Neidig; Arno
Patent Applications and Registrations
Patent applications and USPTO patent grants for Neidig; Arno.The latest application filed is for "power semiconductor component in the planar technique".
- Neidig; Arno - Plankstadt DE
- Neidig; Arno - Schwetzingen DE
| Patent | Date |
|---|---|
| Power semiconductor component in the planar technique Grant 7,030,426 - Neidig April 18, 2 | 2006-04-18 |
| Power semiconductor component in the planar technique App 20050212075 - Neidig, Arno | 2005-09-29 |
| Power semiconductor module having a plastic housing a metal/ceramic multilayer substrate and terminals in a soft encapsulation Grant 5,699,232 - Neidig , et al. December 16, 1 | 1997-12-16 |
| Power semiconductor module and method for producing the module Grant 4,970,576 - Neidig , et al. November 13, 1 | 1990-11-13 |
| Power semiconductor module Grant 4,788,626 - Neidig , et al. November 29, 1 | 1988-11-29 |
| Semiconductor power module with ceramic substrate Grant 4,731,644 - Neidig March 15, 1 | 1988-03-15 |
| Semiconductor power module Grant 4,727,454 - Neidig , et al. February 23, 1 | 1988-02-23 |
| Semiconductor power module with an integrated heat pipe Grant 4,727,455 - Neidig , et al. February 23, 1 | 1988-02-23 |
| Power thyristor on a substrate Grant 4,672,415 - Berndes , et al. June 9, 1 | 1987-06-09 |
| Rectifier module Grant 4,670,771 - Neidig , et al. June 2, 1 | 1987-06-02 |
| Static converter module with mounting lugs Grant 4,636,580 - Neidig , et al. January 13, 1 | 1987-01-13 |
| Process for the direct bonding of metal to ceramics Grant 4,591,401 - Neidig , et al. May 27, 1 | 1986-05-27 |
| Method of direct bonding copper foils to oxide-ceramic substrates Grant 4,505,418 - Neidig , et al. March 19, 1 | 1985-03-19 |
| Method for directly joining metal pieces to oxide-ceramic substrates Grant 4,483,810 - Bunk , et al. November 20, 1 | 1984-11-20 |
| Chemically sensitive field effect transistor having electrode connections Grant 4,232,326 - Neidig , et al. November 4, 1 | 1980-11-04 |
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