 2017-04-27 |
| Methods for singulating semiconductor wafer Grant 9,570,314 - Nelson , et al. February 14, 2 | 2017-02-14 |
| Methods For Singulating Semiconductor Wafer App 20160104626 - NELSON; William John ; et al. | 2016-04-14 |
| Trench DMOS device with improved drain contact Grant 7,049,194 - Hshieh , et al. May 23, 2 | 2006-05-23 |
| Trench DMOS device with improved drain contact App 20040108554 - Hshieh, Fwu-Iuan ; et al. | 2004-06-10 |
| Apparatus for attaching resists and wafers to substrates Grant 6,712,110 - Nelson , et al. March 30, 2 | 2004-03-30 |
| Trench DMOS device with improved drain contact Grant 6,657,255 - Hshieh , et al. December 2, 2 | 2003-12-02 |
| Trench DMOS device with improved drain contact App 20030080351 - Hshieh, Fwu-Iuan ; et al. | 2003-05-01 |
| Leaded Semiconductor Device Package For Use In Nonsoldering Assembling App 20010013421 - NELSON, WILLIAM JOHN ; et al. | 2001-08-16 |
| SEC | 0001398232 | NELSON WILLIAM JOHN |
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