| Patent | Date |
|---|
Routing power and ground vias in a substrate
Grant 7,327,583 - Nelson , et al. February 5, 2 | 2008-02-05 |
Routing vias in a substrate from bypass capacitor pads
Grant 7,326,860 - Nelson , et al. February 5, 2 | 2008-02-05 |
System and method for evaluating power and ground vias in a package design
Grant 7,272,806 - Frank , et al. September 18, 2 | 2007-09-18 |
System and method for integrating subcircuit models in an integrated power grid analysis environment
Grant 7,143,022 - Wang , et al. November 28, 2 | 2006-11-28 |
Systems and methods for generating node level bypass capacitor models
Grant 7,143,389 - Wang , et al. November 28, 2 | 2006-11-28 |
System and method for determining signal coupling coefficients for lines
Grant 7,137,088 - Frank , et al. November 14, 2 | 2006-11-14 |
System And Method For Evaluating Signal Coupling Between Differential Traces In A Package Design
App 20060236276 - Frank; Mark D. ; et al. | 2006-10-19 |
Routing vias in a substrate from bypass capacitor pads
App 20060225916 - Nelson; Jerimy ; et al. | 2006-10-12 |
System and method for evaluating signal coupling between differential traces in a package design
Grant 7,117,464 - Frank , et al. October 3, 2 | 2006-10-03 |
Routing differential signal lines in a substrate
Grant 7,078,812 - Frank , et al. July 18, 2 | 2006-07-18 |
Routing vias in a substrate from bypass capacitor pads
Grant 7,075,185 - Nelson , et al. July 11, 2 | 2006-07-11 |
System and method for populating a computer-aided design program's database with design parameters
Grant 7,069,095 - Nelson , et al. June 27, 2 | 2006-06-27 |
System and method for evaluating signal deviations in a package design
Grant 7,055,124 - Frank , et al. May 30, 2 | 2006-05-30 |
Routing power and ground vias in a substrate
App 20060055022 - Nelson; Jerimy ; et al. | 2006-03-16 |
Routing vias in a substrate from bypass capacitor pads
App 20060055049 - Nelson; Jerimy ; et al. | 2006-03-16 |
Routing differential signal lines in a substrate
App 20060043537 - Frank; Mark D. ; et al. | 2006-03-02 |
Systems and methods for generating node level bypass capacitor models
App 20060026542 - Wang; Yong ; et al. | 2006-02-02 |
System and method for determining signal coupling in a circuit design
App 20050251769 - Frank, Mark D. ; et al. | 2005-11-10 |
System and method for determining signal coupling coefficients for vias
App 20050249479 - Frank, Mark D. ; et al. | 2005-11-10 |
System and method for determining signal coupling coefficients for lines
App 20050251770 - Frank, Mark D. ; et al. | 2005-11-10 |
Differential via pair coupling verification tool
App 20050246670 - Bois, Karl J. ; et al. | 2005-11-03 |
Method and apparatus for determining worst case coupling within a differential pair group
App 20050246671 - Bois, Karl J. ; et al. | 2005-11-03 |
Differential trace pair coupling verification tool
App 20050246672 - Bois, Karl J. ; et al. | 2005-11-03 |
System and method for evaluating signal trace discontinuities in a package design
App 20050223348 - Frank, Mark D. ; et al. | 2005-10-06 |
System and method for maintaining homogeneity between a model in a computer-aided modeling system and corresponding model documentation
App 20050197807 - Nelson, Jerimy ; et al. | 2005-09-08 |
System and method for evaluating signal trace discontinuities in a package design
Grant 6,938,230 - Frank , et al. August 30, 2 | 2005-08-30 |
Verifying proximity of ground vias to signal vias in an integrated circuit
Grant 6,922,822 - Frank , et al. July 26, 2 | 2005-07-26 |
System and method for evaluating vias per pad in a package design
Grant 6,907,589 - Frank , et al. June 14, 2 | 2005-06-14 |
System and method for populating a computer-aided design program's database with design parameters
App 20050125747 - Nelson, Jerimy ; et al. | 2005-06-09 |
Inter-signal proximity verification in an integrated circuit
Grant 6,807,657 - Frank , et al. October 19, 2 | 2004-10-19 |
System and method for evaluating signal deviations in a package design
App 20040162714 - Frank, Mark D. ; et al. | 2004-08-19 |
System and method for evaluating power and ground vias in a package design
App 20040162715 - Frank, Mark D. ; et al. | 2004-08-19 |
System and method for evaluating signal coupling between vias in a package design
App 20040163056 - Frank, Mark D. ; et al. | 2004-08-19 |
System and method for evaluating signal coupling between differential traces in a package design
App 20040163058 - Frank, Mark D. ; et al. | 2004-08-19 |
System and method for evaluating vias per pad in a package design
App 20040163054 - Frank, Mark D. ; et al. | 2004-08-19 |
System and method for evaluating signal trace discontinuities in a package design
App 20040163057 - Frank, Mark D. ; et al. | 2004-08-19 |
Verifying proximity of ground metal to signal traces in an integrated circuit
Grant 6,769,102 - Frank , et al. July 27, 2 | 2004-07-27 |
Verifying proximity of ground vias to signal vias in an integrated circuit
App 20040015796 - Frank, Mark D. ; et al. | 2004-01-22 |
Inter-signal proximity verification in an integrated circuit
App 20040015806 - Frank, Mark D. ; et al. | 2004-01-22 |
Verifying proximity of ground metal to signal traces in an integrated circuit
App 20040015795 - Frank, Mark D. ; et al. | 2004-01-22 |
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