loadpatents
name:-0.024924993515015
name:-0.015368938446045
name:-0.0027430057525635
NEFF; James G. Patent Filings

NEFF; James G.

Patent Applications and Registrations

Patent applications and USPTO patent grants for NEFF; James G..The latest application filed is for "photovoltaic devices including flexible bypass diode circuit".

Company Profile
1.13.14
  • NEFF; James G. - Felton CA
  • NEFF; James G. - Sunnyvale CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Photovoltaic Devices Including Flexible Bypass Diode Circuit
App 20220085219 - NEFF; James G. ;   et al.
2022-03-17
Harvestable Indoor Energy Meter
App 20210408317 - NEFF; James G.
2021-12-30
Semiconductor Light Emitting Device Including A Window Layer And A Light-directing Structure
App 20190189838 - Epler; John ;   et al.
2019-06-20
Semiconductor light emitting device including a window layer and a light-directing structure
Grant 10,147,843 - Epler , et al. De
2018-12-04
Method of bonding a semiconductor device using a compliant bonding structure
Grant 9,076,944 - Neff , et al. July 7, 2
2015-07-07
Carrier for a light emitting device
Grant 8,987,771 - Bierhuizen , et al. March 24, 2
2015-03-24
Carrier For A Light Emitting Device
App 20130062651 - BIERHUIZEN; SERGE J. ;   et al.
2013-03-14
Carrier for a light emitting device
Grant 8,319,247 - Bierhuizen , et al. November 27, 2
2012-11-27
Method Of Bonding A Semiconductor Device Using A Compliant Bonding Structure
App 20120225505 - Neff; James G. ;   et al.
2012-09-06
Controlling edge emission in package-free LED die
Grant 8,236,582 - Neff , et al. August 7, 2
2012-08-07
Method of bonding a semiconductor device using a compliant bonding structure
Grant 8,202,741 - Neff , et al. June 19, 2
2012-06-19
Compliant bonding structures for semiconductor devices
Grant 8,053,905 - Epler , et al. November 8, 2
2011-11-08
Carrier For A Light Emitting Device
App 20110233580 - BIERHUIZEN; Serge J. ;   et al.
2011-09-29
Method of forming a dielectric layer on a semiconductor light emitting device
Grant 7,989,824 - Aldaz , et al. August 2, 2
2011-08-02
Compliant Bonding Structures For Semiconductor Devices
App 20110114987 - Epler; John E. ;   et al.
2011-05-19
Complaint bonding structures for semiconductor devices
Grant 7,875,984 - Epler , et al. January 25, 2
2011-01-25
Method Of Forming A Dielectric Layer On A Semiconductor Light Emitting Device
App 20100308367 - ALDAZ; Rafael I. ;   et al.
2010-12-09
Controlling Edge Emission In Package-free Led Die
App 20100279437 - Neff; James G. ;   et al.
2010-11-04
Compliant Bonding Structures For Semiconductor Devices
App 20100224902 - Epler; John E. ;   et al.
2010-09-09
Method Of Bonding A Semiconductor Device Using A Compliant Bonding Structure
App 20100227421 - Neff; James G. ;   et al.
2010-09-09
Method of forming a dielectric layer on a semiconductor light emitting device
Grant 7,732,231 - Aldaz , et al. June 8, 2
2010-06-08
Controlling Edge Emission In Package-free Led Die
App 20100029023 - NEFF; James G. ;   et al.
2010-02-04
Semiconductor Light Emitting Device Including A Window Layer And A Light-directing Structure
App 20100019260 - EPLER; John ;   et al.
2010-01-28

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